• Proceedings of the KIEE Conference
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• 1987.11a
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• pp.191-192
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• 1987

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.4
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• pp.581-586
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• 1998

We investigated the effect of mechanical back side damage in Czochralski grown silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductivity decay method, degree of X-ray diffuse scattering, X-ray section topography, and wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the magnitude of diffuse scattering and X-ray excess intensity increased proportionally, and it was at Grade 1:Grade 2:Grade 3=1:7:18.4 that the normalized relative quantization ratio of excess intensity in damaged wafer was calculated, which are normalized to the excess intensity from sample Grade 1.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.122.2-122.2
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• 2011

결정질 태양전지 제작에서, passavtion은 표면의 반사도를 줄여주는 반사 방지막의 역할과 표면의 dangling bond를 감소시켜, 표면 재결합 속도를 줄이고 minority carrier lifetime을 증가하는 데 큰 영향을 미친다. 그렇기 때문에 저가형 고효율 태양전지 제작에서 우수한 특성을 가지는 passivation막은 매우 중요한 이슈이다. 본 연구에서는 LBC(local back contact) 구조를 가지는 단결정 태양전지 후면에, 기존의 Full Al-BSF의 passivation 막을 SiNx와 ONO passivation 막으로 각각 대체하여, LBC 구조에서 더 적합한 passivation 막을 찾고자 하였다. SiNx와 ONO passivation 막은 단결정 LBC 구조 태양전지 후면에 각각 형성되었고 $800^{\circ}C$, 20 sec 조건으로 소성되었다. 실험결과는 minority carrier lifetime과 surface recombination velocity로 관찰하였다. 그 결과, SiNx passivation 막의 표면 재결합 속도는 29.7cm/s이고, ONO passivation 막의 표면 재결합 속도는 24.5cm/s로, Full Al-BSF 표면 재결합 속도 750cm/s에 비해 더 적합한 passivation 막으로 확인할 수 있었다. 결과적으로 SiNx,ONO passivation 막이 Full Al-BSF보다 전극에 수집되는 캐리어의 양이 많아짐에 따라 효율향상을 가져올 수 있을 것이다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1073-1077
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• 2006

Proton irradiation technology was used for improvement of switching characteristics of the PT-IGBT. Proton irradiation was carried out at 5.56 MeV energy with $1{\times}10^{12}/cm^2$ doze from the back side of the wafer. The I-V, breakdown voltage, and turn-off delay time of the device were analyzed and compared with those of un-irradiated device and e-beam irradiated device which was conventional method for minority carrier lifetime reduction. For proton irradiated device, the breakdown voltage and the on-state voltage were 733 V and 1.85 V which were originally 749 V and 1.25 V, respectively. The turn-off time has been reduced to 170 ns, which was originally $6{\mu}s$ for the un-irradiated device. The proton irradiated device was superior to e-beam irradiated device for the breakdown voltage and the on-state voltage which were 698 V and 1.95 V, respectively, nevertheless turn-off time of proton irradiated device was reduced to about 60 % compared to that of the e-beam irradiated device.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.406-406
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• 2011

최근 결정질 실리콘 태양전지 분야에서는 태양전지의 Voc와 Isc의 증가를 통한 효율 향상을 목적으로 후면 passivation 박막에 대한 연구가 활발하게 진행되고 있다. Local-Back Contact Cell은 최적화된 후면 passivation 박막을 이용한 태양전지 제조방법이다. 본 연구에서는 고효율의 LBC 태양전지 개발을 위해 Rapid Thermal Oxide(RTO)를 이용한 후면 passivation 박막에 screen printing을 이용한 point contact 구조의 LBC 태양전지를 제작하고 그 특성을 분석하였다. 본 연구에 사용된 RTO 박막은 O2와 N2, 2L/min의 조건에서 $850^{\circ}C$에서 3분 동안 열처리하여 성장시켰다. 이렇게 성장된 박막은 3nm의 두께로 형성되어 passivation 효과를 나타내었으며, carrier lifetime 측정 결과 37.8us의 값을 나타냈다. 전면 ARC형성을 위해 RTO 박막 위에 PECVD를 이용하여 SiNx passivation 처리를 하였고, 그 결과 carrier lifetime은 49.1us까지 향상하였다. 후면의 전극 형성을 위해 screen printing 방법으로 Al point contact을 형성하여 local 한 BSF를 형성 시켰으며, 이후 후면 전극 연결을 위한 방법으로 300nm의 두께로 full Al evaporation 공정을 진행 하였다. 결과적으로 RTO 후면 passivation 박막에 Al point contact 형성을 통해 제작된 태양전지는, Suns-Voc 579mV, FF 82.3%, 16.7%의 효율을 달성하였다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.8
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• pp.463-467
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• 2000

In this paper, the new LIGBT structures with trap injection are proposed to improve switching characteristics of the conventional SOI LIGBT. The Simulations are performed in order to investigate the effects of the positiion, whidth and concentration of trap injection region with a reduced minority carrier lifetime using 2D device simulator MEDICI. Their electrical characteristics are analyzed and the optimum design parameters are extracted. As a result of simulation, the turn off time for the model A with the trap injection is $0.78\mus$. These results indicate the improvement of about 2 times compared with the conventional SOI LIGBT because trap injection prevents minority carriers which is stored in the n-drift region during turn off switching. The latching current is $1.5\times10^{-4}A/\mum$ and forward blocking voltage is 168V which are superior to those of conventional structure. It is shown that the trap injection is very effective to reduce the turn off time with a little increasing of on-state voltage drop if its design and process parameters are optimized.

• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.156-159
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• 2011

SiNx:H films have been widely used for anti-reflection coatings and passivation for crystalline silicon solar cells. In this study, SiNx:H films were deposited using high frequency (13.56 MHz) direct plasma enhanced chemical vapor deposition, and the optical and passivation properties were investigated. The radio frequency power, the spacing between the showerhead and wafer, the $NH_3/SiH_4$ ratio, the total gas flow, and the $N_2$ gas flow were changed over certain ranges for the film deposition. The thickness uniformity, the refractive index, and the minority carrier lifetime were then measured in order to study the properties of the film. The optimal deposition conditions for application to crystalline Si solar cells are determined from the results of this study.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.51-55
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• 2011

The surface passivation is one of the important methods that can improve the efficiency of solar cells and can be classified into two methods: wet-chemical passivation and film passivation. In this paper, chemical HF treatment were employed for the passivation of n-type silicon wafers and their effects were studied. To investigate film passivation effects, the silicon nitride films were also deposited by PECVD (plasma-enhanced chemical vapor deposition) on n-type silicon wafers treated with chemical HF. The minority carrier lifetime measurements were used for evaluation of the passivation characteristics in the all experiments steps. We confirmed that the minority carrier lifetime was improved with chemical HF treatment due to passivation effects by H-termination.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.7-11
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• 2012

SiNx films have been wildly used as anti-reflection coatings and passivation for crystalline silicon solar cells. In this study, the SiNx films were deposited by using high frequency (13.56MHz) PECVD and optical & passivation properties were investigated. The RF power was changed in a certain range for the film deposition. Then, the refractive index, etch rate, minority carrier lifetime and cell efficiency were measured to study the properties of the film respectively. The optimal deposition conditions for application to crystalline silicon solar cells were proposed as results of the study. Finally, the best cell efficiency of 16.98% was obtained from the solar cell with the SiNx films deposited by RF power of 550W.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.12
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• pp.565-569
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• 2006

Plasma enhanced chemical vapor deposition(PECVD) is a well established technique for the deposition of hydrogenated film of silicon nitride (SiNx:H), which is commonly used as an antireflection coating as well as passivating layer in crystalline silicon solar cell. PECVD-SiNx:H films were investigated by varying the deposition and annealing conditions to optimize for the application in silicon solar cells. By varying the gas ratio (ammonia to silane), the silicon nitride films of refractive indices 1.85 - 2.45 were obtained. The film deposited at $450^{\circ}C$ showed the best carrier lifetime through the film deposition rate was not encouraging. The film deposited with the gas ratio of 0.57 showed the best carrier lifetime after annealing at a temperature of $800^{\circ}C$. The single crystalline silicon solar cells fabricated in conventional industrial production line applying the optimized film deposition and annealing conditions on large area substrate of size $125mm{\times}125mm$ (pseudo square) was found to have the conversion efficiencies as high as 17.05 %. Low cost and high efficiency silicon solar cells fabrication sequence has also been explained in this paper.