• Journal of Korean Medical classics
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• v.21 no.2
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• pp.39-47
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• 2008

After reviewing literatures of Han dynasty or earlier that recognize tumor, bump or mass, we concluded as follows. The recognition or study on tumor, bump or mass started at least Seoju(西周) Dynasty or earlier, and academic system was developed since earlier Han Dynasty(漢代). Until Han Dynasty, main characters that recognize Tumor, bump or mass include Jong(腫), Yang(瘍), Yu(瘤), Yeong, Chang (瘡), Ong(癰), Jeo(疽), Jeok(積), Chwi(聚), Byeok(癖), Jing, and Ga, Hyeon that firstly appeared in Southern and Northern Dynasties(南北朝), and Am(癌) that firstly appeared in Song Dynasty[宋代] can also be considered as significant characters. The main perception of cancer(腫瘍) until Han Dynasty was started by understanding the concept of the word Yu(瘤) and developed through visual, tactile sensation and symptom observation of following 2 categories, One is tumor, btm1p or mass which is expressed in outer body like Yeong, Jong(腫), Chang(瘡), Yang(瘍), Ong(癰), and Jeo(疽), The other is tumor, bump or mass which is expressed internally like Jeok(積), Chwi(聚), Byeok (癖), Jing, and Ga.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.37-41
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• 2014

One of the important developments in next generation electronic devices is the technology for power delivery and heat dissipation. In this study, the Cu-to-Cu flip chip bonding process was evaluated using the square ABL power bumps and circular I/O bumps. The difference in bump height after Cu electroplating followed by CMP process was about $0.3{\sim}0.5{\mu}m$ and the bump height after Cu electroplating only was about $1.1{\sim}1.4{\mu}m$. Also, the height of ABL bumps was higher than I/O bumps. The degree of Cu bump planarization and Cu bump height uniformity within a die affected significantly on the misalignment and bonding quality of Cu-to-Cu flip chip bonding process. To utilize Cu-to-Cu flip chip bonding with ABL bumps, both bump planarization and within-die bump height control are required.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of the Korean Graphic Arts Communication Society
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• v.4 no.1
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• pp.43-55
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• 1986

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.39-46
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• 2003

Sn-Cu eutectic solder bump was fabricated by electroplating for flip chip and its characteristics were studied. A Si-wafer was used as a substrate and the UBM(Under Bump Metallization) of Al(400 nm)/Cu(300 nm)/Ni(400 nm)/Au(20 nm) was coated sequentially from the substrate to the top by an electron beam evaporator. The experimental results showed that the plating ratio of the Sn-Cu increased from 0.25 to 2.7 $\mu\textrm{m}$/min with the current density of 1 to 8 A/d$\m^2$. In this range of current density the plated Sn-Cu maintains its composition nearly constant level as Sn-0.9∼1.4 wt%/Cu. The solder bump of typical mushroom shape with its stem diameter of 120 $\mu\textrm{m}$ was formed through plating at 5 A/d$\m^2$ for 2 hrs. The mushroom bump changed its shape to the spherical type of 140 $\mu\textrm{m}$ diameter by air reflow at $260^{\circ}C$. The homogeneity of chemical composition for the solder bump was examined, and Sn content in the mushroom bump appears to be uneven. However, the Sn distributed more uniformly through an air reflow.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.186-194
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• 2004

Experiments were conducted to determine the structural static and dynamic characteristics of air foil bearings. The housing of the bearing on the journal was driven by an impact hammer which was used to simulate dynamic forces acting on the bump loll with various leading condition. Two different bump foils (Cu-coated bump and viscoelastic bump) were tested and the static and dynamic coefficients of two bump foils compared, based on the experimental measurements for a wide range of operating conditions. The static and dynamic characteristics of air foil bearings were extracted 0rpm the frequency response function by least square method and IV(Instrumental Variable) method. The experiment was tested at 0rpm and $10,000\~16,000rpm$, and loaded on $50\~150N$. From the test results, the possibility of the application of high load and high speed condition is suggested.

• The Bulletin of The Korean Astronomical Society
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• v.41 no.2
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• pp.40.2-40.2
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• 2016

The attenuation of starlight by dust in galactic environments is investigated through models of radiative transfer in a spherical, clumpy interstellar medium (ISM). We show that the attenuation curves are primarily determined by the wavelength dependence of absorption rather than by the underlying extinction (absorption+scattering) curve; the observationally derived attenuation curves cannot constrain a unique extinction curve unless the absorption or scattering efficiency is specified. Attenuation curves consistent with the Calzetti curve are found by assuming the silicate-carbonaceous dust model for the Milky Way (MW), but with the $2175{\AA}$ bump suppressed or absent. The discrepancy between our results and previous work that claimed the Small Magellanic Cloud dust to be the origin of the Calzetti curve is ascribed to the difference in adopted albedos; we use the theoretically calculated albedos whereas the previous ones adopted empirically derived albedos from observations of reflection nebulae. It is found that the model attenuation curves calculated with the MW dust are well represented by a modified Calzetti curve with a varying slope and UV bump strength. The strong correlation between the slope and UV bump strength, as found in star-forming galaxies at 0.5 < z < 2.0, is well reproduced if the abundance of the UV bump carriers is assumed to be 30-40% of that of the MW-dust; radiative transfer effects lead to shallower attenuation curves with weaker UV bumps as the ISM is more clumpy and dustier. We also argue that some of local starburst galaxies have a UV bump in their attenuation curves, albeit very weak.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.17-21
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• 2008

The electroless plating of copper and tin were investigated for the fabrication of Sn-Cu bump. Copper and tin were electroless plated in series on $20{\mu}m$ diameter copper via to form approximately $10{\mu}m$ height bump. In electroless copper plating, acid cleaning and stabilizer addition promoted the selectivity of bath on the copper via. In electroless tin plating, the coating thickness of tin was less uniform relative to that of electroless copper, however the size of Sn-Cu bump were uniform after reflow process.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.10 s.103
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• pp.1202-1210
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• 2005

This paper develops a computer model for estimating the bump characterisitcs of a cat)over type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using MSC.ADAMS. A shock absorber, a rubber bush, and a leaf spring affect a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC.PATRAN. A mode analysis is performed with the frame model using MSC.NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double wheel bump test is performed with an actual vehicle. In the double wheel bump, vortical displacement, velocity, acceleration are measured. Those test results are compared with the simulation results.