• 한국결정성장학회지
• /
• 제31권3호
• /
• pp.116-126
• /
• 2021

코디어라이트(Mg₂Al₄Si₅O₁₈) 하니컴 세라믹스의 대표적 응용분야는 자동차 배기가스 정화용 필터(diesel particulate filter(DPF))이다. 천연광물, 조공제, 유기바인더를 혼합한 슬러리를 압출하여 DPF용 하니컴 코디어라이트를 성형한 후 980~1450℃ 범위에서 소결하였다. 소결온도에 따른 결정상(indialite, cordierite, cristobalite, alumina, spinel, mullite, pro-enstatite)의 형성과정을 XRD Rietveld 정밀화법을 이용하여 정량분석 하였다. 동시에, 세라믹 에칭(etching) 방법으로 소결 시료 표면의 비정질상을 제거한 후 SEM/EDS법을 사용하여 결정상들의 형상과 조성을 확인하였다. 이들 결과로부터 DPF 하니컴에서 결정상 형성 과정을 명확히 밝힐 수 있었다. 또한, DPF 하니컴의 소결온도에 따른 열팽창계수(linear coefficient of thermal expansion, CTE) 변화를 분석하였고, 결정상의 정량분석결과를 바탕으로 계산된 CTE와 비교하였다. 소결된 DPF 하니컴 내의 결정상들이 CTE 특성에 미치는 영향을 고찰하였다.

• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
• /
• pp.922-923
• /
• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
• /
• pp.1245-1247
• /
• 2005

Glass frit was selected to be a $Bi_2O_3-RO-R_2O_3$ system as a sealing material to replace the current PbO system in PDP. Fillers such as a zircon, cordierite and ${\beta}-eucryptite$ were added for the control of thermal expansion coefficient (CTE), flowability and strength for sealing. At $450-500^{\circ}C$, reaction of frit and filler and interface were evaluated by a flow button test and SEM observation. The composite (frit and filler) showed CTE in the range of 70-83 x $10^{-7}/K$ and flowability of 14-20mm. It can be a candidate for the replacement of PbO system.

• 마이크로전자및패키징학회지
• /
• 제6권2호
• /
• pp.13-21
• /
• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• 소성∙가공
• /
• 제33권3호
• /
• pp.200-207
• /
• 2024

In this study, we developed a semi-analytical approach for the numerical analysis of residual stress in oxide scales formed on hot-rolled steels. The oxide scale, formed during the hot rolling process, experiences complex interactions due to thermal and mechanical influences, significantly affecting the material's integrity and performance. Our research focuses on integrating various stress components such as thermal stress, growth stress, and creep behavior to predict the residual stress within the oxide layer. The semi-analytical method combines analytical expressions for each stress component with numerical integration to account for their cumulative effects. Validation through instrumented indentation tests confirms the reliability of our model, which considers thermal expansion coefficient (CTE) differences, scale growth, and creep-induced stress relaxation. Our findings indicate that thermal stress resulting from CTE differences significantly impacts the overall residual stress, with growth stress contributing a compressive component during cooling, and creep behavior playing a minor role in stress relaxation. This comprehensive approach enhances the accuracy of residual stress prediction, facilitating the optimization of material design and processing conditions for hot-rolled steel products.

• 공업화학
• /
• 제22권6호
• /
• pp.623-626
• /
• 2011

다양한 조성의 PMDA/BPDA/p-PDA/ODA로 이루어진 폴리아믹산을 합성하여 다양한 조성의 4성분계 폴리이미드 필름을 열적 이미드화 공정을 통해 제조하였다. 제조된 폴리이미드 필름의 화학 구조 및 열적 기계적 특성은 퓨리에 변환 적외선 분광기(FT-IR), 열중량 분석기(TGA), 열 기계 분석기(TMA), 동 역학적 거동 분석기(DMA), 그리고 만능 인장시험기(UTM) 등을 이용하여 조사하였다. 강직한 구조의 PMDA와 p-PDA의 함량이 증가할수록 인장강도, 탄성률 및 열적 특성이 향상되었고, 상대적으로 유연한 구조의 BPDA와 ODA의 함량이 증가할수록 신장률과 흡습률이 각각 증가하였다. 특히, 열팽창계수(CTE)값은 PMDA : BPDA : p-PDA : ODA의 조성이 5 : 5 : 4 : 6 조성일 때 동박의 CTE와 유사한 결과를 나타내었으며, 이와 같은 조성을 갖는 4성분계 폴리이미드 필름의 경우 유연성 회로 기판의 flexible copper clad laminates (FCCL)을 위한 기본 필름으로 적용할 수 있을 것으로 판단된다.

• 폴리머
• /
• 제36권6호
• /
• pp.733-738
• /
• 2012

광전소자용 유연기판으로 사용되는 폴리에틸렌나프탈레이트 필름의 치수안정성 향상을 위하여 첨가된 유리 비드와 유리 섬유가 필름의 열팽창계수와 광투과도에 미치는 영향을 살펴보았다. 첨가된 무기 필러의 함량이 증가할수록 열팽창계수와 광투과도가 감소함을 알 수 있었다. 무기 필러의 크기, 입도 분포 또한 유연기판의 치수안정성과 광투과도에 영향을 미치는 주요한 요인임을 확인할 수 있었다. 본 연구 결과, 유연기판으로 사용 가능한 85% 이상의 광투과도를 유지하면서 폴리에틸렌나프탈레이트의 고유 치수안전성을 50% 이상 감소시키는 무기 필러의 함량은 5 wt% 내외임을 알 수 있었다.

• 대한기계학회논문집A
• /
• 제33권4호
• /
• pp.380-387
• /
• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• 한국전기전자재료학회논문지
• /
• 제17권4호
• /
• pp.443-447
• /
• 2004

In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• 한국전기전자재료학회논문지
• /
• 제28권9호
• /
• pp.571-576
• /
• 2015

In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.