• Tribology and Lubricants
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• v.17 no.6
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• pp.441-446
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• 2001

In this paper the effect of bump compliance, load, and the number of pad on the lift-off speed is studied. When the load is greater and bump compliance lower, the shaft is lifted off at higher rotating speed. And when the load is applied near the center of pad, lift-off speed is lower. When the number of pad increases, the lift-off speed is higher. The lift-off characteristics can be used to lengthen the lift time of the coating and design the rotating machinery supported by bump bearings.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.245-247
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• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

• Proceeding of EDISON Challenge
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• 2014.03a
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• pp.544-549
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• 2014

임계마하수보다 큰 자유흐름 마하수에서는 충격파의 발생으로 인해 급격한 항력증가가 발생하므로, 임계마하수 증가는 고속 공기역학에서 중요한 분야로 다뤄지고 있다. Whitcomb R. T.에 의해 천음속영역에서 순항할 수 있는 초임계익형이 개발되었으나, 충격파 제어 기법들에 대한 실험적인 검증은 형상 제작의 어려움으로 인해 한계를 지닌다. 따라서 본 논문에서는 2D_Comp-2.1_P와 Prandtl-Glauert 압축성 보정식을 이용하여 NACA0012와 RAE2822의 임계마하수를 해석하고, 충격파 제어 장치 중 하나인 Bump를 RAE2822에 설치하여 임계마하수를 향상시키기 위한 연구를 수행하였다. 연구 결과 충격파를 압축파로 분산시켜 충격파의 강도를 약화시키고, 양항비의 4.7% 증가를 확인하였다. 따라서 Bump를 설계한 RAE2822가 기본 익형보다 높은 천음속 조건에서 효율적인 공력특성을 가지는 것을 확인하였다.

• 유체기계공업학회:학술대회논문집
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• 2004.12a
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• pp.98-103
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• 2004

This paper presents modeling and simulation of the bump foil bearings with consideration of the elastic behavior of the foil and gas compressibility. Heshmat had originally introduced the simple compliance model to estimate the EHL(elasto-hydrodynamic lubrication) performance. But this approach can not consider the deflection of top foil at the edge of bearing, so model is insufficient to analyze in case that the eccentricity ratio is greater than I. So the top foil is considered as a simple beam model supported by linear spring elements, and the bump foil deflection can be simple compliance model. The EHL calculations are performed for convention rigid type, classical foil type, variable pitch type and double bump type toil bearings. This paper presents that 2nd or 3rd generation bearings have excellent performance in every speeds.

• The KSFM Journal of Fluid Machinery
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• v.9 no.1 s.34
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• pp.47-55
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• 2006

This paper presents the theoretical model to investigate the effect of Coulomb damping in the sub-structure of a foil bearing. Foil deflection is restricted by friction of bumps. Equivalent viscous damping of the bump foils is derived from the Coulomb friction. Dynamic equation of the bumps is constituted by stiffness and damping terms. This point give the difference from Heshmat's frictionless and simple compliance bump model. The fluid is modeled with the compressible Reynolds equation. A perturbation approach is used to determine the static and dynamic performance of the bearing from the coupled fluid-structural model. The analysis result shows that the static and dynamic performance is enhanced by bump friction. This analysis technique would be extended to development of a high performance bearing.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.49-53
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• 2002

The Sn-Cu eutectic solder bump formation ($140{\mu}{\textrm}{m}$ diameter, $250{\mu}{\textrm}{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Cu deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased with increasing time. The plating rate increased generally according to current density. After the characteristics of Sn-Cu plating were investigated, Sn-Cu solder bumps were fabricated on optimal condition of 5A/dm$^2$, 2hrs. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallization). The shear strength of Sn-Cu bump after reflow was higher than that of before reflow.

• The Bulletin of The Korean Astronomical Society
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• v.44 no.2
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• pp.55.1-55.1
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• 2019

We investigate broadband emission properties of the pulsar wind nebula (PWN) 3C 58 using a spectral energy distribution (SED) model. We attempt to match simultaneously the broadband SED and spatial variations and emission about 3C 58 in X-ray band. We further the model to explain a possible far-IR feature of which a hint is recently suggested in 3C 58: a small bump at ~10^11 GHz in the PLANCK and Herschel band. While external dust emission may easily explain the observed bump, it may be internal emission of PWNe implying an another additional population of particles. Although significance for the bump in 3C 58 is not higher than other PWNe, here we explore possible origins of the IR bump using the emission model and find that a population of electrons with GeV energies can explain the bump. If it is produced in the PWN, it may provide new insights into particle acceleration and flows in PWNe.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• Journal of KIISE:Computer Systems and Theory
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• v.30 no.11
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• pp.663-674
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• 2003

Bump mapping is a technique that represents the detailed parts of the object surface, such as a perturberance of the skin of a peanut, using the geometry mapping without complex modeling. However, the hardware implementation for bump mapping is considerable, because a large amount of per pixel computation, including the normal vector shading, is required. In this paper, we propose a new bump mapping algorithm using the polar coordinate system and its hardware architecture. Compared with other existing architectures, our approach performs bump mapping effectively by using a new vector rotation method for transformation into the reference space and minimizing illumination calculation. Consequently, our proposed architecture reduces a large amount of computation and hardware requirements.

• Journal of Welding and Joining
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• v.19 no.5
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• pp.520-525
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• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.