• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.1
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• pp.40-45
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• 1991

It is well known that the conventional differential source-coupled pair uses gates as its input terminals. This input pair provids a high open-loop gain, a large CMRR, and a good PSRR. For these reasons, the input pair has been used widely as an input stages of the differential amplifiers, but a narrow linear input range of this structurelimits its application in the area of some analog circuit design. A novel CMOS source-coupled backgate pair is proposed in this paper. The bulk of MOSFET is exploited and input devices are biased to operate in ohmic region. With this topology, the backgate pair of the wide linear input range and variable transconductance can be obtained. This backgate input differential stage is realized with the size of W/L=50/25 MOSFETs. The results show the nonlinear error is less than $\gamma$1% over 10V full-scale range for the bias current of 200$\mu$A with 10V single power-supply.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.2
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• pp.277-281
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• 2007

We investigated fault current limitation characteristics of the resistive superconducting fault current limiter (SFCL) which consisted of a Bi-2212 bulk coil and a shunt coil. The Bi-2212 bulk coil and the shunt coil were connected in parallel. The Bi-2212 bulk coil was placed inside the shunt coil to induce field-assisted quench. The fault test was conducted at an input voltage of $200V_{rms}$ and fault current of $12kA_{rms}\;and\;25kA_{rms}$. The fault conditions were asymmetric and symmetric, and the fault period was 5 cycles. The test results show that the SFCL successfully limited the fault current of $12kA_{rms}\;and\;25kA_{rms}$ to below $5.5{\sim}6.9kA_{peak}\;within\;0.64{\sim}2.17$ msec after the fault occurred. Limitation was faster under symmetric fault test condition due to the larger change rate of current. We concluded that the speed of fault current limitation was determined by the speed of current rise rather than the amplitude of a short circuit current. These results show that the Bi-2212 bulk coil is suitable for distribution-class SFCLS.

• Journal of KIISE:Information Networking
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• v.27 no.1
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• pp.39-47
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• 2000

This paper is to propose an efficient and reliable control procedure of Base Station Controller of mobile communication system for bulk input messages which was delivered instantaneously. We divided the input messages that are processed by the base station controller of the mobile communication system into two things ; they are messages related to call connection and o&m(operation and maintenance). In addition, we analyzed the properties of the input messages and then performed computer simulation on each input message by using M/M/1/K queueing model in term of the following viewpoints : the loss probability of input messages, the average queue length, the utilization of process controller(server),the average waiting time in queue. And we compared the performance of the two input messages in the overload controlling which was caused by the congested input messages.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.639-640
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• 2006

We investigated fault current limitation characteristics of the resistive superconducting fault current limiter(SFCL) which consisted of a Bi-2212 bulk coil and a shunt coil. The Bi-2212 bulk coil and the shunt coil were connected in parallel. The Bi-2212 bulk coil was placed inside the shunt coil to induce field-assisted quench. The fault test was conducted at an input voltage of 200 $V_{rms}$ and fault current of 12 $kA_{rms}$ and 25 $kA_{rms}$. The fault conditions were asymmetric and symmetric, and the fault period was 5 cycles. The test results show that the SFCL successfully limited the fault current of 12 $kA_{rms}$ and 25 $kA_{rms}$ to below $5.5{\sim}6.9kA_{peak}$ within $0.64{\sim}2.17$ msec after the fault occurred. Limitation was faster under symmetric fault test condition due to the larger change rate of current. We concluded that the speed of fault current limitation was determined by the speed of current rise rather than the amplitude of a short circuit current. These results show that the Bi-2212 bulk coil is suitable for distribution-class SFCLs.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.933-934
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• 2007

We fabricated and tested a resistive type superconducting fault current limiter (SFCL) based on BSCCO-2212 bulk coils. Each bulk coils of the SFCL was designed to have the rated voltage of 220 $V_{rms}$ and the critical current($I_C$) of 320$\sim$340 A at 77K. Ten components in series, make the SFCL having the rated voltage of 2.2 $kV_{rms}$ for equal quench test. The fault test was conducted at an input voltage of 2.2 $kV_{rms}$ and fault current of 25 $kA_{rms}$. In addition, we examined the endurance characteristics for all bulk coils through repeat fault test. Test results shows that the SFCL successfully limited the fault current of 25$kA_{rms}$ to below $7{\sim}8kA_{p}$ within minimum 1.1msec after fault occurred. All bulk coils quenched together upon faults and shared the rated voltage evenly. The endurance test results show an equivalent among repeat fault test. During the quench process, average temperature of all bulk coils did not exceed 250 K, and the SFCL was totally safe during the whole operation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.224-227
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• 1996

Platinum thin films were deposited on Si-wafer by DC magnetron sputtering for RTD (Resistance Thermometer Devices). We investigated the physical and electrical characteristics of these films under various conditions, the input power, working vacuum, temperature of substrate and also after annealing these films. The deposition rate was increased with increasing the input power but decreased with increasing Ar gas pressure. The resistivity were decreased wish increasing the temperature of substrate and the annealing time at 1000$^{\circ}C$. At substrate temperature 300$^{\circ}C$, input power 7(w/$\textrm{cm}^2$), working vacuum 5mtorr and annealing conditions 1000$^{\circ}C$, 240 min we obtained 10.65${\mu}$Ω$.$cm, resistivity of Pt thin film closed to the bulk value.

• Electrical & Electronic Materials
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• v.9 no.9
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• pp.911-917
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• 1996

Platinum thin films were deposited on Si-wafer by DC rnagnetron sputtering for RTD (resistance thermometer devices). We investigated the physical and electrical characteristics of these films under various conditions, the input power, working vacuum, temperature of substrate and also after annealing these films. The deposition rate was increased with increasing the input power but decreased with increasing Ar gas pressure. The resistivity and sheet resistivity were decreased with increasing the temperature of substrate and the annealing time at 1000.deg. C. At substrate temperature of >$300^{\circ}C$, input power of 7 w/cm$^{2}$, working vacuum of 5 mtorr and annealing conditions of 1000.deg. C and 240 min, we obtained 10.65.mu..ohm..cm, resistivity of Pt thin films and 3800-3900 ppm/.deg. C, TCR(temperature coefficient of resistance). These values are close to the bulk value. These results indicate that the Pt thin films deposited by DC magnetron sputtering have potentiality for the development of Pt RTD temperature sensor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1077-1079
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• 2003

This paper describes the development of bulk acoustic wave (BAW) resonators using a PolyVinyliDene Fluoride (PVDF). The resonators have an air gap between a substrate for acoustic isolation without surface micromachining. We measured the resonance frequency and the input reflection coefficient (S$\sub$11/) of resonators using vector network analyzer. The fundamental resonance in this experimental result was measured at 1.4 ㎓ with a return loss of -23.2 ㏈. We can confirm a possibility of resonator application as using a PVDF because it can fabricate the resonator without etching process.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.06a
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• pp.251-257
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• 2000

A numerical simulation of the temperature rise for sliding surface in dry contact is based on Jaeger's formula combined with a calculated heat input. A gear tooth temperature analysis was performed. The pressure distribution has the Hertzian pressure distribution on the heat source. The heat partition factor is calculated along line of action. A Temperature distribution of tooth surface is calculated about before and after profile modification. A Temperature of addendum and deddendum in modified gear have reduced.

• Journal of Advanced Marine Engineering and Technology
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• v.25 no.2
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• pp.331-337
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• 2001

A numerical simulation of the temperature rise for sliding surface in dry contact is based on Jaegers formula combined with a calculated heat input. A gear tooth temperature analysis was performed. The pressure distribution has the Hertzian pressure distribution on the heat source. The heat partition factor is calculated along ling of action. A Temperature distribution of tooth surface is calculated about before and after profile modification. A Temperature of addendum and deddendum in modified gear have reduced.