• Title/Summary/Keyword: bottom electrode

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Properties of sputtering PZT thin film on the Ru/$RuO_2$electrode (Ru/$RuO_2$전극에 성장한 PZT박막의 특성에 관한연구)

  • 강현일;최장현;이종덕;송준태
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.717-720
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    • 2001
  • Ferroelectric lead ziroconate titanate (PZT) thin film were fabricated on the different bottom electrodes. Both Ru and Ru/RuO$_2$bottom electrodes were deposited by RF-magnetron sputteirng method. The structure phase and surface morphology of the PZT thin film were largely affected by the bottom electrode. It was observerd that used of Ru/RuO$_2$double electrode reduced leakage current and better ferroelectric properties compare with RuO$_2$bottom electrode. From these results, Ru/RuO$_2$hybride bottom electrode is thought to be the available structure for the bottom electrode.

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Distortion of the Bottom Surface in Micro Cavity Machining Using MEDM (미세 캐비티 방전 가공에서 바닥면 형상 왜곡)

  • 임종훈;류시형;제성욱;주종남
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.12
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    • pp.191-197
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    • 2003
  • As mechanical components are miniaturized, the demand on micro die and mold is increasing. Micro mechanical components usually have high hardness and good conductivity. So micro electrical discharge machining (MEDM) is an effective way to machine those components. In micro cavity fabrication using MEDM, it is observed that the bottom surface of cavity is distorted. Electric charges tend to be concentrated at the sharp edge. At the center of the bottom surface, debris can not be drawn off easily. These two phenomena make the bottom surface of the electrode and workpiece distort. As machining depth increases, the distorted shape of electrode approaches hemisphere. This process is affected by capacitance and the size of electrode. By using a smaller electrode than the desired cavity size and appropriate tool movement, bottom shape distortion can be prevented.

Distortion of the Bottom Surface in Micro Cavity Machining Using MEDM

  • Lim Jong Hoon;Je Sung Uk;Ryu Shi Hyoung;Chu Chong Nam
    • International Journal of Precision Engineering and Manufacturing
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    • v.6 no.4
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    • pp.44-48
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    • 2005
  • As mechanical components are miniaturized, the demands on micro die/mold are increasing. Micro mechanical components usually have high hardness and good conductivity. Micro electrical discharge machining (MEDM) can thus be an effective way to machine those components. In micro cavity fabrication using MEDM, it is observed that the bottom surface of the cavity is distorted. Electric charges tend to be concentrated at the sharp edge, and debris cannot be drawn off easily at the center of the bottom surface. These two phenomena make the bottom surface of electrode and workpiece distort. As machining depth increases, the distorted shape of the electrode approaches hemisphere. This process is affected by both capacitance and the size of electrode. By using a smaller electrode than the desired cavity size and appropriate tool movement, bottom shape distortion can be prevented.

Characterization of Pt Bottom Electrode Deposited on Sputtered-Ru/polysilicon by Metalorganic Chemical Vapor Deposition (유기금속 화학증착법에 의해 Sputtered-Ru/Polysilicon 위에 증착된 Pt 전극의 특성)

  • Choe, Eun-Seok;Yang, Jeong-Hwan;Yun, Sun-Gil
    • Korean Journal of Materials Research
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    • v.9 no.4
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    • pp.368-372
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    • 1999
  • The suggested electrode structure of MOCVD-Pt/sputtered-Ru/polysilicon has an excellent adhesion with increasing annealing temperatures and shows a stable electrode structure up to $600^{\circ}C$. However, the ruthenium used for barrier layer increased the roughness of platinum bottom electrodes because ruthenium diffused through the Pt bottom electrode and reacted with oxygen during the annealing above $700^{\circ}C$. The surface roughness increased the resistivity of Pt bottom electrodes. The resistivity of samples annealed at $600^{\circ}C$ was about $13\mu$Ω.cm. The electrode structure was possible to apply for ferroelectric thin film integration of semiconductor memory devices.

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Top-emission Electroluminescent Devices based on Ga-doped ZnO Electrodes (Ga-doped ZnO 투명전극을 적용한 교류무기전계발광소자 특성 연구)

  • Lee, Wun Ho;Jang, Won Tae;Kim, Jong Su;Lee, Sang Nam
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.2
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    • pp.44-48
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    • 2017
  • We explain optical and electrical properties of top and bottom-emission structured alternating-current powder electroluminescent devices (ACPELDs) with Ga-doped ZnO(GZO) transparent electrode. The top-emission ACPELDs were layered as the metal electrode/dielectric layer/emission layer/top transparent electrode and the bottom-emission ACPELDs were structured as the bottom transparent electrode/emission layer/dielectric layer/metal electrode. The yellow-emitting ZnS:Mn, Cu phosphor and the barium titanate dielectric layers were layered through the screen printing method. The GZO transparent electrode was deposited by the sputtering, its sheet resistivity is $275{\Omega}/{\Box}$. The transparency at the yellow EL peak was 98 % for GZO. Regardless of EL structures, EL spectra of ACPELDs were exponentially increased with increasing voltages and they were linearly increased with increasing frequencies. It suggests that the EL mechanism was attributed to the impact ionization by charges injected from the interface between emitting phosphor layer and the transparent electrode. The top-emission structure obtained higher EL intensity than the bottom-structure. In addition, charge densities for sinusoidal applied voltages were measured through Sawyer-Tower method.

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Spin Signals in Lateral Spin Valves with Double Nonmagnetic Bottom Electrodes

  • Lee, B.C.
    • Journal of Magnetics
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    • v.13 no.3
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    • pp.81-84
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    • 2008
  • Spin injection and detection in lateral spin valves with double nonmagnetic bottom electrodes are investigated theoretically. Spin-polarized current injected from a magnetic electrode is split to two bottom electrodes, and nonlocal spin signals between the other magnetic electrode and the nonmagnetic electrodes are calculated from drift-diffusion equations. It is shown that the spin signal is approximately proportional to the associated current in the electrode.

Characteristics of IZO/Ag/IZO Multilayer Electrode Grown by Roll-to-roll Sputtering for Touch Screen Panel

  • Cho, Chung-Ki;Bae, Jin-Ho;Kim, Han-Ki
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.125-125
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    • 2011
  • In this study, we investigated the electrical, optical, structural, and surface properties of indium zinc oxide (IZO)/Ag/IZO multilayer electrode grown by specially designed roll-to-roll sputtering system using the flexible substrate. By the continuous roll-to-roll sputtering of the bottom IZO, Ag, and top IZO layers at room temperature, they were able to fabricate a high quality IZO/Ag/IZO multilayer electrode. At optimized conditions, the bottom IZO layer (40 nm) was deposited on a flexible substrate. After deposition of the Bottom IZO layer, Ag layer was deposited onto the bottom IZO film as a function of DC power (200~500 W). Subsequently, the top IZO layer was deposited onto the Ag layer at identical deposition conditions to the bottom IZO layer (40 nm). We investigated the characteristics of IZO/Ag/IZO multilayer electrode as a function of Ag thickness. It was found that the electrical and optical properties of IZO/Ag/IZO multilayer electrode was mainly affected thickness of the Ag layer at optimized condition. In case of IZO/Ag/IZO multilayer electrode with the Ag power (350W), it exhibited a low sheet resistance of 7.1 ohm/square and a high transparency of 86.4%. Furthermore, we fabricated the touch screen panel using the IZO/Ag/IZO multilayer electrode, which demonstrate the possibility of the IZO/Ag/IZO multilayer electrode grown by roll-to-roll sputtering system as a transparent conducting layer in the touch screen panel.

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Characteristics of PZT thin films with varying the bottom-electrodes and buffer layer (PZT 박막제조시 하부전극과 buffer층에 따른 박막특성에 관한 연구)

  • 이희수;오근호
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.2
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    • pp.177-184
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    • 1996
  • We adopted the $Pt/SiO_{2}/Si$ and the $Ir/SiO_{2}/Si$ substrates of which buffer layer is $PbTiO_{3}$ to improve electrode and interfacial properties of PZT thin film deposited by reactive sputtering method using metal target in this study. We got PZT thin film to have highly oriented(100) structure and good crystallinity using buffer layer in Pt bottom-electrode, though randomly oriented PZT thin film was obtained without buffer layer. Although great improvement of PZT phase formation on Ir bottom-electrode with buffer layer was not observed, we observed the increase of remennant polarization and the decrease of coercive field compared with properties of PZT thin films on the Pt bottom-electrode. So we got the results of the increase of dielectric constant using buffer layer on fabrication of PZT thin film and the better dielectric properties in PZT thin film using Ir bottom-electrode compared with that using Pt bottom-electrode.

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Fatigue Characteristics of PZT Thin Films Deposited by ECR-PECVD

  • Chung, Su-Ock;Lee, Won-Jong
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.4
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    • pp.177-185
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    • 2005
  • Fatigue characteristics of lead zirconate titanate (PZT) films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) were investigated. The fatigue characteristics were investigated with respect to PZT film thickness, domain structure, fatigue pulse height, temperature, electrode materials and electrode configurations. The used top and bottom electrode materials were Pt and $RuO_2$. In the fatigue characteristics with fatigue pulse height and PZT film thickness, the fatigue rates are independent of the applied fatigue pulse height at the electric field regions to saturate the P-E hysteresis and polarization $(P^*,\;P^A)$ characteristics. The unipolar and bipolar fatigue characteristics of PZT capacitors with four different electrode configurations $(Pt//Pt,\;Pt//RuO_2,\;RuO_2//Pt,\;and\;RuO_2//RuO_2)$ were also investigated. The polarization-shifts during the unipolar fatigue and the temperature dependence of fatigue rate suggest that the migration of charged defects should not be expected in our CVD-PZT films. It seems that the polarization degradations are attributed to the formation of charged defects only at the Pt/PZT interface during the domain switching. The charged defects pin the domain wall at the vicinity of Pt/PZT interface. When the top and bottom electrode configurations are of asymmetric $(Pt//RuO_2,\;RuO_2//Pt)$, the internal fields can be generated by the difference of charged defect densities between top and bottom interfaces.

The Structural and Electrical Properties of NiCr Alloy for the Bottom Electrode of High Dielectric(Ba,Sr)Ti O3(BST) Thin Films

  • Lee, Eung-Min;Yoon, Soon-Gil
    • Transactions on Electrical and Electronic Materials
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    • v.4 no.1
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    • pp.15-20
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    • 2003
  • NiCr alloys are prepared onto poly-Si/ $SiO_2$/Si substrates to replace Pt bottom electrode with a new one for integration of high dielectric constant materials. Alloys deposited at Ni and Cr power of 40 and 40 W showed optimum properties in the composition of N $i_{1.6}$C $r_{1.0}$. The grain size of films increases with increasing deposition temperature. The films deposited at 50$0^{\circ}C$ showed a severe agglomeration due to homogeneous nucleation. The NiCr alloys from the rms roughness and resistivity data showed a thermal stability independent of increasing annealing temperature. The 80 nm thick BST films deposited onto N $i_{1.6}$C $r_{1.0}$/poly-Si showed a dielectric constant of 280 and a dissipation factor of about 5 % at 100 kHz. The leakage current density of as-deposited BST films was about 5$\times$10$^{-7}$ A/$\textrm{cm}^2$ at an applied voltage of 1 V. The NiCr alloys are possible to replace Pt bottom electrode with new one to integrate f3r high dielectric constant materials.terials.