• 한국도로학회논문집
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• 제15권2호
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• pp.65-71
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• 2013

PURPOSES : The objective of this study is to evaluate the effect of physical characteristics of emulsion asphalt and aggregate on performance of chip seal pavements. METHODS : In order to evaluate the performance of chip seal materials, the sweep tests and Vialit Plate Shock tests were conducted on the mixtures with five emulsion asphalt binders and three aggregate types. The sweep tests was intended to investigate the change of bonding properties between emulsion asphalt and aggregate with curing time. The Vialit Plate Shock test was used to evaluate the bonding properties of chip seal materials at low temperatures. RESULTS : Results from sweep tests showed that polymer modified emulsion asphalt can reduce the curing time by 1.5 hour comparing with typical emulsion asphalt. It is also found that the Flakiness Index of aggregates and absorption rate of binder are the major factors affecting the bonding properties of chip seal materials. The Vialit Plate Shock test results showed that the average aggregate loss of CRS-2 is ten times higher than CRS-2P No.2 indicating that the use of polymer additives in emulsion asphalt can improve the performance of chip seal materials in low temperature region. CONCLUSIONS : The use of polymer in emulsion asphalt can decrease the curing time of chip seal materials and increase the bonding properties between aggregates and asphalt binder. It is also concluded that the lower Flakiness Index and absorption rate of aggregates can improve the performance of chip seal pavement.

• 한국도로학회논문집
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• 제16권5호
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• pp.1-8
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• 2014

PURPOSES : The objective of this study is to evaluate the bond strength of asphalt emulsions including polymer-modified emulsions for chip seals and fog seals using the bitumen bond strength (BBS) test. METHODS : For the laboratory testing, the Pneumatic Adhesion tensile Testing Instrument(PATTI) device is used to measure the bond strength between the asphalt emulsion and aggregate substrate based on the AASHTO TP-91. In order to conduct all the tests in controled condition, all test procedures are performed in the environmental chamber. The CRS-2L and the SBS CRS-2P emulsions are used as a polymer-modified emulsion, and then unmodified emulsion, the CRS-2, is compared for the evaluation of chip seal performance. For the fog seal performance evaluation, two types of polymer-modified emulsions and one of unmodified emulsion, the CSS-1H, are employed. For chip seal study, the BBS tests are performed at 30, 60, 120, and 240 minutes of curing times with curing and testing temperatures of $15^{\circ}C$, $25^{\circ}C$, and $35^{\circ}C$. The fog seal tests are conducted at 30, 60, 90, 120, 180 minutes, and 24 hours with curing and testing temperatures of $25^{\circ}C$, $30^{\circ}C$, and $35^{\circ}C$. RESULTS AND CONCLUSIONS : Overall, chip seal emulsions and fog seal emulsions show the similar bond strength trend. At the same testing condition, polymer-modified emulsions show better bond strength than unmodified emulsions. Also, there is no significant difference between polymer-modified emulsions. One of important findings is that the most bond strength reaches their final bond strength within one hour of curing time. Therefore, the early curing time plays a vital role in the performance of chip seals and fog seals.

• 한국도로학회논문집
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• 제12권3호
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• pp.79-85
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• 2010

본 논문은 골재부착력(aggregate retention) 평가를 통해서 칩실(chip seal)에서 사용되는 롤러 종류의 기초적인 연구 결과를 설명하고 있다. 입도 78M의 화강암 골재와 CRS-2 이멀젼(emulsion)을 사용하여 single layer 칩실 테스트 구간을 시공하였으며, 3개의 다른 롤러 종류를 사용하였다. 사용된 롤러 종류는 pneumatic tire roller, steel wheel roller, and combination roller를 사용하였다. 세 종류의 롤러의 성능을 효과적으로 연구하기 위해서는 시공현장으로부터 직접 테스트용 시편을 얻는 것이 매우 중요하기 때문에, 노스캐롤라이나 주, Bailey에 있는 New Sandy Hill Church Road에서 테스트 구간 설정하고 일반적인 노스캐롤라이나 주의 칩실시공 절차에 준하여 시공을 실시하였다. 테스트 구간에서 제작된 시편들을 실험실로 옮겨서 골재부착력(aggregate retention) 성능평가를 실시하였다. 골재의 부착력을 평가하기 위해서 flip-over test(FOT), Vialit test, and the third-scale Model Mobile Loading Simulator (MMLS3) 시험방법들을 채택하였다. 세 가지의 시험결과들과 시험시공 현장에서 관측된 육안조사를 통해서 다음과 같은 롤러 종류와 순서를 추천하게 되었다. pneumatic tire roller 와 combination roller를 함께 사용하며 처음에 pneumatic tire roller가 다짐을 한 뒤에 그 뒤를 combination roller가 다짐하는 순서로 다짐작업을 함으로써 칩실의 성능이 향상 되리라 사료된다.

• 대한기계학회논문집A
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• 제28권4호
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• 한국도로학회논문집
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• 제16권6호
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• pp.39-50
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• 2014

PURPOSES : The objective of this study is to evaluate the curing and adhesive behavior of asphalt emulsions including polymer-modified emulsions for chip seals and fog seals. METHODS : For the laboratory testing, the evaporation test, the bitumen bond strength (BBS) test, and the Vialit test are used. Also, the rolling ball test and the damping test are employed to evaluate the curing properties of the fog seal emulsions. In order to conduct all the tests in controled condition, all test procedures are performed in the environmental chamber. The CRS-2L and the SBS CRS-2P emulsions are used as a polymer-modified emulsion, and then unmodified emulsion, the CRS-2, is compared for the evaluation of chip seal performance. For the fog seal performance evaluation, two types of polymer-modified emulsions (FPME-1 and FPME-2) and one of unmodified emulsion, the CSS-1H, are employed. All the tests are performed at different curing times and temperatures. RESULTS AND CONCLUSIONS : Overall, PMEs show better curing and adhesive behavior than non-PMEs regardless of treatments types. Especially, the curing and adhesive behavior of PMEs is much better than non-PMEs before 120 minutes of curing time. Since all the test results indicate that after 120 minutes of curing time the curing adhesive behavior of emulsions, the early curing time, i.e., 120 minutes, plays an important role in the performance of chip seals and fog seals.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• 한국도로학회논문집
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• 제17권2호
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• pp.89-98
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• 2015

PURPOSES : The objective of this study is to evaluate the performance properties of chip seals and fog seals with polymer-modified emulsions. METHODS : The performance of chip seals and fog seals was evaluated on the basis of common issues in surface treatments. Granite aggregate and four types of asphalt emulsions (one of the unmodified and three of the modified emulsions) were used considering the usage in field. A Vialit test was performed to determine the aggregate retention, and the MMLS3 (Third Scale Model Mobile Load Simulator) test was conducted to determine the aggregate retention, bleeding, and rutting. In addition, the fog seal specimens were tested by the BPT (British Pendulum Test) to evaluate skid resistance. RESULTS AND CONCLUSIONS : Overall, the polymer-modified emulsions (PMEs) showed better aggregate retention and bleeding resistance for both chip seals and fog seals. When comparing the performance of the PMEs, the difference was not considerable. In addition, PMEs present significantly better rutting resistance than unmodified emulsions. For skid resistance, if the recommended mix design is applied, the specimens do not cause issues with skid resistance. Although all of the fog seal specimens were over the criteria for skid resistance, the specimen fabricated by the high emulsion application rate (EAR) of the unmodified emulsion was nearly equivalent to the skid value criteria. Therefore, the use of an unmodified emulsion with a high EAR should be carefully applied in the field.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1510-1512
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• 2000

Due to the shrinking of the chip size and increasing of the complexity in the modern electronic devices. the defect of wafer are so important to decide the yield in the device process. The engineers has studied the wafer defects and the characteristics. They published lots of the experimental methods. I did an experiment the gettering effect of the defects due to the high temperature and the long time diffusion. Actually, As the thickness of the wafer backside polysilicon is thicker and the diffusion time is faster. the defects on the wafer are decreased. The polysilicon gram boundaries of the wafer backside played an important part as the defect gettering site.

• 전기전자학회논문지
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• 제12권2호
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• pp.95-101
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• 2008

본 논문에서는 2.45 GHz RFID eSeal(electrical seal)의 표준 ISO/IEC 18185-5와 24730-2의 물리적 계층을 지원하는 기저대역 모뎀의 동기 탐색 구조 설계에 대해 연구하였다. DSSS 모뎀 설계 시, 수신기에서 가장 중요한 기능인 코드 획득 및 추적 구조를 설계하였고 고려되어야 할 각 파라미터들에 대해서 살펴보았다. 제안된 모뎀의 데이터 전송률은 59.7 Kbps이며, PN 칩 전송률은 30.521875 Mcps로써 프로세싱 이득(Processing Gain)이 27 dB이다. 그러므로 상기 표준의 변조 특성은 현재 비슷한 모뎀 구조로 사용되고 있는 IEEE 802.11b 규격(프로세싱 이득이 10dB)에 비해 잡음에 대한 내성이 17dB 우수하다. 그러므로 상기 표준에 적합 한 모뎀의 동기 탐색 구조를 제시 하였다.