• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4378-4384
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.

• International Journal of Automotive Technology
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• v.6 no.6
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• pp.657-663
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• 2005

Recently, weight reduction of vehicles has been of great interest, and consequently the use of composite materials in the automotive industry is increasing every year. Composite sandwich panels which consist of two skins and core materials are replacing steels in automotive floor and door. The substitution of one material for another is accompanied by change of joining method, so that adhesive bonding has been popularly used for joining method of composite materials. In the case of adhesive bonding of composite materials, there could be loss in the joint strength by delamination of two faceplates or cracking on faceplate. Thus, it is necessary to prevent loss in the joint strength by designing the joint geometry. In the present paper, adhesive bonding of aluminum sandwich sheet was tried. For understanding joint behavior, studies on stresses in the single lap joint were reviewed and failure modes of composite material were analyzed. Strength tests on the single lap joint consisting of aluminum sandwich sheet and steel were performed and variation of the joint strength with the joint configuration was shown. Based on these results, design guide of adhesive bonding in aluminum sandwich sheet was suggested.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.803-808
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• 2002

A computer-aided alloy-designing technique to develop the insert metal for transient liquid phase (TLP) bonding was applied to high aluminum Ni-base superalloys. The main procedure of a mathematical programming method was to obtain the optimal chemical composition through rationally compromising the plural objective performances of insert metal by a grid-search which involved data estimation from the limited experimental data using interpolation method. The objective function Z which was introduced as an index of bonding performance of insert metal involved the melting point, hardness (strength), formability of brittle phases and void ratio (bonding defects) in bond layer as the evaluating factors. The contour maps of objective function Z were also obtained applying the interpolation method. The compositions of Ni-3.0%Cr-4.0%B-0.5%Ce (for ${\gamma}$/${\gamma}$/${\beta}$ type alloy) and Ni3.5%Cr-3.5%B-3%Ti (for ${\gamma}$/${\gamma}$ type alloy) which optimized the objective function were determined as insert metal. SEM observations revealed that the microstructure in bond layers using the newly developed insert metals indicated quite sound morphologies without forming microconstituents and voids. The creep rupture properties of both joints were much improved compared to a commercial insert metal of MBF-80 (Ni-15.5%Cr-3.7%B), and were fairly comparable to those of base metals.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.11
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• pp.38-45
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• 1996

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. Specially, the method utilizes the longitudinal vibration of ultrasonic transducer composed of piezoelectric vibrator and horn. This work investigates the design conditions affecting the dynamic characteristics through the theretical and experimental analysis. It conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. The integrated modeling is conducted via a combbination of dynamic identification of piezoelectric vibrator and theroretical analysis of horn. Then comparison is made for theroretical and experimental results of the dynamic characteristics of the ultrasonic transducer comprised of piezoelectric vibrator and horn. Form the results of the comparison we develop the design technique of ultrasonic transducer using dynamic characteristics analysis and propose the possibility of ultrasonic bonding considering the optimal conditions for the longitudinal vibration of ultrasonic transducer and other conditions.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.414-417
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• 2008

A lid & frame used as the shield of electromagnetic waves in cellular phones are composed of frame, which is welded at their electric circuits, and lid, of which debonding and joining are available from the frame. Typical lid & frame were mechanically bonded by contact between the embossing of lid and the piercing of frame Bonding force of this part have to allow us to detach the lid from frame for exchange or fix of the electric part and have to be high enough to protect the electric part from external impacts. This study is designed to estimate the effect of design variable of lid & frame on its debonding force. Estimations were performed by finite element method.

• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.144-149
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• 2007

The superplastic forming/diffusion bonding(SPF/DB) is widely used in the automotive and aerospace industry because it has great advantage to produce complex, light and strong parts. But the superplastic forming process requires much forming time and generates excessive thinning in the thickness distribution of formed part. It is necessary to minimize trial and error for SPF/DB Process. Finite element analysis using $L_{18}$ orthogonal may table of Taguchi method for 3-Sheet D/B process is carried out. Through the study, effect of process parameters, such as DH region size, thickness and friction coefficient, is evaluated and the optimum condition is derived.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.688-693
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• 2002

Adhesive bonding is becoming one of the popular joining techniques in metal industries, since it has some advantages over other techniques such as welding and diffusion bonding, e.g., any dissimilar metals are easily adhesive-bonded together. In this study, the experiments were carried out in order to provide the statistical data with strength evaluation methods: tension, shear and four-point bending tests for thermoplastic epoxy resin based adhesive-bonded metal joints. We should certificate on the probability of the adhesive strength that has the tendency of brittle fracture, the adhesive bonding strength between metals with thermoplastic adhesive has the best probability at four-point bending test. The strength testing method that has higher probability is four-point bending test, shear test and tensile test in order.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2006.04a
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• pp.836-840
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• 2006

Design optimization of layered plates bonding process is conducted to achieve high product quality by considering uncertainties in a manufacturing process. During the cooling process of the sequential sub-processes, different thermal expansion coefficients lead to residual stress and displacement. thus resulting in defects on the surface of the adherent. So robust process optimization is performed to minimize the residual stress mean and variation of the assembly while constraining the distortion as well as the instantaneous maximum stress to the allowable limits. In robust process optimization, the dimension reduction (DR) method is employed to quantify both reliability and quality of the layered plate bonding. Using this method. the average and standard deviation is estimated. Response surface is constructed using the statistical data obtained by the DRM for robust objectives and constraints. from which the optimum solution is obtained.

• Transactions of Materials Processing
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• v.18 no.3
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• pp.245-250
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• 2009

A lid & frame used as the shield of electromagnetic waves in cellular phones are composed of frame, which is welded at their electric circuits, and lid, of which debonding and joining are available from the frame. Typical lid & frame were mechanically bonded by contact between the embossing of lid and the piercing of frame. Bonding force of this part has to allow us to detach the lid from frame for exchange or fix of the electric part and have to be high enough to protect the electric part from external impacts. This study is designed to estimate the effect of design variables of lid & frame on its debonding force. Estimations were performed by finite element method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.5
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• pp.812-817
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• 2013

This study demonstrates the diffusion bonding process between a tungsten carbide shank (K30) and tungsten carbide (DX5) for micro WC-PCD tool fabrication. A type of nickel alloy was used as the filler met alto improve the bond ability between K30 and DX5. The bonding pressure, time, and surrounding conditions were kept constant. In particular, the normal pressure was controlled precisely under buckling analysis. Diffusion bonding was performed at various operation temperatures (1170-1770 K) by using a specially designed jig. The microstructure on the localized bonded surface was analyzed using scanning electron microscopy and optical microscopy. In the case of diffusion bonding of WCat 1370-1770K, the filler metal melted completely and diffused between the two base metals, and they were bonded more tightly on both sides than at temperatures below 1370 K. Our results demonstrated the importance of sensitive temperature dependence of diffusion bonding.