• Steel and Composite Structures
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• 제24권6호
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• pp.753-765
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• 2017

This paper aims to investigate the strength degradation of reinforced concrete piers wrapped with steel plates which corrode at the pier base by employing a three dimensional elasto-plastic finite element formulation. The prediction accuracy of the employed finite element analysis method is firstly verified by comparing the analytical results with test results. Then, a series of parametric studies is carried out to investigate the effects of steel plate's corrosion position along width direction, corrosion depth along plate thickness, corrosion range along width direction, and steel plate-concrete bonding degradation on the strength of the piers. It is observed that the strength degradation of the piers is closely related to steel plate's corrosion position, corrosion depth and corrosion range in the case of local corrosion on the webs. In contrast, when the base of flanges corrodes, the strength degradation of the piers is only related to steel plate's corrosion depth and corrosion range, and the influence of corrosion position on the strength degradation is very gentle. Furthermore, the strength of the piers decreases with the degradation of steel plate-concrete bonding behavior. Finally, the maximum strength of the piers obtained from numerical analysis corresponding to different bonding behavior is compared with theoretical results within an accepted error.

• Restorative Dentistry and Endodontics
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• 제37권1호
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• pp.2-8
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• 2012

The limited durability of resin-dentin bonds severely compromises the longevity of composite resin restorations. Resin-dentin bond degradation might occur via degradation of water-rich and resin sparse collagen matrices by host-derived matrix metalloproteinases (MMPs). This review article provides overview of current knowledge of the role of MMPs in dentin matrix degradation and four experimental strategies for extending the longevity of resin-dentin bonds. They include: (1) the use of broadspectrum inhibitors of MMPs, (2) the use of cross-linking agents for silencing the activities of MMPs, (3) ethanol wet-bonding with hydrophobic resin, (4) biomimetic remineralization of water-filled collagen matrix. A combination of these strategies will be able to overcome the limitations in resin-dentin adhesion.

• 한국재료학회지
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• 제14권11호
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• pp.780-785
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• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

• Geomechanics and Engineering
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• 제18권2호
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• pp.133-140
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• 2019

Strain-rate and temperature have significant effects on the one-dimensional (1D) compression behavior of soils. This paper focuses on the bonding degradation effect of soil structure on the time and temperature dependent behavior of soft structured clay. The strain-rate and temperature dependency of preconsolidation pressure are investigated in double logarithm plane and a thermal viscoplastic model considering the combined effect of strain-rate and temperature is developed to describe the mechanical behavior of unstructured clay. By incorporating the bonding degradation, the model is extended that can be suitable for structured clay. The extended model is used to simulate CRS (Constant Rate of Strain) tests conducted on structural Berthierville clay with different strain-rates and temperatures. The comparisons between predicted and experimental results show that the extended model can reasonably describe the effect of bonding degradation on the stain-rate and temperature dependent behavior of soft structural clay under 1D condition. Although the model is proposed for 1D analysis, it can be a good base for developing a more general 3D model.

• 한국표면공학회지
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• 제54권5호
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1349-1354
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• 2008

In this study, we try to find the root cause of water condensing failures in a headlamp using chemical and mechanical analysis. Through the surface inspection by OM, SEM and CT, it was found that water infiltrate into the headlamp through hotmelt adhesive debonding part caused by adhesion force degradation and poor quality. IR spectra shows that adhesion force degradation are characterized by increase of some functional group(1742, 1710, 1649, 1016). Through the ESPI measurement, it is turned out that bonding structural change by thermal expansion and degradation of adhesive can be the cause of void generation. So it is recommended that cooling passage and the bonding part should be redesigned to give a guarantee of less thermal stress and high adhesion quality.

• 멤브레인
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• 제19권4호
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• pp.310-316
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• 2009

조직 공학용 지지체로 사용할 목적으로 제조된 가교된 lactide/hyaluronic acid (LA/HA) 막의 분해 특성을 살펴보았다. 가교제 1,3-butadiene diepoxide (BD), 1-ethyl-3-(3-dimethyl aminopropyl) carbodiimide (EDC)를 사용하여 얻어진 고분자 막을 $37^{\circ}C$로 조절된 항온조에서 증류수에 침전시켜 분해시켰다. 가교반응시 LA/HA 몰비가 작을수록, 가교제의 농도가 작을수록 생성된 고분자 막의 분해속도가 증가하였다. 분해될 때 막의 구조 변화를 살펴보기 위해 분해 전, 3일, 6일, 9일 후의 시료를 채취하여 핵자기 공명 분광법으로 분자 구조를 살펴보았다. EDC로 가교시킨 막의 경우 시간이 지남에 따라 HA-EDC 결합구조는 서서히 분해되는데 HA-LA 결합구조는 급격히 분해되어 6일 후에는 완전히 소멸되었다. BD로 가교시킨 막의 경우 가교된 결합 구조 모두 서서히 분해되었으며 3일, 6일이 지나면서 HA-BD 결합 구조는 원래의 89, 83%가 유지되었으나 HA-LA 결합 구조는 원래의 83, 65%로 유지되었다. 분해된 막을 전자 현미경으로 측정한 결과 분해 전후 표면에서 기공의 밀도는 크게 차이나지 않았으며, 표면과 측면의 구조도 크게 차이가 나지 않아 조직공학용 재료로써 사용할 때 아무런 문제가 없는 것으로 관찰되었다.

• Journal of Welding and Joining
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• 제30권6호
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 춘계학술발표대회 논문집
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• pp.18-21
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• 2003

The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

• 치위생과학회지
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• 제14권1호
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• pp.29-34
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• 2014

본 연구는 최근 심미보철물 제작에 널리 사용되는 지르코니아의 저온열화가 수복물의 안정성 및 내구성에 영향을 미치는 여부를 확인하기 위하여 전단결합강도를 측정하였다. 디스크 형태의 시편을 각각 7개씩 제작한 후 전장도재를 축성하여, ISO 13356 규격에 의거한 조건으로 고압증기 멸균기에 저온열화의 정도를 조절하기 위하여 3, 5, 10시간 동안 수열처리를 진행하였다. 제한된 조건하에 시행된 실험을 통해 전단결합강도를 확인하였으며, 측정 후 파절양상을 관찰 하였다. 저온열화 처리 전후의 시편에 대한 전단결합강도의 변화는 각 실험군별 유의한 차이가 있었다(p<0.05). 10시간을 저온열화 처리한 시편이 가장 낮은 전단결합강도로 나타났으며, 처리시간이 길어질수록 전단결합강도가 낮아지는 경향을 보였다. 파절 양상으로 저온열화 처리를 하지 않은 시편에서 응집성 파절을 보였으며, 저온열화 처리가 길어질수록 혼합형 파절 경향으로 전환되었다. 결론적으로 본 연구는 저온열화 현상이 진행될수록 지르코니아 코어와 전장도재 간의 결합강도가 낮아지는 경향을 확인하였다. 본 실험결과를 토대로 치과용 지르코니아를 이용한 보철물 제작과정과 환자에게 장착 후 안정적인 사용을 위하여 저온열화 현상에 대한 주의가 필요할 것으로 생각된다.