• International Journal of Highway Engineering
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• v.15 no.2
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• pp.65-71
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• 2013

PURPOSES : The objective of this study is to evaluate the effect of physical characteristics of emulsion asphalt and aggregate on performance of chip seal pavements. METHODS : In order to evaluate the performance of chip seal materials, the sweep tests and Vialit Plate Shock tests were conducted on the mixtures with five emulsion asphalt binders and three aggregate types. The sweep tests was intended to investigate the change of bonding properties between emulsion asphalt and aggregate with curing time. The Vialit Plate Shock test was used to evaluate the bonding properties of chip seal materials at low temperatures. RESULTS : Results from sweep tests showed that polymer modified emulsion asphalt can reduce the curing time by 1.5 hour comparing with typical emulsion asphalt. It is also found that the Flakiness Index of aggregates and absorption rate of binder are the major factors affecting the bonding properties of chip seal materials. The Vialit Plate Shock test results showed that the average aggregate loss of CRS-2 is ten times higher than CRS-2P No.2 indicating that the use of polymer additives in emulsion asphalt can improve the performance of chip seal materials in low temperature region. CONCLUSIONS : The use of polymer in emulsion asphalt can decrease the curing time of chip seal materials and increase the bonding properties between aggregates and asphalt binder. It is also concluded that the lower Flakiness Index and absorption rate of aggregates can improve the performance of chip seal pavement.

• International Journal of Highway Engineering
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• v.16 no.5
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• pp.1-8
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• 2014

PURPOSES : The objective of this study is to evaluate the bond strength of asphalt emulsions including polymer-modified emulsions for chip seals and fog seals using the bitumen bond strength (BBS) test. METHODS : For the laboratory testing, the Pneumatic Adhesion tensile Testing Instrument(PATTI) device is used to measure the bond strength between the asphalt emulsion and aggregate substrate based on the AASHTO TP-91. In order to conduct all the tests in controled condition, all test procedures are performed in the environmental chamber. The CRS-2L and the SBS CRS-2P emulsions are used as a polymer-modified emulsion, and then unmodified emulsion, the CRS-2, is compared for the evaluation of chip seal performance. For the fog seal performance evaluation, two types of polymer-modified emulsions and one of unmodified emulsion, the CSS-1H, are employed. For chip seal study, the BBS tests are performed at 30, 60, 120, and 240 minutes of curing times with curing and testing temperatures of $15^{\circ}C$, $25^{\circ}C$, and $35^{\circ}C$. The fog seal tests are conducted at 30, 60, 90, 120, 180 minutes, and 24 hours with curing and testing temperatures of $25^{\circ}C$, $30^{\circ}C$, and $35^{\circ}C$. RESULTS AND CONCLUSIONS : Overall, chip seal emulsions and fog seal emulsions show the similar bond strength trend. At the same testing condition, polymer-modified emulsions show better bond strength than unmodified emulsions. Also, there is no significant difference between polymer-modified emulsions. One of important findings is that the most bond strength reaches their final bond strength within one hour of curing time. Therefore, the early curing time plays a vital role in the performance of chip seals and fog seals.

• International Journal of Highway Engineering
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• v.12 no.3
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• pp.79-85
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• 2010

This paper presents a preliminary study of roller types for chip seals based on aggregate retention performance. Chip seal test sections composed of single seals of granite 78M aggregate and CRS-2 emulsion were constructed using three different roller types: the pneumatic tire roller, steel wheel roller, and combination roller. In order to investigate the performance of these rollers effectively, it is critical to test chip seal samples obtained directly from field construction. Therefore, test sections were constructed on New Sandy Hill Church Road near Bailey, North Carolina. Chip seal samples obtained from these sections were used for laboratory testing. The aggregate retention performance was evaluated using the flip-over test (FOT), Vialit test, and the third-scale Model Mobile Loading Simulator (MMLS3). Based on the test results and visual observation, both the pneumatic roller and the combination roller used together are recommended to improve chip seal performance with the sequence of the pneumatic roller rolling first followed by the combination roller.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• International Journal of Highway Engineering
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• v.16 no.6
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• pp.39-50
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• 2014

PURPOSES : The objective of this study is to evaluate the curing and adhesive behavior of asphalt emulsions including polymer-modified emulsions for chip seals and fog seals. METHODS : For the laboratory testing, the evaporation test, the bitumen bond strength (BBS) test, and the Vialit test are used. Also, the rolling ball test and the damping test are employed to evaluate the curing properties of the fog seal emulsions. In order to conduct all the tests in controled condition, all test procedures are performed in the environmental chamber. The CRS-2L and the SBS CRS-2P emulsions are used as a polymer-modified emulsion, and then unmodified emulsion, the CRS-2, is compared for the evaluation of chip seal performance. For the fog seal performance evaluation, two types of polymer-modified emulsions (FPME-1 and FPME-2) and one of unmodified emulsion, the CSS-1H, are employed. All the tests are performed at different curing times and temperatures. RESULTS AND CONCLUSIONS : Overall, PMEs show better curing and adhesive behavior than non-PMEs regardless of treatments types. Especially, the curing and adhesive behavior of PMEs is much better than non-PMEs before 120 minutes of curing time. Since all the test results indicate that after 120 minutes of curing time the curing adhesive behavior of emulsions, the early curing time, i.e., 120 minutes, plays an important role in the performance of chip seals and fog seals.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• International Journal of Highway Engineering
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• v.17 no.2
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• pp.89-98
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• 2015

PURPOSES : The objective of this study is to evaluate the performance properties of chip seals and fog seals with polymer-modified emulsions. METHODS : The performance of chip seals and fog seals was evaluated on the basis of common issues in surface treatments. Granite aggregate and four types of asphalt emulsions (one of the unmodified and three of the modified emulsions) were used considering the usage in field. A Vialit test was performed to determine the aggregate retention, and the MMLS3 (Third Scale Model Mobile Load Simulator) test was conducted to determine the aggregate retention, bleeding, and rutting. In addition, the fog seal specimens were tested by the BPT (British Pendulum Test) to evaluate skid resistance. RESULTS AND CONCLUSIONS : Overall, the polymer-modified emulsions (PMEs) showed better aggregate retention and bleeding resistance for both chip seals and fog seals. When comparing the performance of the PMEs, the difference was not considerable. In addition, PMEs present significantly better rutting resistance than unmodified emulsions. For skid resistance, if the recommended mix design is applied, the specimens do not cause issues with skid resistance. Although all of the fog seal specimens were over the criteria for skid resistance, the specimen fabricated by the high emulsion application rate (EAR) of the unmodified emulsion was nearly equivalent to the skid value criteria. Therefore, the use of an unmodified emulsion with a high EAR should be carefully applied in the field.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1510-1512
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• 2000

Due to the shrinking of the chip size and increasing of the complexity in the modern electronic devices. the defect of wafer are so important to decide the yield in the device process. The engineers has studied the wafer defects and the characteristics. They published lots of the experimental methods. I did an experiment the gettering effect of the defects due to the high temperature and the long time diffusion. Actually, As the thickness of the wafer backside polysilicon is thicker and the diffusion time is faster. the defects on the wafer are decreased. The polysilicon gram boundaries of the wafer backside played an important part as the defect gettering site.

• Journal of IKEEE
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• v.12 no.2
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• pp.95-101
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• 2008

In this paper, we study an optimum design of search synchronization structure for Baseband Modem to support ISO/IEC 18185-5 and 24730-2 Standard. For DSSS Modem, we design the code acquisition and tracking structure which are important in receiver operation, and examine the parameters to be considered. The data and PN chip transmission rates and processing gain of the proposed modem are 59.7 kbps, 30.521875 Mcps, and 27 dB, respectively. This indicates that the noise immunity of the proposed modem is 17dB better than IEEE 802.11b (Processing gain : 10dB). Therefore, we design the optimum structure for the modem search synchronization which is compatible to the proposed modem standard.