Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
권호 표지
DOI QR코드

DOI QR Code

The Temperature Dependence of the Diffusion Bonding Between Tungsten Carbides for Micro WC-PCD Tool Fabrication

초소형 초경 PCD Tool 제작을 위한 초경합금간 확산접합의 온도 의존성 연구

  • Jeong, B.W. (Department of Advanced Parts and Materials Engineering, Chosun University) ;
  • Park, J.W. (Department of Mechanical Design Engineering, Chosun University)
  • Received : 2013.05.25
  • Accepted : 2013.09.24
  • Published : 2013.10.15
Download PDF
⟨ Previous Next ⟩

Abstract

This study demonstrates the diffusion bonding process between a tungsten carbide shank (K30) and tungsten carbide (DX5) for micro WC-PCD tool fabrication. A type of nickel alloy was used as the filler met alto improve the bond ability between K30 and DX5. The bonding pressure, time, and surrounding conditions were kept constant. In particular, the normal pressure was controlled precisely under buckling analysis. Diffusion bonding was performed at various operation temperatures (1170-1770 K) by using a specially designed jig. The microstructure on the localized bonded surface was analyzed using scanning electron microscopy and optical microscopy. In the case of diffusion bonding of WCat 1370-1770K, the filler metal melted completely and diffused between the two base metals, and they were bonded more tightly on both sides than at temperatures below 1370 K. Our results demonstrated the importance of sensitive temperature dependence of diffusion bonding.

Keywords

References

  1. Heo, S. J., 2013, Wear Mechanism and Machinability of PCD Tool in Turning Tungsten Carbides, Journal of the Korean Society of Manufacturing Technology Engineers 22:1 85-91. https://doi.org/10.7735/ksmte.2013.22.1.85
  2. Kim G. H. 2002, Analysis of Characteristic Evaluation of Microdrilling for the Cemented Carbides Materials. Transactions of the Korean Society of Machine Tool Engineers. 11:6 52-59.
  3. Cho. S. H., Hwang. S. K., Park. W. K., Lee. O. S. 1994, Sintering Characteristics of WC-SiC-10Ni Hard Materials with TiC Addition. Journal of the Korean Inst. Of Met. & Mater. 32:7 786-791.
  4. Kang. C. Y. 1998, On the Transient Liquid Phase Diffusion Bonding. Journal of the Korean Welding Society. 7:6 12-24.
  5. Byng. I. K., Jung. H. S. 2000, The Study on Diffusion Bonding of Hard Metal to High Speed Steel. The Korean Welding and Joining Society. 317-319.
  6. Kwon. B. D., Lee. W. B., Kim. B. S., Hong. T. W., Shur. C. C., Jung. S. B. 2000, Joinability of Tool Steels by TLP Bonding. The Korean Welding and Joining Society. 12:4 439-444.
  7. Ravisanker. B., Krishnamoorthi. J., Ramakrishnan. S. S., Angelo. P. C. 2009, Diffusion bonding of SU 263. Journal of Materials Processing Technology. 209 2135-2144. https://doi.org/10.1016/j.jmatprotec.2008.05.015
  8. Bhanumuthy K, Schmid-Fetzer R. 1996, Solid-state reaction bonding of silicon carbide(HIPSiC) below $1000^{\circ}C$. Mater Sci Eng. 220 35-40. https://doi.org/10.1016/S0921-5093(96)10452-4
  9. ASSADI. H., SHIRZADI. A. A., WALLACH. E. R. 2001, Transient liquid phase diffusion bonding under a temperature gradient: Modelling of the interface morphology. Acta mater, 49 31-39. https://doi.org/10.1016/S1359-6454(00)00307-4
  10. Rusnaldy. 2001, Diffusion Bonding: An Advanced of Material Process. ROTASI. 3:1 23-27.

Cited by

  1. Tensile Strength Properties of the Diffusion Bonding Copula Shape for Micro PCD Tool Fabrication vol.14, pp.2, 2015, https://doi.org/10.14775/ksmpe.2015.14.2.025
  2. Bonding properties on diffusion bonding layer for micro PCD-WC tool fabrication vol.33, pp.8, 2013, https://doi.org/10.1007/s12206-019-0717-z