• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.238-243
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• 2013

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

• The Journal of Advanced Prosthodontics
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• v.6 no.3
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• pp.151-156
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• 2014

PURPOSE. To investigate the microtensile bond strength between two all-ceramic systems; lithium disilicate glass ceramic and zirconia core ceramics bonded with their corresponding glass veneers. MATERIALS AND METHODS. Blocks of core ceramics (IPS e.max$^{(R)}$ Press and Lava$^{TM}$ Frame) were fabricated and veneered with their corresponding glass veneers. The bilayered blocks were cut into microbars; 8 mm in length and $1mm^2$ in cross-sectional area (n = 30/group). Additionally, monolithic microbars of these two veneers (IPS e.max$^{(R)}$ Ceram and LavaTM Ceram; n = 30/group) were also prepared. The obtained microbars were tested in tension until fracture, and the fracture surfaces of the microbars were examined with fluorescent black light and scanning electron microscope (SEM) to identify the mode of failure. One-way ANOVA and the Dunnett's T3 test were performed to determine significant differences of the mean microtensile bond strength at a significance level of 0.05. RESULTS. The mean microtensile bond strength of IPS e.max$^{(R)}$ Press/IPS e.max$^{(R)}$ Ceram ($43.40{\pm}5.51$ MPa) was significantly greater than that of Lava$^{TM}$ Frame/Lava$^{TM}$ Ceram ($31.71{\pm}7.03$ MPa)(P<.001). Fluorescent black light and SEM analysis showed that most of the tested microbars failed cohesively in the veneer layer. Furthermore, the bond strength of Lava$^{TM}$ Frame/Lava$^{TM}$ Ceram was comparable to the tensile strength of monolithic glass veneer of Lava$^{TM}$ Ceram, while the bond strength of bilayered IPS e.max$^{(R)}$ Press/IPS e.max$^{(R)}$ Ceram was significantly greater than tensile strength of monolithic IPS e.max$^{(R)}$ Ceram. CONCLUSION. Because fracture site occurred mostly in the glass veneer and most failures were away from the interfacial zone, microtensile bond test may not be a suitable test for bonding integrity. Fracture mechanics approach such as fracture toughness of the interface may be more appropriate to represent the bonding quality between two materials.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.124-134
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• 1994

The shade of restorative materials is very important for successful restoration esthetically harmonized with the natural tooth. The purpose of this study was to evaluate the color stability and the opacity change of conventional chemical setting and visible light curing glass-ionomer cements for restorative esthetic filling. Specimens of each brand (GC Fuji II and Fuji II LC) were uniformly prepared and divided into three groups: In group l(control group), the specimens received no surface treatment; in group 2, the specimens were coated with varnish and the excess gently blown off; and in group 3. the specimens were coated with light-cured bonding resin and irradiated by a visible light curing unit for 20 seconds on both sides. All specimens were stored in distilled water at $37^{\circ}C$ and checked after for 24 hours. 2 months. 4 months, 6 months. and 8 months. The color characteristics($L^*,\;a^*,\;b^*$) and the opacity(Y%) of all the samples were measured by a spectrocolorimeter and the total color differences(${\Delta}E^*$) and opacity changes(${\Delta}Y%$) were computed. The following results were obtained : 1. The total tolor differences in all groups increased with time. 2. The total color differences of the LC groups after immersion for 8 months in distilled water at $37^{\circ}C$ were lower than those of GC groups(p<0.01), and the total color differences of the varnish or the light-cured bonding resin coated groups were lower than those of the control group with glass-ionomer cements which had no surface treatment(p<0.01). 3. In all groups the translucency decreased with time. 4. In the control group and the varnish coating group. the opacity changes of the GC groups were lower than those of the LC groups(p<0.01) and in the light-cured bonding resin coated group, there was no significant difference between the GC group and the LC group. 5. The opacity changes of the varnish or the light-cured bonding resin coated groups were lower than those of the control group(p<0.01). These results suggest that color change and opacity of conventional chemical setting and light cured glass-ionomer cement were increased with time, and the color changes and the opacity changes of a control group after immersion for 8 months in distilled water at $37^{\circ}C$ were greater than those of the varnish or the light-cured bonding resin coated groups.

• Journal of Powder Materials
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• v.15 no.4
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• pp.297-301
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• 2008

The Ni-based bulk metallic glass matrix composites were fabricated by spark plasma sintering of mixture of gas-atomized metallic glass powders and ductile brass powders. The successful consolidation of metallic glass matrix composite was achieved by strong bonding between metallic glass powders due to viscous flow deformation and lower stress of ductile brass powders in the supercooled liquid state during spark plasma sintering. The composite shows some macroscopic plasticity after yielding, which was obtained by introducing a ductile second brass phase in the Ni-based metallic glass matrix.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.2
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• pp.61-66
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• 2000

In this paper, we discuss the machining characteristics of HDD glass. Glass is now being used globally as a data storage device, Such glasses are usually machined by lapping by this technique requires a long machining time, resulting in low productivity, For this reason, we examine the possibility of EILD grinding in HDD glass workpieces, A move to ELID grinding may result in substantial cost reduction. Our purpose is to investigate the grinding characteristics of HDD glass in ELID grinding. The bonding materials for fixing the abrasives of cast iron, cobalt and bronze are applied, and grinding conditions such as rotation speed and feeding are varied. Results show that with the use of ELID, mirror surfaces can be achieved with high efficiency.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.9
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• pp.488-493
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• 2004

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 $\mu\textrm{m}$ and 100 $\mu\textrm{m}$ respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.21-27
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• 2010

The effect of COG bonding parameters, especially the bonding temperature, on the bonding quality and reliability was investigated in this paper. We measured the bubble area formed in the ACF resin during the bonding process and tried to investigate the relationship between bubble area and bonding peel strength. 85/85 test which exposes a sample to a 85% humidity and $85^{\circ}C$ temperature condition was also carried out. The bubble area was dramatically increased under ~$10^{\circ}C$ lower than recommended bonding temperature. The bubble area formed at the edge of IC chip was larger than the other parts of IC chip. But the peel strength was not associated with the bubble area. High temperature and humid condition made the bubble area larger, but we could not find clear trend of change in the peel strength.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1879-1884
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• 2014

Recently, the micro bonding technology comes into the spotlight as the miniaturization of the electronic product. The micro bonding technique can classify by way of laser welding and ultrasonic bonding and etc. However, the research on the micro bonding is much lacks. In this paper, carried out the cooling analysis of the 60 [kHz] ultrasonic bonding equipment to know heat effect of the piezoelectric element when the ultrasonic bonding equipment was operated. The ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the 60 [kHz] ultrasonic bonding equipment was done. We carried out the bonding for improving bonding strength to using the silver paste. air thightness of bonding surface was confirmed by analysis of bonding interfaces.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.315-321
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• 2005

Chip-on-glass technology to attach IC chip directly on the glass substrate of flat panel display was studied by using induction heating body in AC magnetic field. With applying magnetic field of 230 Oe at 14 kHz, the temperature of an induction heating body made with Cu electrodeposited film of 5 mm${\times}$5 mm size and $600{\mu}m$ thickness reached to $250^{\circ}C$ within 60 seconds. However, the temperature of the glass substrate was maintained below $100^{\circ}C$ at a distance larger than 2 mm from the Cu induction heating body. COG bonding was successfully accomplished with reflow of Sn-3.5Ag solder bumps by applying magnetic field of 230 Oe at 14 kHz for 120 seconds to a Cu induction heating body of 5mm${\times}$5mm size and $600{\mu}m$ thickness.