Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
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Estimation of Design Variables for Improving the Bonding Force of Lid & Frame for Cellular Phone

휴대폰용 리드 및 프레임의 접합력 향상을 위한 설계 변수 평가

  • 남기주 (부산대학교 대학원 정밀가공시스템공학) ;
  • 이정민 (한국국제대학교 자동차공학부) ;
  • 김병민 (부산대학교 기계공학부)
  • Published : 2009.06.01
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Abstract

A lid & frame used as the shield of electromagnetic waves in cellular phones are composed of frame, which is welded at their electric circuits, and lid, of which debonding and joining are available from the frame. Typical lid & frame were mechanically bonded by contact between the embossing of lid and the piercing of frame. Bonding force of this part has to allow us to detach the lid from frame for exchange or fix of the electric part and have to be high enough to protect the electric part from external impacts. This study is designed to estimate the effect of design variables of lid & frame on its debonding force. Estimations were performed by finite element method.

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References

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  1. Progressive Process Design of Integrated Part for Mobile Phone vol.20, pp.2, 2011, https://doi.org/10.5228/KSTP.2011.20.2.110