• Tribology and Lubricants
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• 제20권5호
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• pp.245-251
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• 2004

This paper presents the effects of the bump foil stiffness on the static and dynamic performance of the foil journal bearings. Reynolds equation is used for the static and dynamic performance analyses. To consider the deflection of top foil the top foil is modeled as a elastic beam and the bump foil is modeled as a spring. So in the static performance analysis the load capacity is compared to the various bump foil stiffness and in the dynamic performance analysis the trajectory of journal center is compared to the various bump foil stiffness.

• 한국전산유체공학회지
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• 제10권3호
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• pp.19-26
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• 2005

The purpose of this paper is the study on the characteristics of an inlet system with shock/boundary layer interactions by using various types of bumps which are substituted for the conventional bleeding system in supersonic inlet. in this study a comprehensive numerical analysis has been performed to understand the three-dimensional flow field including shock/boundary layer interaction and growth of turbulent boundary layer that might occur around a three-dimensional bump in a supersonic inlet. The characteristics of boundary layer seen in the current numerical simulations indicate the potential capability of a three-dimensional bump to control shock/boundary layer interaction in supersonic inlets.

• Tribology and Lubricants
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• 제21권6호
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• pp.256-262
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• 2005

The calculation of bump foil deflection is very important to predict the performance of foil bearings more accurately, because the foil bearings consist of top foil and its elastic foundation usually called bump foil. For the purpose of this, a finite element model considering 3-dimensional structure of the bump foil is developed to calculate the deflection of inter-connected bump. The results obtained from the suggested model are compared and analyzed with those from the previous proposed deflection models. In addition, load capacity of the foil bearings is analyzed by using this model.

• Tribology and Lubricants
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• 제21권6호
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• pp.283-288
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• 2005

This paper presents the theoretical model and analysis results to investigate the effect of Coulomb damping in the sub-structure of a foil bearing. Vertical and horizontal deflection of a bump is restricted by friction of the bump. Equivalent viscous damping of the bump foil is derived from the Coulomb friction. Dynamic equation of the bump is constituted by stiffness and damping terms. The air film is modeled by the compressible Reynolds equation. A perturbation approach and finite difference numerical method is used to determine the static and dynamic performance of the bearing from the coupled fluid-structural model. The analysis result shows that the static and dynamic performance is enhanced by the bump friction.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년도 학술대회
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• pp.262-267
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• 2008

Numerical investigations were performed with an external-compression inlet with a three-dimensional bump at Mach 2 to scrutinize the geometrical effects of the bump in controlling the interaction of a shock wave with a boundary layer. The inlet was designed for two oblique shock waves and a terminal normal shock wave followed by a subsonic diffuser, with a circular cross-section throughout. The bump-type inlet that replaced the aft ramp of the conventional ramp-type inlet was optimized with respect to the inlet performance parameters as well as compared with the conventional ramp-type inlet. The current numerical simulations showed that a bump-type inlet can provide an improvement in the total pressure recovery downstream of the shock wave/boundary layer interaction over a conventional ramp-type inlet.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년 추계학술대회논문집
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• pp.262-267
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• 2008

Numerical investigations were performed with an external-compression inlet with a three-dimensional bump at Mach 2 to scrutinize the geometrical effects of the bump in controlling the interaction of a shock wave with a boundary layer. The inlet was designed for two oblique shock waves and a terminal normal shock wave followed by a subsonic diffuser, with a circular cross-section throughout. The bump-type inlet that replaced the aft ramp of the conventional ramp-type inlet was optimized with respect to the inlet performance parameters as well as compared with the conventional ramp-type inlet. The current numerical simulations showed that a bump-type inlet can provide an improvement in the total pressure recovery downstream of the shock wave/boundary layer interaction over a conventional ramp-type inlet.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2005년도 춘계 학술대회논문집
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• pp.213-218
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• 2005

The purpose of this study is the characteristics of an innovative inlet system with shock/boundary layer interactions by using various types of bumps which are substituted for the conventional bleeding system in supersonic inlet. This study performs a comprehensive numerical effort that be directed at better understanding the three-dimensional flowfield includes shock/boundary layer interaction and growth of turbulent boundary layer that occur around a three-dimensional bump in a supersonic inlet. The characteristics of boundary layer seen in the current numerical simulations indicates the potential capability of the three-dimensional bump to control shock/boundary layer interaction in supersonic inlets.

• Journal of Mechanical Science and Technology
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• 제14권7호
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• pp.744-751
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• 2000

To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

• 한국생산제조학회지
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• 제19권2호
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• pp.157-162
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• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

• Journal of Welding and Joining
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• 제20권5호
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• pp.72-77
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.