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http://dx.doi.org/10.7735/ksmte.2013.22.5.812

The Temperature Dependence of the Diffusion Bonding Between Tungsten Carbides for Micro WC-PCD Tool Fabrication  

Jeong, B.W. (Department of Advanced Parts and Materials Engineering, Chosun University)
Park, J.W. (Department of Mechanical Design Engineering, Chosun University)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.22, no.5, 2013 , pp. 812-817 More about this Journal
Abstract
This study demonstrates the diffusion bonding process between a tungsten carbide shank (K30) and tungsten carbide (DX5) for micro WC-PCD tool fabrication. A type of nickel alloy was used as the filler met alto improve the bond ability between K30 and DX5. The bonding pressure, time, and surrounding conditions were kept constant. In particular, the normal pressure was controlled precisely under buckling analysis. Diffusion bonding was performed at various operation temperatures (1170-1770 K) by using a specially designed jig. The microstructure on the localized bonded surface was analyzed using scanning electron microscopy and optical microscopy. In the case of diffusion bonding of WCat 1370-1770K, the filler metal melted completely and diffused between the two base metals, and they were bonded more tightly on both sides than at temperatures below 1370 K. Our results demonstrated the importance of sensitive temperature dependence of diffusion bonding.
Keywords
Diffusion bonding; Bonding temperature; Tungsten carbide; Filler metal; Melting temperature;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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