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http://dx.doi.org/10.14478/ace.2011.22.6.623

Synthesis and Characterization of 4-Component Polyimide Films with Various Diamine and Dianhydride Compositions  

Park, Yun Jun (Energy Materials Research Center, Korea Research Institute of Chemical Technology)
Yu, Duk Man (Energy Materials Research Center, Korea Research Institute of Chemical Technology)
Choi, Jong Ho (Department of New and Renewable Energy, Kyungil University)
Ahn, Jeong-Ho (Department of Polymer Science and Engineering, Sunkyunkwan University)
Hong, Young Taik (Energy Materials Research Center, Korea Research Institute of Chemical Technology)
Publication Information
Applied Chemistry for Engineering / v.22, no.6, 2011 , pp. 623-626 More about this Journal
Abstract
Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.
Keywords
polyimide; 4-component; monomer composition change; coefficient of thermal expansion; thermal and mechanical properties;
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Times Cited By KSCI : 2  (Citation Analysis)
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