The Transactions of the Korean Institute of Electrical Engineers C (대한전기학회논문지:전기물성ㆍ응용부문C)

The Korean Institute of Electrical Engineers (대한전기학회)
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Fabrication of Copper Electrode Array and Test of Electrochemical Discharge Machining for Micro Machining of Glass

유리의 미세 가공을 위한 구리 전극군의 제작과 전기 화학 방전 가공 시험

  • 정주명 (아주대학교 전자공학과) ;
  • 심우영 (아주대학교 전자공학) ;
  • 정옥찬 (아주대학교 대학원 전자공학) ;
  • 양상식 (아주대학교 전자공학과)
  • Published : 2004.09.01
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Abstract

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 $\mu\textrm{m}$ and 100 $\mu\textrm{m}$ respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon.

Keywords

References

  1. C. S. Taylor, 'The anode effect', 47th General Meeting of the American Electrochemical Society, Niagara Falls, April 23, 1925
  2. H. H. Kellogg, 'Anode effect in aqueous electrolysis,' Journal of the Electrochemical Society, vol. 97, pp. 133-142, 1950 https://doi.org/10.1149/1.2777980
  3. S. Shoji and M. Esashi, 'Photoetching and electrochemical discharge drilling of pyrex glass', Technical Digest of the Sensor Symposium, pp. 27-30, 1990
  4. I. Basak, and A. Ghosh, 'Mechanism of spark generation during electrochemical discharge machining: a theoretical model and experimental verification,' Journal of Materials Processing Technology, vol. 62, pp. 46-53, 1996 https://doi.org/10.1016/0924-0136(95)02202-3
  5. I. Basak and A. Ghosh, 'Mechanism of material removal in electrochemical discharge machining: atheoretical model and experimental verification,' Journal of Materials Processing Technology, vol. 71, pp. 350-359, 1997 https://doi.org/10.1016/S0924-0136(97)00097-6
  6. 정옥찬, 양의혁, 양상식, '유리의 미세 가공을 위한 전기화학 방전 가공기술에 관한 실험적 연구,' 대한전기학회 논문지, 45권, 10호, pp. 1374-1379, 1996
  7. 정귀상, 홍석우, '전기화학적 방전가공법에 의한 #7740 파이렉스 유리기판의 미세가공에 관한 연구,' 전기전자 재료학회 논문지, 12권, 6호, pp. 486-496, 1999
  8. C. T. Yang, S. S. Ho and B. H. Yan, 'Micro hole machining of borosilicate glass through electrochemical discharge machining(ECDM),' Key Engineering Materials, vol. 196, pp. 149-166, 2001 https://doi.org/10.4028/www.scientific.net/KEM.196.149
  9. Kenichi Takahata and Yogesh B. Gianchandani, 'Batch mode micro-electro-discharge Machining', Journal of Microelectromechanical Systems, vol. 11, no. 2, pp. 102-110, 2002 https://doi.org/10.1109/84.993444
  10. F. G. Tseng and C. S. Yu, 'High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photoresist', Sensors and Actuators A, vol. 97-98, pp. 764-770, 2002 https://doi.org/10.1016/S0924-4247(02)00018-3