• 제목/요약/키워드: ceramic insulation layer

검색결과 26건 처리시간 0.023초

고용량 적층 세라믹 커패시터에서 설계 및 제조공정에 따른 전기적 특성 평가 (Design and Fabrication Process Effects on Electrical Properties in High Capacitance Multilayer Ceramic Capacitor)

  • 윤중락;우병철;이헌용;이석원
    • 한국전기전자재료학회논문지
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    • 제20권2호
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    • pp.118-123
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    • 2007
  • The purpose of this work was to investigate the design and fabrication process effects on electrical properties in high capacitance multilayer ceramic capacitor (MLCC) with nickel electrode. Dielectric breakdown voltage and insulation resistance value were decreased with increasing stack layer number, but dielectric constant and capacitance were increased. With increasing green sheet thickness, dielectric breakdown voltage, C-V and I-V properties were also increased. The major reasons of the effects were thought to be the defects generated extrinsically during fabrication process and interfacial reactions formed between nickel electrode and dielectric layer. These investigations clearly showed the influence of both green sheet thick ness and stack layer number on the electrical properties in fabricating the MLCC.

알루미늄 판상에 글라스 세라믹 후막이 코팅된 절연금속기판의 제조 및 절연특성 (Fabrication and Electrical Insulation Property of Thick Film Glass Ceramic Layers on Aluminum Plate for Insulated Metal Substrate)

  • 이성환;김효태
    • 마이크로전자및패키징학회지
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    • 제24권4호
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    • pp.39-46
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    • 2017
  • 본 연구는 평판형 히터용 금속방열판상의 세라믹 절연층 제조, 즉 절연성 금속기판에 관한 것이다. 반도체나 디스플레이의 열처리 공정 등에 사용되는 평판형 히터를 제조함에 있어서, 온도 균일도를 높이기 위해 금속 방열판으로서 열전도율이 높고, 비교적 가벼우며, 가공성 좋은 알루미늄 합금 기판이 선호된다. 이 알루미늄 기판에 발열 회로 패턴을 형성하기 위해서는 금속 기판에 절연층으로서 고온 안정성이 우수한 세라믹 유전체막을 코팅하여야 한다. 금속 기판상에 세라믹 절연층을 형성함에 있어서 가장 빈번히 발생하는 첫 번째 문제는 금속과 세라믹의 이종재료 간의 큰 열팽창계수 차이와 약한 결합력에 의한 층간박리 및 균열발생이다. 두 번째 문제는 절연층의 소재 및 구조적 결함에 따른 절연파괴이다. 본 연구에서는 이러한 문제점 해소를 위해 금속소재 기판과 세라믹 절연층 사이에 완충층을 도입하여 이들 간의 기계적 매칭과 접합력 개선을 도모하였고, 다중코팅 방법을 적용하여 절연막의 품질과 내전압 특성을 개선하고자 하였다.

세라믹-금속 기반 LED 어레이 패키지의 저온동시소성시 휨발생 억제 연구 (Low Temperature Co-firing of Camber-free Ceramic-metal Based LED Array Package)

  • 허유진;김효태
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.35-41
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    • 2016
  • 고출력 LED 조명용 패키지를 제조함에 있어서 발열은 LED의 광출력과 수명에 매우 중요한 영향을 주는 인자로 알려져 있다. 본 연구에서는 가로등용 고출력 LED 패키지를 개발함에 있어서 효과적인 방열을 하기 위하여 방열효과가 상대적으로 우수한 구조인 chip-on-a-heat sink 구조를 가지는 세라믹-메탈 기반의 패키지를 제조하였다. 열확산 기능을 하는 heat sink 기판소재는 알루미늄 합금을, LED 어레이 회로를 형성하는 절연막으로는 저온동시소성용 glass-ceramics을 사용하였다. 특히 열처리 시 가장 이슈가 되는 세라믹-금속 하이브리드 패키지 기판의 휨을 억제하기 위한 수단으로서, glass-ceramic 절연막을 부분 코팅함으로써 휨현상을 용이하게 줄일 수 있게 되었다. 또한, LED 패키지의 방열특성의 향상 즉 열저항도 기존의 MCPCB 패키지나 전면 코팅형 절연막 패키지에 비해 훨씬 낮아지는 효과를 얻었을 뿐 아니라, 세라믹 코팅소재의 절감효과도 볼 수 있게 되었다.

NiZn Ferrite Coating for Electrical Insulation of MnZn Ferrite Cores

  • Kitamoto, Y.;Yajima, H.;Nakayama, Y.;Abe, M.
    • 한국세라믹학회지
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    • 제38권6호
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    • pp.506-508
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    • 2001
  • The ferrite plating with applying power ultrasound waves of 19.5 kHz and 600W enabled us to encapsulate entirely MnZn ferrite cores for transformers with Ni$\sub$x/Zn$\sub$y/Fe$\sub$3-x-y/O$_4$coating. Supplying a NH$_4$OH solution during the plating broke the limit of the solubility of Ni ions to ferrite-plated films. The electrical resistivity of the NiZn ferrite coating increased with increasing the Ni and Zn content, reaching 2.3${\times}$10$\^$5/Ωcm at the composition of Ni$\sub$0.24/Zn$\sub$0.30/Fe$\sub$2.46/O$_4$. The saturation magnetization was 540 emu/㎤. As a result, the MnZn ferrite cores were successfully encapsulated with the NiZn ferrite coatings for an insulation layer.

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Effect of ceramic powder addition on the insulating properties of polymer layer prepared by dip coating method

  • Kim, S.Y.;Lee, J.B.;Kwon, B.G.;Hong, G.W.
    • 한국초전도ㆍ저온공학회논문지
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    • 제16권1호
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    • pp.14-18
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    • 2014
  • The mechanical, electrical and thermal characteristics of insulating materials may significantly affect the performance and reliability of electrical devices using superconductors. General method to provide insulating layer between coated conductors is wrapping coated conductor with Kapton tape. But uniform and compact wrapping without failure or delamination in whole coverage for long length conductor is not a simple task and need careful control. Coating of insulating layer directly on coated conductor is desirable for providing compact insulating layer rather than wrapping insulating layers around conductor. Ceramic added polymer has been widely used as an insulating material for electric machine because of its good electrical insulating properties as well as excellent heat resistance and fairy good mechanical properties. The insulating layer of coated conductor should have high breakdown voltage and possesses suitable mechanical strength and maintain adhesiveness at the cryogenic temperature where it is used and withstand stress from thermal cycling. The insulating and mechanical properties of polymer can be improved by adding functional filler. In this study, insulating layer has been made by adding ceramic particles such as $SiO_2$ to a polymer resin. The size, amount and morphology of added ceramic powder was controlled and their effect on dielectric property of the final composite was measured and discussed for optimum composite fabrication.

Metal PCB에 있어서 양극산화법으로 제작한 Al2O3절연막의 방열특성 (Heat dissipation of Al2O3 Insulation layer Prepared by Anodizing Process for Metal PCB)

  • 조재승;김정호;고상원;임실묵
    • 한국표면공학회지
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    • 제48권2호
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    • pp.33-37
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    • 2015
  • High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

$BaTiO_3$계 SBLC의 표면 재산화 형성 기구 및 전기적 성질 (Surface Reoxidation Mechanism and Electrical Properites of SBLC in $BaTiO_3$ System)

  • 이형규;김호기
    • 한국세라믹학회지
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    • 제23권5호
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    • pp.55-60
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    • 1986
  • A mechanism for formation of surface reoxidation layer in Surface Boundary Layer Capacitor (SBLC) has been studied. SBLC were prepared by reduction of $BaTiO_3$ doped with $Bi_2O_3$ and electrode firing of silver paste containing $Bi_2O_3$ The apparent dielectric constant was in the order of $10^5$ and the insulation resistance larger than $10^6$$\Omega$ It can be expected that $Bi_2O_3$ dopant in $BaTiO_3$ plays the role of inhibition of grain growth and decreasing the resistivity of $BaTiO_3$. In order to confirm the process of surface reoxidation layer effects of atmosphere and annealing time in electrode sintering were investigated.

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Al-합금의 단열섬유판 반응침투에 의한 $Al_2O_3$-세라믹스의 형성 (Formation of $Al_2O_3$-Ceramics by Reactive Infiltration of Al-alloy into Insulation Fiber Board)

  • 김일수
    • 한국세라믹학회지
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    • 제34권5호
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    • pp.483-490
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    • 1997
  • Al2O3/metal composites were fabricated by oxidation and reaction of molten Al-alloy into two types of commercial Al2O3-SiO2 fibrous insulation board. The growth rate, composition and microstructure of these materials were described. An AlZnMg(7075) alloy was selected as a parent alloy. Mixed polycrystalline fiber and glass phase fiber were used as a filler. The growth surface of an alloy was covered with and without SiO2. SiO2 powder was employed as a surface dopant to aid initial oxidation of Al-alloy. Al-alloy, SiO2, fiber block and growth inhibitor CaSiO3 were packed sequentially in a alumina crucible and oxidized in air at temperature range 90$0^{\circ}C$ to 120$0^{\circ}C$. The growth rate of composite layer was calculated by measuring the mass increasement(g) per unit surface($\textrm{cm}^2$). XRD and optical microscope were used to investigate the composition and phase of composites. The composite grown at 120$0^{\circ}C$ and with SiO2 dopant showed rapid growth rate. The growth behavior differed a little depending on the types of fiber used. The composites consist of $\alpha$-Al2O3, Al, Si and pore. The composite grown at 100$0^{\circ}C$ exhibited better microstructure compared to that grown at 120$0^{\circ}C$.

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BaTiO$_3$ 후막의 마이크로파 소성 및 전기적 특성 (Microwave Sintering Behavior and Electrical Properties of BaTiO$_3$ Thick Films)

  • 배강;김호기
    • 한국세라믹학회지
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    • 제35권11호
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    • pp.1197-1202
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    • 1998
  • To check the possibility for microwave sintering of MLCC(multi layer ceramic capacitor) the tape cast-ed BaTiO3 thick films in zirconia insulation box were sintered by the domestic microwave oven. Microwave sintered samples had higher density lower porosity than coventionally sintered ones. but they didn't show Z5U electrical properties due to short sintering time about 15 minutes.

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5층열장벽 피막의 고온 물성에 관한연구 (A Syudy on the High Temprerties of the 5Layer Functionally Gradient Thermal Barrier Coating)

  • 한주철;정철;송요승;윤종구;노병호;이구현
    • 한국표면공학회지
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    • 제31권1호
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    • pp.12-23
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    • 1998
  • The Thermal Barrier Coating(TBC) has been used to improve the heat barrier and tribological properties of the aircraft engine and the automobile engine in high temperature. Especially, the high temperature tribological propertied of the cylinder haed and the piston crown of diesel engine was emphasized. Therefore, the purpose of this work was to evaluate the microstructure, tribological propeer in high tempearmal shock resistance and bonding strength of five layer functionally gradient TBC for the applications. The five layerwere composed with 100% ceramic insulating later, 75(ceramic):25 (metal) layer, 50:50 layer, 25:75 layer and 100% metal bonding layer to redude the thermal stress. the YSL and MSL poweders were the insulation ceramics powers. The NiCrAly, Inconel625 and SUS powders were the bonding and mixingg powders for plasma spray process. According to the result of high temperature wear test, the wera resistance of YSZ/NiCrAlY siytem was most out standing at 600 and $800^{\circ}C$. At $400^{\circ}C$, the wear resistance of YSZ/Inconel system was better than others. Wear volume at other temperature because of the low temperature degration of zirconia. The thermal shock mechanism of 5 later is the vertical crack gegration in insulating layer. this means that the initial cracks were generated in the top layer, and then developed into the composite layers during thermal shock test. Finally, these cracks werereached to the interface of coating and substrate and also, these vertioal cracks join with the horizontal cracks of the each layers. The bonding strength of YSZ/NiCrAlY and YSZ/Inconel 5 layer system is better than other 5layer systems. The theramal shock resistance of thermal barrier coating s with 5 layer system is better than that of 3 layers and 2 layers.

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