• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• Journal of Korean Society for Quality Management
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• v.49 no.3
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• pp.255-268
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• 2021

Purpose: We sought to understand why a high-speed rotating projectile featuring a fuze-and-body assembly sometimes exhibited airburst, and we intended to improve the flight stability by eliminating airburst. Methods: We performed characteristic factor analysis, structural mechanics modeling, and dynamic modeling and simulation; and we scheduled firing tests to discover the cause of airburst. We used a step-by-step procedure to analyze the reliability function for selecting the bonding force standard that prevents airburst. Results: The 00MM high-speed rotating projectile features a fuze bonded to a body assembly; the bonding sometimes can break on firing. The resulting contact force, vibration and roll damping during flight generated yaw. Flight became unstable; fuze operation triggered an airburst. Our reliability test improved the bonding force standard (the force was increased). When the bonding force was at least the minimum required, a firing test revealed that airburst/flight instability disappeared. Conclusion: Analysis and identification of the causes of flight instability and airburst render military training safer and enhance combat power. Ammunition must perform as designed. Our method can be used to set standards that improve the performances of similar types of ammunition.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.18-21
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• 2003

The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• International Journal of Naval Architecture and Ocean Engineering
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• v.13 no.1
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• pp.136-146
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• 2021

This paper aims to numerically estimate the dynamic ice load on a conical structure. The Discrete Element Method (DEM) is employed to model the level ice as the assembly of numerous spherical particles. To mimic the realistic fracture mechanism of ice, the parallel bonding method is introduced. Cases with four different ice drifting velocities are considered in time domain. For validation, the statistics of time-varying ice forces and their frequencies obtained by numerical simulations are extensively compared against the physical model-test results. Ice properties are directly adopted from the targeted experimental test set up. The additional parameters for DEM simulations are systematically determined by a numerical three-point bending test. The findings reveal that the numerical simulation estimates the dynamic ice force in a reasonably acceptable range and its results agree well with experimental data.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.250-253
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• 2001

Mechanical properties of gold bonding wire for VLSI packaging have been studied. The diameters of gold wires are about 20-30 micrometer and fracture loads are 8-20 gram force. The elastic modulus, yield strength, fracture strength and elongation properties have been evaluated by micro-tensile test method. This work discusses for an appropriate selection of micro-force testing system and grip design in mim testing. The best method to determine gauge length of wire and to measure tensile properties has been proposed. The mechanical properties such as strength and elastic modulus of current gold bonding wire are higher than pure those of gold wire.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1079-1083
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• 1998

In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.241-247
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• 1992

The direct bonding of Cu to $Al_2O_3$, employing the $Cu-Cu_2$O eutectic skin melt, is investigated. The bonding force and interface structure of samples prepared by oxidation at $1015^{\circ}C$ in $1.5{\times}10^{-1}$torr followed by bonding at 107$5^{\circ}C$ under $10_{-3}$ torr vacuum have been studied using peeling test, SEM, EDS and XRD. It has been found that the optimal strength is obtained for 3 minutes of oxidation while the adhesion force is decreased with oxidation shorter or longer than 3 minutes. The rupture occured at alumina-eutectic interface. Fractured surface of $Al_2O_3$covered with $Cu_2$O nodules pulled out of the Cu indicates that bonding strength is governed by $Cu-Cu_2$O interface and not by $Cu_2$O-A$l_2O_3$interface. The bonding force is slightly increased with bonding time and the reaction phases of CuA$l_2O_4$and $CuAlO_2$are formed at interface during the bonding.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• Proceedings of the Korea Concrete Institute Conference
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• 2005.05a
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• pp.287-290
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• 2005

CFRP strips manufactured in factory are produced normally with smaller width and larger thickness than CFRP sheets. By this reason, bonding force between CFRP strips and concrete substrate is not sufficient to sustain tensile force in CFRP strips. Therefore premature debonding failure cannot be avoided when strengthening is done by simply bonding the CFRP strips. The flexural strength of RC beam strengthened with CFRP strips must be calculated based on the effective strain considering debonding failure. This paper presents test results of an experimental study conducted to evaluate the flexural strength on RC beams strengthened with CFRP strips. 7 specimens were tested with respect to bond length and amount of CFRP strips. From the test results, it was indicated that the strain of the CFRP strips achieved at debonding failure can be decreased less than 6,000$\mu$ depending on the amount of CFRP strips.