• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1994.10a
• /
• pp.571-576
• /
• 1994

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. In order to improve the currently used wire bonding machine using ultrasonic energy, technical accumulation is needed steadily through development of exciting device of ultrasonic composed of piezoelectic vibrator and horn. This study investigates the design conditions affecting the dynamic characteristics through the theoretical and experimental analysis of piezoelectric vibrator and horn, The study conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. In theoretical model, the integrated modeling is conducted via a combination of dynamic identification of piezoelectric vibrator and theoretical analysis of horn. Hence comparison is made for theoretical and experimental results of the dynamic characteristics of the ultrasonic transducer composed of piezoelectric vibrator and horn. Form the results of this study we develop the design technique of ultrasonic transducer using dynamic characteristic analysis and propose the possibility of ultrasonic welding considering the optimal condition of the natural frequency and vibration mode of horn.

• Structural Engineering and Mechanics
• /
• v.78 no.3
• /
• pp.319-332
• /
• 2021

The wood-concrete composite is an interesting solution in the field of Civil Engineering to create high performance bending elements for bridges, as well as in the building construction for the design of wood concrete floor systems. The authors of this paper has been working for the past few years on the development of the bonding process as applied to wood-concrete composite structures. Contrary to conventional joining connectors, this assembling technique does ensure an almost perfect connection between wood and concrete. This paper presents a careful theoretical investigation into interfacial stresses at the level of the two interfaces in composite wooden beam- reinforced concrete slab strengthened by external bonding of prestressed composite plate under a uniformly distributed load. The model is based on equilibrium and deformations compatibility requirements in all parts of the strengthened composite beam, i.e., the wooden beam, RC slab, the CFRP plate and the adhesive layer. The theoretical predictions are compared with other existing solutions. This research is helpful for the understanding on mechanical behaviour of the interface and design of the CFRP- wooden-concrete hybrid structures.

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.23 no.1
• /
• pp.84-91
• /
• 2013

Ultrasonic flip-chip bonding needs a precise bonding tool which delivers ultrasonic energy into chip bumps effectively to use the selected resonance mode and frequency of the horn structure. The bonding tool is excited at the resonance frequency and the input and output ports should locate at the anti-nodal points of the resonance mode. In this study, we propose new design method with topology optimization for ultrasonic bonding tools. The SIMP(solid isotropic material with penalization) method is used to formulate topology optimization and OC(optimal criteria) algorithm is adopted for the update scheme. MAC(modal assurance criterion) tracking is used for the target frequency and mode. We fabricate two prototypes of ultrasonic tools which are based on 3D optimization models after reviewing 2D and 3D topology optimization results. The prototypes are satisfied with the ultrasonic frequency and vibration amplitude as the ultrasonic bonding tools.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.3
• /
• pp.9-15
• /
• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Proceedings of the Korea Concrete Institute Conference
• /
• 2001.05a
• /
• pp.69-74
• /
• 2001

Steel plate or fiber composite plate are mainly used in externally bonding method. Shear strengthening by externally bonding method is to confirm shear safety and to avoid brittle failure. In case of strengthening by externally bonding method, a failure of structure occurs frequently due to delamination between strengthening plate and concrete. Therefore, it is important to consider the delamination in the strengthening design. The objective of this study is to propose a modified shear strength evaluation by considering the delamination. The delamination criteria of strengthening plate is established by the ultimate strain and shear stress. And shear strength of RC beams is proposed in terms of the delamination criteria. The proposed shear strength is compared with test results and verified through the comparison.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.6 no.1
• /
• pp.143-150
• /
• 1998

The evaluation of joint fatigue strength of light weight materials for electrical vehicle body has been performed through single lap joint tests with the design parameters such as joint style, adherend, bonding overlap length and bonding thickness. Fatigue strength was evaluated through 5-Hz, tension-tension, load controlled test with the stress ratio zero value. It is experimentally observed that fatigue strength of joint increases for the increase of overlap length. The combinations of Al-Al and Al-FRP adherends show that fatigue strength of joint is hardly changed for the increase of bonding thickness, but FRP-FRP adherend specimen shows that fatigue strength of joint increases after decreases for the increase of bonding thickness. Al-Al adherend specimen has much higher fatigue length than Al-FRP and FRP-FRP adherend specimens. Riveting at adgesive bonded joint gives little effect on fatigue strength.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.860-864
• /
• 2003

Recently. use of compound semiconductor is widely increasing in the area of LED and RF device. In this study, wafer bonding module is designed and optimized to bond 6 inches device wafer and carrier wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Load spreader and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analyses show the designed mechanisms are very effective in performance improvement.

• Journal of the Korean Society for Precision Engineering
• /
• v.32 no.9
• /
• pp.799-805
• /
• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.5 no.2
• /
• pp.87-93
• /
• 1997

The bonding strength evaluation of light weight materials for electrical vehicle applications has been performed through single lap joint tests in which the design parameters such as fillet, joint style, adherend, bonding overlap length,bonding thickness, and environmental condition(soaking time in $25^{\circ}C$ water) are considered. It is experimentally oberved that lap shear strength of joint increases for higher fillet height, longer overlap length, and thinner bonding layer thickness. Al-Al adherend combination shows much higher lap shear strength than AL-FRP and FRP-FRP adherend combinations. Riveting at adhesive bonded joint of AL-AL adherend combination makes lap shear strength decrease. Effect of soaking time on lap shear strength is negligible.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.18 no.2
• /
• pp.102-107
• /
• 2019

The vehicle market has developed environment-friendly vehicles to comply with fuel economy regulations and exhaust regulations that have become stricter and stricter over time. Many studies have been conducted to improve the travel performance and fuel economy of environment-friendly vehicles, and vehicle manufacturers have been studying how to manufacture light-weight vehicles in order to improve the fuel economy of both existing vehicles and the newer environment-friendly vehicles. Exemplary light-weight vehicle technologies optimizes the design of the vehicle body structure, which is a vehicle weight-reducing method that modifies component shapes or layouts to optimize the structure of the vehicle. In addition, the new process technology uses new light-weight and very strong materials, and not typical materials, to manufacture light-weight vehicles. This study aims at the optimal design of vehicle body structures using multi-materials for the Fender-Apron, which is an important frame member for the external front side of a vehicle body, by conducting FEA (Finite Element Analysis) and multi-material bonding.