• Korean Journal of Materials Research
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• v.32 no.8
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• pp.339-344
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• 2022

The lattice oxygen mechanism (LOM) is considered one of the promising approaches to overcome the sluggish oxygen evolution reaction (OER), bypassing -OOH^* coordination with a high energetic barrier. Activated lattice oxygen can participate in the OER as a reactant and enables O^*-O^* coupling for direct O₂ formation. However, such reaction kinetics inevitably include the generation of oxygen vacancies, which leads to structural degradation, and eventually shortens the lifetime of catalysts. Here, we demonstrate that Se incorporation significantly enhances OER performance and the stability of NiFe (oxy)hydroxide (NiFe) which follows the LOM pathway. In Se introduced NiFe (NiFeSe), Se forms not only metal-Se bonding but also Se-oxygen bonding by replacing oxygen sites and metal sites, respectively. As a result, transition metals show reduced valence states while oxygen shows less reduced valence states (O^-/O₂^2-) which is a clear evidence of lattice oxygen activation. By virtue of its electronic structure modulation, NiFeSe shows enhanced OER activity and long-term stability with robust active lattice oxygen compared to NiFe.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.4
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• pp.391-396
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• 2023

Recently, as power and electronic devices have increased in frequency and capacity, it has become a major concern to protect electronic circuits and electronic components used in these devices from abnormal voltages such as various surges and pulse noise. To respond to variously rated voltages applied to power electronic devices, the rated voltages of various varistors can be obtained by controlling the size of internal particles of the varistor or controlling the number of layers of the varistor. During bonding, the problem of unbalanced thermal runaway occurring between the electrode and the varistor interface causes degradation of the varistor and shortens its life of the varistor. In this study, to solve the problem of unbalanced heat distribution of stacked varistors to adjust the operating voltage, the contents of the ZnO-based varistor composition were 96 wt% ZnO, 1 mol% Sb₂O₃, 1 mol% Bi₂O₃, 0.5 mol% CoO, 0.5 mol% MnO, and 1 mol% TiO₂. A multi-layered ZnO varistor was modeled by bonding a single varistor with a composition in three layers according to the operating voltage. The thermal distribution of the triple-layered ZnO varistor was analyzed for the thermal runaway phenomenon that occurred during varistor operation using the finite element method according to Comsol 5.2.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.44 no.2
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• pp.35-41
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• 2012

In this study, wheat starch adhesive was investigated the shape and structure of starch, the difference in characteristics such as chemical composition according to the fermenting period of 2 years or less. The fermenting period of wheat starch adhesive is 1 month, 2months, 4 months,6 months, 1 year, 2years old. The wheat starch adhesives were investigated total sugar contents, protein contents, properties of gelatinization, pH, the bonding strength and also observed the surface of starch,. As a result, the longer the fermenting period, the increasing in total sugar contents and decreasing in protein contents. The particle shape and surface were similar regardless of the period. In addition, properties of gelatinization according to the fermenting period also could not see the difference. In pH of the adhesive, the longer the fermenting period, the near to neutral. The adhesive was high bonding strength in 4 months, but appeared a tendency to decrease from 6 months. The damage assessment through the UV degradation in regard to the papers applied the adhesive was accomplished. Color difference was no change except 1 month. The 4 months and 6 months' pH was each 5.0, 5.2. But it was near to neutral that the 12 months and 24 months' pH was each 5.7, 5.9.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.17-20
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• 2001

Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectrics were fabricated, and nitrogen distribution and bonding species which contribute to memory characteristics were analyzed. Also, memory characteristics of devices depending on the anneal temperatures were investigated. The devices were fabricated by retrograde twin well CMOS processes with $0.35{\mu}m$ Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectric were fabricated, and nitrogen distribution and bonding species which contributing memory characteristics were analyzed. Also, memory characteristics of devices according to anneal temperatures were investigated. The devices were fabricated by $0.35{\mu}m$ retrograde twin well CMOS processes. The processes could be simple by in-situ process of nitridation anneal and reoxidation. The nitrogen distribution and bonding state of gate dielectric were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary Ion Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). Nitrogen concentrations are proportional to nitridation anneal temperatures and the more time was required to form the same reoxidized layer thickness. ToF-SIMS results show that SiON species are detected at the initial oxide interface and $Si_{2}NO$ species near the new $Si-SiO_{2}$ interface that formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. These could be said that nitrogen concentration near initial interface is limited to a certain quantity, so excess nitrogen are redistributed near the $Si-SiO_{2}$ interface and contributed to electron trap generation.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• Structural Engineering and Mechanics
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• v.64 no.4
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• pp.427-436
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• 2017

Concrete technologists have used ultrasonic pulse velocity test for decades to evaluate the properties of concrete. However, the presented research work focuses on the use of ultrasonic pulse velocity test to study the degradation in steel-concrete bond subjected to increasing loading. A detailed experimental investigation was conducted by testing five identical beam specimens under increasing loading. The loading was increased from zero till failure in equal increments. From the experimentation, it was found that as the reinforced concrete beams were stressed from control unloaded condition till complete failure, the propagating ultrasonic wave velocity reduced. This reduction in wave velocity is attributed to the initiation, development, and propagation of internal cracking in the concrete surrounding the steel reinforcement. Using both direct and semidirect methods of testing, results of reduction in wave velocity with evidence of internal cracking at steel-concrete interface are presented. From the presented results and discussion, it can be concluded that the UPV test method can be successfully employed to identify zones of poor bonding along the length of reinforced concrete beam. The information gathered by such testing can be used by engineers for localizing repairs thereby leading to saving of time, labor and cost of repairs. Furthermore, the implementation strategy along with real-world challenges associated with the application of the proposed technique and area of future development have also been presented.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.563-569
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• 1996

Degradation of $Zn_3N_2$ films is studied by using several analytical techniques. Polycrystalline $Zn_3N_2$ films prepared by reactie rf magnetron sputtering are kept in the air. Electrical and optical properties are measured by using van der Pauw technique and double-beam spectrometry. Structure and chemical bonding states are studied by X-ray diffraction(XRD), Fourier transfer infrared ray spectroscopy(FT-IR) and X-ray photoelectron specroscopy (XPS). Significant differences are observed in optical properties between the degraded film and the ZnO film. XRD analysis reveals that the degraded film contains very small ZnO grains because very weak and broad ZnO peaks are observed. XPS and FT-IR measurements reveal the formation of $Zn(OH)_2$ in the degraded film. The existence of N-H bonds in degraded films is exhibited from the N 1s spectra. $Zn_3N_2$ change into the mixture of ZnO, $Zn(OH)_2$ and an ammonium salt.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.466-466
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• 2011

There have been several methods to fabricate carbon nanotube (CNT) emitters, which include as-grown, spraying, screen-printing, electrophoresis and bonding methods. Unfortunately, these techniques generally suffer from two main problems. One is a weak mechanical adhesion between CNTs and the cathode. The as-grown, spraying and electrophoresis methods show a weak mechanical adhesion between CNTs and the cathodes, which induces CNT emitters pulled out under a high electric field. The other is a severe degradation of the CNT tip due to organic binders used in the fabrication process. The screen-printing method which is widely used to fabricate CNT emitters generally shows a critical degradation of CNT emitters caused by the organic binder. Such kinds of problems induce a short lifetime of the CNT field emitters which may limit their practical applications. Therefore, a robust CNT emitter which has the strong mechanical adhesion and no degradation is still a great challenge. Here, we introduce a simple and effective technique for fabrication of CNT field emitter, namely filtration-taping-transfer method. The CNT emitters fabricated by the filtration-taping-transfer method show the low turn-on electric fields, the high emission current, good uniformity and good stability. The enhanced emission performance of the CNT emitters is mainly attributed to high emission sites on the emitter area, and to good ohmic contact and strong mechanical adhesion between the emitters and cathodes. The CNT emitters using a simple and effective fabrication method can be applied for various field emission applications such as field emission displays, lamps, e-beam sources, and x-ray sources. The detail fabrication process will be covered at the poster.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.28.2-28.2
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• 2009

Cobalt thin film was fabricated by a novel NH3-based plasma-enhanced atomic layer deposition(PE-ALD) using Co(CpAMD) precursor and $NH_3$ plasma. The PE-ALD Co thin films were produced well on both thermally grown oxide (100 nm) $SiO_2$ and Si(001) substrates. Chemical bonding states and compositions of PE-ALD Co films were analyzed by XPS and discussed in terms of resistivity and impurity level. Especially, we successfully developed PE-ALD Code position at very low growth temperature condition as low as $T_s=100^{\circ}C$, which enabled the fabrication of Co patterns through lift-off method after the deposition on PR patterned substrate without any thermal degradation.