Development of Epoxy/Boron Nitride Composites for High Heat Dissipation of Metal Copper Clad Laminate (MCCL) (Metal Copper Clad Laminate (MCCL)의 고방열 특성을 위한 Epoxy/BN 복합체 개발)
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- Korean Chemical Engineering Research
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- v.58 no.1
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- pp.64-68
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- 2020