• 제목/요약/키워드: bonding condition

검색결과 436건 처리시간 0.023초

An analysis of the Wi-Ni Carbide Alloy Diffusion Bonding technique in its application for DME Engine Fuel Pump

  • Chun, Dong-Joon
    • International Journal of Advanced Culture Technology
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    • 제8권2호
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    • pp.246-251
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    • 2020
  • Dimethyl Ether(DME) engine use a highly efficient alternative fuel having a great quantity of oxygen and has a advantage no polluting PM gas. The existing DME fuel cam material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding piston shoe and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The hardness of specimen and bonding rate were measured using ultrasound equipment. The bonding state of each condition was excellent, and the thickness of mid-layer, temperature and maintaining time were measured. The mid-layer thickness according to bonding temperature and maintaining time were observed with optical microscope. We analyzed the micro-structural analysis, formation of bonding specimen, wafer fabrication and fuel cam abrasion test. Throughout this study, we confirmed that the fuel cam for DME engine which demands high durability against velocity and pressure is excellent.

티타늄 자전거의 다중 조인트 접합을 위한 초소성 하이드로포밍과 확산 접합 기술 (Joining of Multi Nodes of a Titanium Bicycle by the Superplastic Hydroforming and Diffusion Bonding Technology)

  • 유영훈;이상용
    • 소성∙가공
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    • 제28권1호
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    • pp.15-20
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    • 2019
  • The superplastic forming/diffusion bonding process has been developed to fabricate a core frame structure with joint nodes out of tubes, for the development of a titanium high performance bicycle. The hydroforming process has been applied for bulging of a tube in the superplastic condition before, and during the diffusion bonding process. In this experiment, a commercial Ti-3Al-2.5V tube was selected as raw material for the study. The forming experiment has been performed using a servo-hydraulic press with a capacity of 200 ton. Next, nitrogen gas was used to acquire necessary pressure for the bulging and bonding of the tubes to fabricate the joint nodes. The pertinent processing temperature was $870^{\circ}C$ for the superplastic hydroforming/diffusion bonding (SHF/DB) process, using the Ti-3Al-2.5V tube. The bonding quality and the progress of bulging and diffusion bonding have been observed by the investigation of the joining interfaces at the cross section of the joint structure. The control of the nitrogen pressure throughout the SHF/DB process, was an important factor to avoid any significant defects in the joint structure. The whole progress stage of the diffusion bonding could be observed at a joint interface. A core structure with 5 joint nodes to manufacture a titanium bicycle could be obtained in a SHF/DB process.

모꾸메가네 장신구를 위한 은/동 접합 잉곳 소재 개발 (Development of the Ag/Cu Ingots for Mokumegane Jewelry)

  • 송오성;김종률;김명로
    • 한국산학기술학회논문지
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    • 제9권1호
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    • pp.9-15
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    • 2008
  • 모꾸메가네는 나무결 모양을 낼 수 있는 고부가가치가 가능한 장신구 소재이며 서로 다른 금속을 가공하기 위해 융점이 다른 두 가지 이상 금속을 적층하여 붙인 잉곳 제작이 필수적이다. 기존의 모꾸메가네용 잉곳은 숯을 이용한 환원성 분위기에서 경험에 근거한 육안 판별로 만들어져서 접합의 신뢰성과 후속 가공 도중 층간 분리가 일어나는 분제가 있었다. $900^{\circ}C$에서 2.5kg의 압력을 가하면서 진공 열처리로를 이용하여 90% 이상 접합율이 가능한 조건을 확인하였다. 계면에서의 계면 확산계수가 통상의 벌크 확산계수보다 100배 향상되는 것을 확인하였고 이종 접합시에 계면 확산계수를 확인하여 $700^{\circ}C$의 저온에서 10분동안 진공열처리, 90% 이상 접합율을 가진 모꾸메가네용 잉곳을 성공적으로 제조하였다. 제조된 잉곳으로 핸드폰 외장용 모꾸메가네 시작품을 성공적으로 제조할 수 있었다.

Sn-Pb 솔더를 이용한 경연성 인쇄 회로 기판간의 열압착 본딩 (Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder)

  • 최정현;이종근;윤정원;정승부
    • 마이크로전자및패키징학회지
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    • 제17권3호
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    • pp.11-15
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    • 2010
  • 본 연구에서는 Sn-Pb 솔더를 이용한 열압착법을 이용하여 경성 인쇄 회로 기판 (rigid printed circuit board, RPCB)과 연성 인쇄 회로 기판 (flexible printed circuit board, FPCB)간 접합 시의 접합 조건을 최적화하는 연구를 진행하였다. 접합의 주요 변수로는 접합 압력, 온도 및 시간이 있으며 이러한 변수의 변화로 인해 접합부의 접합 형태와 박리 강도에서 많은 차이가 발생하는 것을 확인할 수 있었다. 또한 일정 접합 온도와 시간 조건 ($225^{\circ}C$, 7초)에서 22 N/cm의 최고 박리 강도를 보이며 이후로는 더 이상 박리 강도에서 큰 차이를 보이지 않게 되는데, 이를 박리 시험 시의 F-x (forcedisplacement) curve를 토대로 파괴 에너지를 산출하여 그 차이를 규명하였다. 최적의 접합 조건은 $225^{\circ}C$, 7초로 나타났다.

FRP 보강판 부착 콘크리트에서 유도초음파 모드 거동에 대한 접착층의 영향 (Effect of Bonding Layer on Guided Wave Mode Behavior in FRP Plate Bonded on Concrete)

  • 이용주;신성우
    • 비파괴검사학회지
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    • 제32권1호
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    • pp.34-40
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    • 2012
  • 본 연구에서는 FRP 보강판 부착 콘크리트에서의 유도초음파 기본 모드의 전파 특성에 부착제인 epoxy의 두께와 물성이 미치는 영향을 알아보고자 하였으며, 이를 위해 FRP-epoxy-concrete로 구성된 다층 유도초음파 시스템을 모델링하고 모드 해석을 수행하였다. Epoxy 층의 두께와 탄성계수를 변수로 하여 해석을 수행한 결과, A0 모드에 비해 S0 모드가 epoxy 층의 두께와 탄성계수 변화에 큰 영향을 받으며, 이로부터 경계층인 Epoxy 층의 상태 평가에는 A0 모드에 비해 S0 모드가 유효하리라는 결론을 얻었다.

고상확산접합된 Haynes230의 인장성질에 미치는 접합조건의 영향 (Effect of Bonding Condition on the Tensile Properties of Diffusion Bonded Haynes230)

  • 강길모;전애정;김홍규;홍성석;강정윤
    • Journal of Welding and Joining
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    • 제31권3호
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    • pp.76-83
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    • 2013
  • This study investigated the effect of bonding temperature and holding time on microstructures and mechanical properties of diffusion bonded joint of Haynes230. The diffusion bonds were performed at the temperature of 950, 1050, and $1150^{\circ}C$ for holding times of 30, 60, 120 and 240 minutes at a pressure of 4MPa under high vacuum condition. The amount of non-bonded area and void observed in the bonded interface decreased with increasing bonding temperature and holding time. Cr-rich precipitates at the linear interface region restrained grain migration at $950^{\circ}C$ and $1050^{\circ}C$. However, the grain migration was observed in spite of short holding time due to the dissolution of precipitates to base metal in the interface region at $1150^{\circ}C$. Three types of the fracture surface were observed after tensile test. The region where the coalesce and migration of grain occurred much showed high fracture load because of base metal fracture whereas the region where those did less due to the precipitates demonstrated low fracture load because of interface fracture. The expected fracture load could be derived with the value of fracture area of base metal ($A_{BF}$) and interface ($A_{IF}$), $Load=201A_{BF}+153A_{IF}$. Based on this equation, strength of base metal and interface fracture were calculated as 201MPa and 153MPa, respectively.

초소성 성형/확산접합 공정의 유한요소 해석 (Finite Element Analysis of Superplastic Forming/Diffusion Bonding Processes)

  • 홍성석;김용환
    • 소성∙가공
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    • 제5권1호
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    • pp.37-46
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    • 1996
  • Superplastic forming/diffusion bonding (SPF/DB) processes were analyzed using a rigid visco-plastic finite element method. The optimum pressure-time relationship for a target strain rate and thickness distributions were predicted by two-node line elements based on the membrane approximation for plane strain. Material behavior during SPF/DB of the integral structures having complicated shapes was investigated. The tying condition is employed for the analysis of inter-sheet contact problems. A movement of rib structure is successfully predicted during the forming.

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A$_2$O$_3$세라믹과 Ni-Cr-Mo鋼과의 인서트 合金을 이용한 擴散接合에 關한 硏究 (A study on the diffusion bonding of the $Al_2$O$_3$ ceramics to metal)

  • 김영식;박훈종;김정일
    • Journal of Welding and Joining
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    • 제10권3호
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    • pp.63-72
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    • 1992
  • The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

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환경변화에 의한 열 압착용 실리콘 고무의 정전기 대전 특성에 관한 연구 (A Study on Electrostatic Electrification Properties of Silicone Rubber for Thermal Bonding According to the Variation of Environment)

  • 이성일
    • 한국전기전자재료학회논문지
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    • 제23권9호
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    • pp.718-723
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    • 2010
  • In this paper, the following results were obtained from the experiment in which electrification voltage of silicone rubber specimen for thermal bonding were measured under various time, temperature ($10{\sim}40^{\circ}C$), and humidity (30~90%) conditions and different amount of carbon additives (0~15 phr (per hundred resin)). Electrostatics electrification voltage decreased when carbon is up to 10 phr, and there was no electrification voltage in 15 phr condition. The electrostatics electrification voltage did not change over time. When the temperature was constant, electrostatics electrification voltage sharply dropped when the humidity was around 70%. That means, this condition might be appropriate for prevention of charging. The electrification voltage decreased as humidity and amount of carbon increased.

7000계 Al 합금의 확산접합에 관한 연구 (A Syudy on the Diffusion Joining of 7000 Al Alloy)

  • 진영철;홍은성;김양수;이민상;유창영
    • 열처리공학회지
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    • 제6권1호
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    • pp.9-16
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    • 1993
  • To investigate the properties of diffusion bonding of 7050 Al alloy, the diffusion bonding joints have been produced in self-made diffusion bonding hot-press which admits a defined application of the bonding pressure during the heating phase and also rapid cooling after the bonding process with various bonding condition. The strength of the bond increases with increasing the bonding time and temperature. Shear test at toom temperature showed that high strength up to 70% that of parent metal (320 MPa), 220 MPa for the specimen bonded 14 hr at $560^{\circ}C$, with 3 MPa. In this case, however, there is large deformation more than 20% reduction in thickness. The results were correlated with joint characteristics found by optical microstructure and by fractography by SEM. When the strengths of the bonds are more than 50% that of parent metal, a great deal of dimples stretched along the direction of shear stress are observed over the fractured surface of the bond. On the microstructure of the bond line, initial mophology of the bond line disapeared for the grain boundary migration with increasing the bonding time.

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