• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.5 no.3
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• pp.48-58
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• 1994

In this paper, a CLPDA (Crossed Log-Periodic Dipole Antenna) for EMI / EMC Measurement is presented, and is analyzed by Combining the moment method and the transmission line theory. The CLPDA has a broaddband characteristic. It is so important to achieve a impedance matching over op- erating frequency range that Twin-boom method is used at feed point. Here, the current distribution, input admittance, radiation pattern and gain are calculated. In practice CLPDA is fabricated. Calculated result for radiation pattern and gain are very closed to measured result.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.50-57
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• 2001

This paper describes a design for the circularly polarized microstrip EMC cross dipole array antenna with the wide bandwidth. To realize the characteristics of wide bandwidth and circular polarization, the electromagnetic-coupled cross dipole element is proposed. The optimum design parameters of a circularly polarized EMC cross dipole element are calculated by the FDTD and the Ensemble. To obtain the uniform aperture illumination of electric field in an array, offset technique that the cross dipole elements are alternatively arranged on center of the microstrip feed line is adopted. In 20-element array design, the calculated axial ratio and gain are about 0.1dB and 9.9 dBi at 12 GHz, respectively, The frequency characteristics of a fabricated 20-element array antenna are measured. The calculated results agree well with the measured ones.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6419-6424
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• 2014

The use of the PMP (Protection Module Package) was proposed as a solution for the shorter battery lifetime. The PMP means that a protection circuit consists of a semiconductor single. In this study, basic research was carried out to select a suitable epoxy material of the EMC module through finite element analysis. First, the stress on the external force was compared by the flexural strength analysis. In the following thermal analysis, the temperature change of the EMC module and the internal part was compared using the calculated heating value. Finally, the filling ratio was compared with the injection of the melting epoxy in the EMC module.

• Journal of Korean Society of Forest Science
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• v.83 no.4
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• pp.540-544
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• 1994

Equilibrium moisture contents(EMC) were calculated based on temperature and relative humidity of atmosphere and actual EMCs were measured at intervals of ten days in previous air-dried wood samples for seven different species including Douglas fir and oaks in four indoor locations in central region for one year. Mean annual air temperature and relative humidity were $23.3^{\circ}C$ and 54.9% in bedroom, $22.4^{\circ}C$ and 59.5% in living room of apartment, $20.1^{\circ}C$ and 57.0% in office room and 19.4 and 64.0% in living room of tile-roofed house, respectively. Mean annual calculated and actual EMCs were 10.2 and 9.7% in bedroom, 11.1 and 10.2% in living room of apartment, 10.7 and 10.4% in office room, and 12.1 and 12.5% in living room of tile-roofed, house, respectively. Actual EMC of kasai were higher than average value of EMC for seven species. However, those of sycamore and apitong were lower than average value.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Journal of IKEEE
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• v.25 no.4
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• pp.591-597
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• 2021

This paper proposes an EMC-aware PCB design method to reduce electromagnetic emission, where trace length and teturn path of critical signal are shortened by changing chip location and trace layout on the PCB, while additional filters or decoupling capacitors are not required. In the proposed method, signal velocity is calculated for various signals on the PCB. Critical signal with the fastest signal velocity is determined and its return path is shortened as much as possible by placing chip location and trace routing first. Return path of critical signal should be carefully designed not to have discontinuity. Power plane and ground plane should be carefully designed not to be divided, since these planes are the reference of return path. The proposed method was applied to automotive directional Bluetooth speaker which failed to pass CISPR 32 and CISPR 25 EMC tests. Its PCB was redesigned based on the proposed method and it easily passed the EMC tests. The proposed method is useful to EMC-sensitive electronic equipments.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Journal of the Korean Wood Science and Technology
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• v.42 no.6
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• pp.653-658
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• 2014

This research was carried out to investigate equilibrium moisture content (EMC) of wood in outdoor locations in Korea. EMC was calculated using Hailwood-Horrobin equation for 73 different locations in Korea using the 1981 to 2010 climate normal data obtained from the Korea Meteorological Admnistration (KMA). Daegu showed the lowest values of EMC (11.5), and the highest EMC values (15.8) was found in Heuksando. Considering the season effect, summer (June, July, August) showed the highest values 15.3, followed by autumn (September, October, November) 13.7, winter (December, January, February) 12.2, and spring (February, March, April) 12.0. Monthly EMC showed the lowest values 11.6 in April and July showed the highest EMC values 16.1. The smallest changes in monthly EMC were found in Jeju island and Heuksando showed the largest values 8.7. A proper wood drying based on average EMC is more required in the regions with larger variation in EMC.

• Applied Chemistry for Engineering
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• v.10 no.6
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• pp.949-953
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• 1999

Because epoxy molding compound(EMC) for semi-conductor encapsulants contains high concentrations of fillers, its flow behaviors are affected much by the concentrations and properties of those fillers. This paper reports the effects of a filler concentration, shape, size, and size distributions on the viscosity behavior of EMC(epoxy/silica). In addition, the prediction of viscosity behavior was performed using the Mooney equation. The maximum packing volume in the Mooney equation was calculated by Ouchiyama's packing model and Taguchi's optimization method, while the shpae factor was determined by fitting the experimental data. The results showed that the Mooney equation predicted the viscosity behavior of EMC very well.

• Journal of the Korean Institute of Landscape Architecture
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• v.29 no.1
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• pp.22-31
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• 2001

The purpose of this study is to compare calculated pollutant loadings using pollutant load unit factors and vector type coverage, and expected mean concentration(EMC) and raster type of digital elevation model(DEM). This study is also focusing on comparison of the advantages and the disadvantages of the two methods, and seeking for a method of calculation of pollutant loadings using DEM. Estimation of pollutant inputs using pollutant load unit factors has limitations in identifying seasonal variations of pollutant loadings. Seasonal changes of runoffs should be considered in the calculation of pollutant loadings from catchments into reservoirs. Evaluation of pollutant inputs using runoff-coefficient and EMC can overcome these drawbacks. Proper EMC and runoff-coefficient values for the Koeup stream catchments of the Koheung estuarine lake were drawn from review of related papers. Arc/Info was employed to establish database of spatial and attribute data of point and non-point pollutant sources and characteristics of the catchments. ArcView was used to calculate point and non-point pollutant loadings. Pollutant loads estimated with either unit factors-coverages, i.e., pollutant load unit factors and vector coverages f point sources and land use, or EMC and digital elevation mode(DEM) were compared with stream monitoring loads. We have found that some differences were shown between monitoring results and estimated loads by Unit Factors-Coverage and EMC-DEM. Monthly variations of pollutant loads evaluated with EMC-DEM were similar to those with monitoring result. The method using EMC-DEM can calculate accumulated flows and pollutant loads and can be utilized to identify stream networks. A future research on correcting the difference between vector type stream using flow direction grid and digitalizing vector type should be conducted in order to obtain more exact calculation of pollutant loadings.