• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.88-89
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• 2009

In this paper, we investigated about wet cleaning effect as deep trench formation methods for Power chip devices. Deep trench structure was classified by two methods, PSU (Poly Stick Up) and Non-PSU structure. In this paper, we could remove residue defect during wet. cleaning after deep trench etch process for non-PSU structure device as to change wet cleaning process condition. V-SEM result showed void image at the trench bottom site due to residue defect and residue component was oxide by EDS analysis. In order to find the reason of happening residue defect, we experimented about various process conditions. So, defect source was that oxide film was re-deposited at trench bottom by changed to hydrophobic property at substrate during hard mask removal process. Therefore, in order to removal residue defect, we added in-situ SCI during hard mask removal process, and defect was removed perfectly. And WLR (Wafer Level Reliability) test result was no difference between normal and optimized process condition.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.49-56
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• 2008

This paper introduces a compact analytical current conduction model of long-channel depletion-mode n-type nanowire field-effect transistors (NWFETs). The NWFET used in this work was fabricated with the bottom-up process and it has a bottom-gate structure. The model includes all current conduction mechanisms of the NWFET operating at various bias conditions. The results simulated from the newly developed NWFET model reproduce a reported experimental results within a 10% error.

• KIEAE Journal
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• v.12 no.3
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• pp.95-100
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• 2012

Thermal phenomena has caused abnormal weather phenomena due to the lack of urban green spaces To solve these problems, the country of recorded a city business is actively evolving trends. but in all the land, most built-up city's green buildings unless the demolition of the composition is an impossible situation, green space in urban areas, with emphasis on composition. In this study, thermal power plants that occured in the evolution of vegetation by utilizing Bottom Ash was tried to develop a lightweight block. Bottom Ash block to take advantage of vegetation is focused create green space in urban areas Vegetation in the block was carried out manufacturing lightweight, porous, lightweight water ratio suitable for three types of blocks selected according to its kind study on the manufacturing and process. Bottom Ash from this study at the time of disposal of coal ash generated by recycling the landfill shortages, loss of landfill costs, environmental pollution and are trying to solve the same problem at the same time.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.5
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• pp.889-898
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• 2022

In this study, sand casting process was applied to manufacture a large aluminum turbo-type fan used for tank powerpack. To apply the sand casting method, the turbo fan was reverse engineered, and after designing three gating systems, the optimal gating system design was selected by performing casting simulation. In the case of the bottom up-gating system, there is a significant temperature loss of the molten alloy during blade filling. When the molten alloy is completely filled into the sand mold, the blade upper tip and front shroud are below the liquidus temperature. In the case of the top down-gating system, molten alloy scattering occurs, but the temperature loss while the blade is filled is smaller than that of the bottom up type. And after the inflow of molten alloy into the mold is completed, the blade upper tip and front shroud are higher than the liquidus temperature. A sand mold was manufactured with the top down-gating system and the casting process was performed. The fan was made perfectly in appearance without any unfilled parts.

• Journal of the Korean Chemical Society
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• v.10 no.2
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• pp.76-90
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• 1966

Ammonium sulfate synthesized by the air oxidation methods without catalyst using the reaction vessel which was fitted with fritted glass at the bottom of it and introducing, through the bottom, ammonia and air with constant flow rates to sulfurous acid solution of constant concentrations at the given temperatures. The experiment showed that the oxidation process was accelerated in accord with the increase of the air flow rates when the ammonia flow rate was constantly kept at ca. 100ml/min. in high temperatures. When the pH of the solution reached 9.0, the oxidation was nearly completed. It is assumed that in the process of reaction, $[O_{2}{\to}HSO_{3}^-]^{\neq}$ would be produced as an activated complex and the reaction was thought to be first order. The experiment indicated that the 0.5M sulfurous solution could be oxidized up to 98.54% at the flow rates of ammonia and air, 100ml/min., and 4l/min., respectively at $50^{\circ}C$.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Review of Korean Society for Internet Information
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• v.14 no.3
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• pp.68-77
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• 2013

This article consists of 3 parts. Part I is multi stakeholder approach on Internet governance system. Part II is analysis of the Korean Internet governance system. In this part, I explain relevant laws in Korea, including Korean Internet Address Resources Act. Part III is my suggestion on Korean Internet governance system using a multi stakeholder approach. First of all, the keyword of the Internet governance system is decision making process: that is, consensus based versus top-down approach. Then who are major players in Internet governance in national level? Government, or Private sectors such as business and civil society. Korean legal system for Internet governance shows a top-down decision making process. Major players are the government (that is, Ministry of Science, ICT and Future Planning) and KISA affiliated with the government. Other players include Internet Address Policy Committee, Korea Internet Governance Alliance, and NGOs. The key statute for Internet governance in Korea is Internet Address Resources Act of 2004. Articles 3 and 5 require the Ministry of Science, ICT and Future Planning to take a proactive role in Internet governance. The government shall consult with the Internet Address Policy Deliberation Committee for Internet governance. Yet this Committee is established under the control of the Ministry of Science, ICT and Future Planning. All members of this Committee are also commissioned or nominated by the Chairman of the Ministry. Meanwhile, there are also non-official organizations, including Sub-committee on Address & Infrastructure of Korea Internet Governance Alliance. I suggest to reform decision making process of Korean Internet governance system based on BOTTOM-UP process for CONSENSUS BASED DECISION. My suggested system includes the following: (1) The government hands over a major role in Internet governance to INDEPENDENT Internet policy organization. And the government participates in such organization as ONE of the players. (2) Nomination of this committee member must be bottom-up process for a genuine multi-stakeholder model including civil society, commercial organization, end-users and experts. (3) The government should establish plan for supporting the private sector's international activity on the long-term basis.

• Journal of the Korean institute of surface engineering
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• v.31 no.5
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• pp.237-244
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• 1998

In this stydy, submicron shallow trenches applied to STI(shallow tench isolation) were etched using inductively coupled $CI_2$/HBr and $CI_2/N_2$plasmas and the physical and electrical defects remaining on the etched silicon trench surfaces and the effects of various annealing and oxidation on the removal of the defects were studied. Using high resolution electron microscopy(HRTEM), Physical defects were investigated on the silicon trench surfaces etched in both 90%$CI_2$/ 10%$N_2$ and 50%$CI_2$/50%HBr. Among the areas in the tench such as trench bottom, bottom edge, and sidewall, the most dense defects were found near the trench bottom edge, and the least dense defects were found near the trench bottom edge, and least dense defects compared to that etched with ment as well as hydrogen permeation. Thermal oxidation of 200$\AA$ atthe temperature up to $1100^{\circ}C$apprars not to remove the defects formed on the etched silicon trenches for both of the etch conditions. To remove the physicall defects, an annealing treatment at the temperature high than $1000^{\circ}C$ in N for30minutes was required. Electrical defects measured using a capacitance-voltage technique showed the reduction of the defects with increasing annealing temperature, and the trends were similar to the results on the physical defects obtained using transmission electron microscopy.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.66-72
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• 2010

Recently, the use of means of transportation of the lightweight aluminum to temper the trend is increasing. More efficient use of lightweight aluminum material to Friction stir welding has been widely attempted. Types of welding tools at the right screw to rotate anti-clockwise direction, when the tensile stress exerted on the location of the top plate to the left in the direction of the welding process to the installation was able to obtain high tensile strength. A5052 to the top of the left in the direction of the welding process to install and, when you installed the right under the A6061 was not easily come up to the top of the A5052. Conversely, at the bottom left to install on top of the A6061 and A5052 have been installed at the bottom of the upper area of the A6061 and A5052 intrude easily form the shape of the hill you can see that it was formed.

• Journal of KIISE:Information Networking
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• v.28 no.4
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• pp.611-620
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• 2001

To meet the requirements of reliable service for various applications, a Reliable Multicast Transport Protocol should be implemented over IP Multicast where currently best-effort service is provided. Among the current researches, hierarchical tree-based mechanism has been proposed and actively studied. This mechanism is known to provide high scalability as well as reliability, but needs an additional tree configuring mechanism for building an efficient logical tree in transport layer. Bottom-up approach has been used for creating such a tree. This method has benefits from parallel tree construction for receivers, while it has some drawbacks such that it does not guarantee a loop-free tree and brings heavy message overhead during tree creation process. Therefore, this paper proposes a top-down based mechanism for constructing a control tree, which can guarantee loop-freeness by step-wise mannered tree building. From experimental simulations, it shows that the proposed mechanism has less message overhead. It is recommended that the bottom-up and the proposed top-down will be selectively used in real networks, according to the requirements of the concerned multicast applications.