• Speech Sciences
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• v.12 no.4
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• pp.237-245
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• 2005

The purpose of this study was to investigate the characteristics for cohesion in the narratives of fluent aphasics. Ten fluent aphasics and ten normal adults matched chronological-age and education level with aphasics participated in this study. Story retelling task was given to the participants individually. And all narratives they produced were recorded and transcribed for analysis. The frequency of cohesive markers and the rate of accuracy were analyzed. The result were as follows; (1) The fluent aphasics used cohesive devices significantly less than the normal adult group, and the rate of accuracy of cohesive devices used was lower than the normal adults. (2) Both groups used lexical cohesion more than pro-forms and ellipsis, and the difference of two groups was larger in lexical cohesion than pro-forms and ellipsis. (3) The fluent aphasics used lexical cohesion more accurately than pro-forms and ellipsis but the normal adults used all three cohesive markers accurately. The difference of two groups was large in pro-forms and ellipsis.

• Korean Journal of Cognitive Science
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• v.13 no.2
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• pp.1-13
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• 2002

This Paper is concerned with the impact of linguistic markers of coherence, such as causal connectives. repetitions. and anchoring devices. on the comprehension of a scientific text in Korean. A scientific text on the process of lightning formation was selected. and two versions of the text were constructed by varying the strength of coherence. Eighty-two undergraduate students took Part in the experiment in which they were instructed to fill in the blanks in each text in a recall and a recognition task and to respond to a set of question in a comprehension test. The results of this experiment revealed a selective effect of the cohesive markers. It was found that the different linguistic signals seem to Play a facilitating role in varying degrees in accordance with the type of tasks involved Moreover an analysis of topic continuity from the beginning paragraphs through the last revealed that the text was better understood in the paragraphs containing the main topic better than those without it. This finding seems to indicate that the off-line processing of scientific text is not influenced solely by the local bottom-up processing alone The effect of topic continuity seems to suggest that a global. top-down processing effect has an important role to play. overriding the impact of cohesive devices.

• Annual Conference on Human and Language Technology
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• 2001.10d
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• pp.226-232
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• 2001

본 연구는 결속장치(cohesive devices)가 과학텍스트의 읽기 속도와 내용 이해에 끼치는 영향에 대해 연구하였다. 연구의 목적을 위한 실험을 통해서 먼저, 텍스트의 문단별 읽기 시간을 측정하여 온라인 처리 과정을 검토하였고, 둘째, 회상과 재인 검사를 실시하여 오프라인 상태에서의 이해도를 조사하였다. 이 연구의 재료로 사용된 텍스트는 번개 생성과정에 대한 과학텍스트로서, 반복, 지시사, 정박(anchoring), 인과적 접속사 등의 결속장치를 이용하여 응집성(coherence)의 강도를 높고, 낮게 조작하였다. 실험 결과, 결속장치가 길속장치의 종류와 지엽적 응집성의 강도에 따라 과학텍스트 읽기와 이해에 선택적으로 영향을 끼친다는 것을 발견하였다. 첫째, 인과적 접속사는 읽기 시간에는 영향을 주지 않는 반면, 이해를 촉진했는데, 이 긍정적 효과는 과제의 종류에 따라 다르게 나타났다. 즉, 회상 검사 결과에서는 인과적 접속사가 쓰인 모든 문단에서 유의한 차이가 나타났으나, 재인 검사에서는 유의한 차이가 부분적으로만 나타났다. 둘째, 반복 결속장치는 다른 결속장치와 같이 발생할 경우에만 읽기 시간과 이해를 부분적으로 촉진하는 것으로 나타났다. 셋째. 정박 결속장치의 영향은 읽기와 이해 두 처리 과정에 모두 선택적으로 영향을 준 것으로 나타났다. 인과적 접속사와 함께 쓰인 문단의 경우에는 회상 검사에서만, 반복 결속장치가 함께 쓰인 문단에서는 회상, 재인 검사에서 모두 긍정적 영향을 준 것으로 관찰되었다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.9-17
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• 2015

After its inception in 1994, the Journal of the Microelectronics and Packaging Society has continued to make significant strides in the number and quality of publications within its field. The interest in the microelectronics and packaging research has become more critical as consumer electronic products continue its increasing trend towards thinner and lighter devices that tests the boundaries of electronic devices. This study utilizes social network analysis of all published literature in the Journal for the past 22 years. Using the keywords and abstracts available within each individual article, the publications within the Journal has focused on major topics covering (1) flip chip, (2) reliability, (3) Cu, (4) IMC (intermetallic compounds), and (5) thin film. Using the social network relationship between keywords within articles, flip chip was closely associated with reliability, BGA (ball grid array), contact resistance, electromigration in many of the published research works within the Journal. From the centrality analysis, it was found that flip chip, reliability, Cu, thin film, IMC, and RF (radio frequency) to have a high degree of centrality suggesting these key areas of research have relatively high connectivity with other research topics within the Journal and is central to many of the research fields within the micro-electronics and packaging area. The cohesiveness analysis showed research clustering of five major cohesive sub-groups and was mapped to better understand the major area of research within this field. Research within the field of micro-electronics and packaging converges many disciplines of science and engineering. The continued evolution within this field requires an understanding of the rapidly changing industry environment and the consumer needs.

• Journal of KIISE
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• v.43 no.8
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• pp.893-901
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• 2016

In Internet of Things (IoT) environments, users are required to search for IoT devices necessary to access services for accomplishing their tasks. As IoT technologies advance, a user task will utilize various types of IoT-based services that are deployed in an IoT environment. Therefore, to accomplish a user task effectively, the services that utilize IoT devices need to be found in a certain geographical region. In addition, the service discovery needs to be accomplished in a stable manner while considering dynamically changing IoT environments. To deal with these issues, we propose two service discovery methods that consider geographic cohesiveness of services in IoT environments. We compare the effectiveness of the proposed methods against a traditional service discovery algorithm that does not consider geographic cohesiveness.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.784-786
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• 2009

Thermal transfer of emitting layer from the donor film to the substrates depends on the physical interaction between the donor film, the emitting layer, and the hole-transport layer (HTL). The interfacial adhesion between the donor film and the EML, the cohesive force of the EML, and the interfacial adhesion between the EML and the HIL have to be optimized to achieve good LITI pattern quality. It was found that surface pretreatment of the donor plate was important on the laser induced thermal transfer of the emitting layer onto the HIL layer of the OLED devices.

• Interaction and multiscale mechanics
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• v.4 no.3
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• pp.207-217
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• 2011

International efforts have focused recently on the development of tungsten surfaces that can intercept energetic ionized and neutral atoms, and heat fluxes in the divertor region of magnetic fusion confinement devices. The combination of transient heating and local swelling due to implanted helium and hydrogen atoms has been experimentally shown to lead to severe surface and sub-surface damage. We present here a computational model to determine the relationship between the thermo-mechanical loading conditions, and the onset of damage and failure of tungsten surfaces. The model is based on thermo-elasticity, coupled with a grain boundary damage mode that includes contact cohesive elements for grain boundary sliding and fracture. This mechanics model is also coupled with a transient heat conduction model for temperature distributions following rapid thermal pulses. Results of the computational model are compared to experiments on tungsten bombarded with energetic helium and deuterium particle fluxes.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Textile Coloration and Finishing
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• v.20 no.1
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• pp.8-15
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• 2008

We presented the modified decal-transfer lithography (DTL) and light stamping lithography (LSL) as new powerful methods to generate patterns of poly(dimethylsiloxane) (PDMS) on the substrate. The microstructures of PDMS fabricated by covalent binding between PDMS and substrate had played as barrier to locally control wettability. The transfer mechanism of PDMS is cohesive mechanical failure (CMF) in DTL method. In the LSL method, the features of patterned PDMS are physically torn and transferred onto a substrate via UV-induced surface reaction that results in bonding between PDMS and substrate. Additionally we have exploited to generate the patterning of rhodamine B and quantum dots (QDs), which was accomplished by hydrophobic interaction between dyes and PDMS micropatterns. The topological analysis of micropatterning of PDMS were performed by atomic force microscopy (AFM), and the patterning of rhodamine B and quantum dots was clearly shown by optical and fluorescence microscope. Furthermore, it could be applied to surface guided flow patterns in microfluidic device because of control of surface wettability. The advantages of these methods are simple process, rapid transfer of PDMS, modulation of surface wettability, and control of various pattern size and shape. It may be applied to the fabrication of chemical sensor, display units, and microfluidic devices.

• Journal of the Korean institute of surface engineering
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• v.26 no.6
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• pp.316-326
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• 1993

Adhesion and hardeness are the most important properties of a hard coated layer which is applied to wear-resistant devices. Zr/ZrN layer was deposited on tool steel(SKH9) and stainless steel(SUS304) by a re-active D.C. magnetron sputtering technique and their microhardness and adhesion strength were measured for the films processed by changing the partial pressures of $N_2$ gas (4~10$\times$$10^{-4}$mbar) and the substrate bias voltage(0~250V). The adhesion strength was evaluated by acoustic signals through the scratch-test with the incremental applied load. As the partial pressure of $N_2$ gas and the substrate bias voltage were increased, the adhesion strength of tool steel was observed to be stronger than that of the stainless steel. The adhesion strength was generally, observed to decrease with the same tendency regardless of the kinds of substrates. The adhesion strength of tool steel was increased more and more strongly than that of stainless steel as heat-treated temperature was increased. The strength of tool steel was appeared to be high adhesion strength at $400^{\circ}C$. From the failure mode of the film during the scratch adhesion test, the cohesive failure was observed to be obvious and the adhesive failure in a minor portion in the Zr/ZrN doublelayer regardless of the kinds of substrates.