• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.12
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.10
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• pp.2008-2017
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• 2002

Joint structure of a transducer horn-holder assembly fur a wire bonder was examined through FEM contact analysis. A three dimensional modeling and analysis was carried out to survey the internal physics of this structure and to prove the accuracy of a computation compared to a measurement. After validation, a simple two dimensional model was built fur various parametric study considering the efficiency and speed of the computation. Several factors such as boundary conditions, a modeling boundary, mesh density and so on, were considered to obtain consistency with three dimensional analysis. An arc angle and a position of each holder boss were chosen as design parameters. A design of experiment was applied to find out an optimized design of the holder geometry. As a result, a guideline for holder boss design was suggested and main factors and their influence on stress concentration in the transducer horn were surveyed.

• Journal of Korean Academy of Nursing
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• v.47 no.2
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• pp.178-187
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• 2017

Purpose: The purposes of this study were to identify the relationships among perceived parental bonding, illness perception, and anxiety and to determine the influences of perceived parental bonding and illness perception on anxiety in adult patients with congenital heart diseases. Methods: In this study a descriptive correlational design with survey method was utilized. The participants were 143 adult patients with congenital heart disease being cared for in the cardiology out-patient clinic of A medical center. Data were collected using the Parental Bonding Instrument, Illness Perception Questionnaire Revised Scale, and Cardiac Anxiety Questionnaire Scale. Data were analyzed using descriptive statistics, independent t-test, one-way ANOVA, Pearson correlation analysis, and hierarchial regression analyses. Results: There showed significant positive relationships of anxiety with maternal overprotection, consequences, and personal control respectively. Among predictors, maternal overprotection (${\beta}=.45$), consequence (${\beta}=.26$), and personal control (${\beta}=-.03$) had statistically significant influence on anxiety. Conclusion: Nursing interventions to decrease maternal overprotection and negative consequence, and to enhance personal control are essential to decrease the anxiety of adult patients with congenital heart diseases.

• Journal of Sensor Science and Technology
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• v.16 no.1
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• pp.62-67
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• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.12 s.117
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• pp.1272-1278
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• 2006

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Bulletin of the Korean Chemical Society
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• v.28 no.12
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• pp.2454-2458
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• 2007

Exploring the basic concepts for the design of CO2-philic molecules is important due to the possibility for “green” chemistry in supercritical CO2 as substitute solvent systems. The Lewis acid-base interactions and C?H…O weak hydrogen bonding were suggested as two key factors for the solubility of CO2-philic molecules. We have performed high level quantum mechanical calculations for the van der Waals complexes of CO2 with trimethylphosphate and trimethylphosphine oxide, which have long been used for metal extractants in supercritical CO2 fluid. Structures and energies were calculated using the MP2/6-31+G(d) and recently developed multilevel methods. These studies indicate that the Lewis acid-base interactions have larger impact on the stability of structure than the C?H…O weak hydrogen bonding. The weak hydrogen bonds in trimethylphosphine oxide have an important role to the large supercritical CO2 solubility when a metal is bound to the oxygen atom of the P=O group. Trimethylphosphate has many Lewis acid-base interaction sites so that it can be dissolved into supercritical CO2 easily even when it has metal ion on the oxygen atom of the P=O group, which is indispensable for a good extractant.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• Steel and Composite Structures
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• v.24 no.6
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• pp.753-765
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• 2017

This paper aims to investigate the strength degradation of reinforced concrete piers wrapped with steel plates which corrode at the pier base by employing a three dimensional elasto-plastic finite element formulation. The prediction accuracy of the employed finite element analysis method is firstly verified by comparing the analytical results with test results. Then, a series of parametric studies is carried out to investigate the effects of steel plate's corrosion position along width direction, corrosion depth along plate thickness, corrosion range along width direction, and steel plate-concrete bonding degradation on the strength of the piers. It is observed that the strength degradation of the piers is closely related to steel plate's corrosion position, corrosion depth and corrosion range in the case of local corrosion on the webs. In contrast, when the base of flanges corrodes, the strength degradation of the piers is only related to steel plate's corrosion depth and corrosion range, and the influence of corrosion position on the strength degradation is very gentle. Furthermore, the strength of the piers decreases with the degradation of steel plate-concrete bonding behavior. Finally, the maximum strength of the piers obtained from numerical analysis corresponding to different bonding behavior is compared with theoretical results within an accepted error.

• Design & Manufacturing
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• v.17 no.1
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• pp.40-47
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• 2023

Macular degeneration and glaucoma are representative age-related retinal diseases that rank second and third in the prevalence of retinal diseases, and are a kind of degenerative neurological disease. Irreversible visual acuity and visual field damage may occur, and the number of patients is rapidly increasing as the population ages. Since this retinal disease is a chronic disease, continuous drug treatment is required. There are various drug delivery methods for treatment, but direct injection of the drug into the intravitreal is the most effective for continuous delivery of the drug over a long period of time. In order to solidify Dexamethasone, a retinal disease treatment, and insert it into the primary intravitreal, it is important to develop a technology to miniaturize the treatment and an applicator to deliver the treatment. In this study, a mold technology was developed to integrate the cannula and hub, which are one part of applicator. In addition, surface treatment was performed on the outside of the cannula to improve the bonding strength between the cannula and the hub, and the bonding strength according to each condition was analyzed through a tensile test.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.81-85
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• 2013

Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.