• 소성∙가공
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• 제31권4호
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• pp.179-185
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• 2022

The influence of post-roll bonding heat treatment conditions such as temperature and time on the variation in the diffusion layer, generated at the bonding interface and the subsequent mechanical properties of the roll-bonded Ti grade 1/Al1050/Ti grade 1 sheets, was systematically investigated. The intermetallic compound (IMC) phase generated by post heat treatment conditions adopted in this study was obviously indexed as monolithic TiAl₃. Whereas the thickness of IMC layer generated by annealing at 500 ℃ was approximately 100 nm scale, it drastically increased above 1.5 ㎛ when annealed at 600 ℃. Uniaxial tensile and peel tests were then performed to compare mechanical properties. As a result, the bonding strength drastically increased above 7.9 N/mm by annealing at 600 ℃, which implies that proper annealing condition was a prerequisite, to improving interface bonding strength as well as global elongation properties for Ti/Al/Ti 3-ply sheet.

• Journal of the Korean Wood Science and Technology
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• 제43권5호
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• pp.682-690
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• 2015

The bonding performance of two types of wood adhesives, namely phenol-resorcinol-formaldehyde (PRF) resin and melamine-urea-formaldehyde (MUF) resin for glued laminated timber manufactured by high frequency (HF) heating was evaluated. The HF heating system consists of HF oscillator with dielectric heating system for curing adhesives, and hydraulic press system for clamping glued laminated timber. The designed frequency and output power of the HF system was as 5 MHz and 60 kW, respectively. To verify dielectric heating mechanism under HF oscillation, the heat loss factors of laminae and adhesives were measured. The results show that it is possible to selectively heat adhesives for their curing due to the remarkably higher loss factor of the adhesives than those of wood laminae. The temperature of adhesive in the bonding line reached up to the set temperature within a few seconds by high frequency oscillating, which advanced the curing of adhesive afterwards. The bonding performance, such as shear strength of bonding line, water soaking delamination, and boiling water soaking delamination of PRF resin met the requirement of Korean Standard (KS), however the MUF resin did not meet the KS requirement of boiling water soaking delamination. These results indicate that the HF heating system is successful to manufacture glued laminated timbers with PRF resins to meet the bonding requirements.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• 마이크로전자및패키징학회지
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• 제28권3호
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• pp.9-15
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• 2021

최근 반도체 소자의 소형화는 물리적 한계에 봉착했으며, 이를 극복하기 위한 방법 중 하나로 반도체 소자를 수직으로 쌓는 3D 패키징이 활발하게 개발되었다. 3D 패키징은 TSV, 웨이퍼 연삭, 본딩의 단위공정이 필요하며, 성능향상과 미세피치를 위해서 구리 본딩이 매우 중요하게 대두되고 있다. 본 연구에서는 대기중에서의 구리 표면의 산화방지와 저온 구리 본딩에 티타늄 나노 박막이 미치는 영향을 조사하였다. 상온과 200℃ 사이의 낮은 온도 범위에서 티타늄이 구리로 확산되는 속도가 구리가 티타늄으로 확산되는 속도보다 빠르게 나타났고, 이는 티타늄 나노 박막이 저온 구리 본딩에 효과적임을 보여준다. 12 nm 티타늄 박막은 구리 표면 위에 균일하게 증착되었고, 표면거칠기(R_q)를 4.1 nm에서 3.2 nm로 낮추었다. 티타늄 나노 박막을 이용한 구리 본딩은 200℃에서 1 시간 동안 진행하였고, 이후 동일한 온도와 시간 동안 열처리를 하였다. 본딩 이후 측정된 평균 전단강도는 13.2 MPa이었다.

• Corrosion Science and Technology
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• 제7권1호
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• pp.50-60
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• 2008

The majority of the described experimental results deal with relatively pure aluminium. Variations were made in the pretreatment of the aluminum substrates and an investigation was performed on the resulting changes in oxide layer composition and chemistry. Subsequently, the bonding behavior of the surfaces was investigated by using model adhesion molecules. These molecules were chosen to represent the bonding functionality of an organic polymer. They were applied onto the pretreated surfaces as a monolayer and the bonding behavior was studied using infrared reflection absorption spectroscopy. A direct and clear relation was found between the hydroxyl fraction on the oxide surfaces and the amount of molecules that subsequently bonded to the surface. Moreover, it was found that most bonds between the oxide surface and organic functional groups are not stable in the presence of water. The best performance was obtained using molecules, which are capable of chemisorption with the oxide surface. Finally, it was found that freshly prepared relatively pure aluminum substrates, which are left in air, rapidly lose their bonding capacity towards organic functional groups. This can be attributed to the adsorption of contamination and water to the oxide surface. In addition the adhesion of a typical epoxy-coated aluminum system was investigated during exposure to water at different temperatures. The coating was found to quite rapidly lose its adhesion upon exposure to water. This rapid loss of adhesion corresponds well with the data where it was demonstrated that the studied epoxy coating only bonds through physisorptive hydrogen bonding, these bonds not being stable in the presence of water. After the initial loss the adhesion of the coating was however found to recover again and even exceeded the adhesion prior to exposure. The improvement could be ascribed to the growth of a thin oxyhydroxide layer on the aluminum substrate, which forms a new, water-stable and stronger bond with the epoxy coating. Two routes for improvement of adhesion are finally decribed including an interphasial polymeric thin layer and a treatment in boiling water of the substrate before coating takes place. The adhesion properties were finely also studied as a function of the Mg content of the alloys. It was shown that an enrichment of Mg in the oxide could take place when Mg containing alloys are heat-treated. It is expected that for these alloys the (hydr)oxide fraction also depends on the pre-treatment and on the distribution of magnesium as compared to the aluminium hydroxides, with a direct impact on adhesive properties.

• International Journal of Automotive Technology
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• 제7권5호
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• pp.565-570
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• 2006

The development of a light-weight vehicle is in great demand for enhancement of fule efficiency and dynamic performance. The vehicle weight can be reduced effectively by using lightweight materials such as aluminum and magnesium. However, if such materials are used in vehicles, there are often instances when different materials such as aluminum and steel need to be joined to each other. The conventional joining method, namely resistance spot welding, cannot be used in joining different materials. Self-piercing rivet(SPR) and adhesive bonding, however, are good alternatives to resistance spot welding. This paper is concerned with the crushing test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding. Various parameters of crashworthiness are analyzed and evaluated. Based on these results, the applicability of SPR and adhesive bonding are proposed as an alternative to resistance spot welding.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.828-831
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• 2001

A simple and versatile method of manufacturing semiconductor devices with pn-junctions used the silicon direct bonding technology with simultaneous impurity diffusion is suggested . Formation of p- or n- type layers was tried during the bonding procedure by attaching two wafers in the aqueous solutions of Al(NO$_3$)$_3$, Ga(NO$_3$)$_3$, HBO$_3$, or H$_3$PO$_4$. An essential improvement of bonding interface structural quality was detected and a model for the explanation is suggested. Diode, Dynistor, and BGGTO structures were fabricated and examined. Their switching characteristics are presented.

• 한국공작기계학회논문집
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• 제17권1호
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• pp.120-125
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• 2008

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.

• 대한치과기공학회지
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• 제30권2호
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• pp.71-77
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• 2008

Acrylic resin has been widely used for dental care since it requires relatively simple equipment for treatment and less time and cost are needed to make it and, furthermore, proper strength, dimensional stability as well as durability are ensured after treatment. A survey of denture users showed, however, that more than 60% of dentures installed need repair each year, $22{\sim}30%$ of which are due to falling out of teeth. This study is aimed at exploring the means to increase bonding strength of denture by reducing the causes for falling out of teeth during the processing of dentures. For this aim, the bonding strength of dentures was compares and analyzed before and after the glazed surface of teeth contacting denture was eliminated. From the analysis, it was revealed that there was a difference of 4.3MPa in average in bonding strength between 20MPa for the glazed surface not eliminated and 24.3MPa for the glazed surface eliminated.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.