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The Effect of Bubble Generated during COG Bonding on the Joint Reliability  

Choi, Eun-Soo (Department of Mechanical system Engineering, Korea Polytechnic Univ.)
Yun, Won-Soo (Department of Mechanical Engineering, Korea Polytechnic Univ.)
Jeong, Young-Hun (Department of Mechanical Engineering, Korea Polytechnic Univ.)
Kim, Bo-Sun (LG Display Co., Ltd)
Jin, Song-Wan (Department of Mechanical Engineering, Korea Polytechnic Univ.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.27, no.7, 2010 , pp. 21-27 More about this Journal
Abstract
The effect of COG bonding parameters, especially the bonding temperature, on the bonding quality and reliability was investigated in this paper. We measured the bubble area formed in the ACF resin during the bonding process and tried to investigate the relationship between bubble area and bonding peel strength. 85/85 test which exposes a sample to a 85% humidity and $85^{\circ}C$ temperature condition was also carried out. The bubble area was dramatically increased under ~$10^{\circ}C$ lower than recommended bonding temperature. The bubble area formed at the edge of IC chip was larger than the other parts of IC chip. But the peel strength was not associated with the bubble area. High temperature and humid condition made the bubble area larger, but we could not find clear trend of change in the peel strength.
Keywords
COG Bonding; ACF; Peel Strength; Bubble;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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1 Yim, M.-J., Hwang, J. and Paik, K.-W., "Anisotropic Conductive Films (ACFs) for Ultra-Fine Pitch Chip- On-Glass (COG) applications," International Journal of Adhesion & Adhesives, Vol. 27, No. 1, pp. 77-84, 2007.   DOI   ScienceOn
2 Yim, M.-J. and Paik, K.-W., "The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF)," IEEE Transactions on Advanced Packaging, Vol. 22, No. 2, pp. 166-173, 1999.   DOI   ScienceOn
3 Wu, Y. P., Alam, M. O., Chan, Y. C. and Wu, B. Y., "Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages," Microelectronics Reliability, Vol. 44, No. 2, pp. 295- 302, 2004.   DOI   ScienceOn
4 Kweon, S. H., Kwon, S. R., Ko, D. J., Park, K. S. and Yang, S. H., "The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface," Journal of the Korean Society for Precision Engineering, Vol. 25, No. 6, pp. 7-12, 2008.   과학기술학회마을
5 Yin, C. Y., Alam, M. O., Chan, Y. C., Bailey, C. and Lu, H., "The Effects of Reflow Process on the Contact Resistance and Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications," Microelectronics Reliability, Vol. 43, No. 4, pp. 625-633, 2003.   DOI   ScienceOn
6 Kim, H.-J., "Study on Bubble Formation in Rigid- Flexible Substrates Bonding using Anisotropic Conductive Films (ACFs) and Their Effects on the ACF Joint Reliability," Ph.D. Thesis, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 2006.
7 Jung, S.-W., "Optimization of COG Bonding Process for LCD Panel Driver IC," Master's Thesis, Department of Mechanical System Engineering, Korea Polytechnic University, 2010.
8 Kwon, W.-S. and Paik, K.-W., "Fundamental Understanding of ACF Conduction Establishment with Emphasis on the Thermal and Mechanical Analysis," International Journal of Adhesion & Adhesives, Vol. 24, No. 2, pp. 135-142, 2004.   DOI   ScienceOn