• 한국수소및신에너지학회논문집
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• 제28권4호
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• pp.338-344
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• 2017

Polyoxometal molybdophosphoric acid (MoPA) bonded polyether ether ketone (PEEK) composite membrane for water electrolysis has been investigated. The composited membrane, covalently cross linked (CL) sulfonated polyether ether ketone (SPEEK) with a bonded MoPA, was prepared in sulfonation of PEEK, cross linkage reaction with 1,4-diiodobutane, and addition with MoPA. PEEK was covalently cross-linked with 1,4-diiodobutane to improve mechanical strength and was added with MoPA to increase proton conductivity. MoPA should be fixed to back bone of SPEEK to prevent bleeding out. Therefore, the carbonyl group of SPEEK was reduced with NaBH4 and 3-isocyanatepropyltriethoxysilane (ICPTES) was added. The MoPA bonded composite was produced in the reaction of MoPA with 3-mercaptopropyltrimethoxvsilane (MPTMS). In conclusion, MoPA bonded CL-SPEEK composite membrane featured 0.129 S/cm of proton conductivity at $80^{\circ}C$, and 2,156 hours of chemical stability in Fenton test. These properties are better than those of membranes of other SPEEK system.

• 대한토목학회논문집
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• 제30권2A호
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• pp.161-168
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• 2010

국내 가동 중 일부 원전의 원자로건물에 부착식 텐던이 설치되어 있고, 부착식 텐던에 대한 유효 긴장력 평가는 이들 원전의 계속운전을 위한 주요 현안으로 부각되고 있다. 따라서, 본 연구에서는 System Identification 기법을 이용한 부착식 텐던의 유효 긴장력 평가를 위하여, SI 기법에 유효한 주요 매개변수의 영향 평가를 수행하고 최적의 매개변수를 도출하였다. 본 연구를 위하여, 원자로건물 벽체의 1/5 축소모형 시험체를 제작하였고, 유효 긴장력과 고유진동수 및 변위와의 상관성을 분석하기 위하여 Impact test, SIMO sine sweep test 및 광섬유센서와 변위계에 의한 휨시험을 수행하였다. 시험결과, 고유진동수와 변위 모두 유효 긴장력과 좋은 상관성을 지니는 것으로 나타나, 이들 매개변수 모두 SI 기법의 입력자료로 활용되어 부착식 텐던의 유효 긴장력 예측이 가능한 것으로 분석되었다.

• 한국구조물진단유지관리공학회 논문집
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• 제12권6호
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• pp.155-163
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• 2008

본 연구에서는 외부 부착 프리스트레스트 탄소섬유판으로 보강된 RC보의 휨거동을 분석하기 위한 실험연구를 수행하였다. 실험체는 프리스트레스 양을 변수로 축소모형으로 제작되었다. 또한 프리스트레스의 도입에 따른 구조성능 비교를 위하여 기준실험체와 단순부착 실험체를 함께 제작하였다. 실험결과, 단순 부착 탄소섬유판으로 보강된 부재는 조기 박리에 의해 탄소섬유판 인장강도의 50% 이하에서 최종파괴되었다. 그러나, 프리스트레스를 도입하여 보강한 실험체는 모두 탄소섬유판의 파단하중까지 도달하였다. 또한 프리스트레스 보강량의 증가에 따라서 균열하중, 항복하중은 증가하며 최대하중은 프리스트레스 양과 관계없이 일정한 것으로 나타났다.

• 대한토목학회논문집
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• 제28권4A호
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• pp.447-456
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• 2008

본 논문에서는 CFRP판으로 긴장 보강된 철근콘크리트 보의 부착파괴를 해석하기 위한 수정된 부착파괴 모델를 제안하였다. 부착파괴 모델은 한정된 실험결과로부터 발생할 수 있는 오류를 줄이기 위해 선행연구자들의 실험결과를 통계적으로 분석하여 제안하였다. 부착 CFRP판으로 긴장 보강된 보에 대한 실험을 통해 긴장 보강 시스템에서 최종파괴 이전에 부착파괴가 발생하는 것을 확인하였으며, 부착파괴 변형률은 유효프리스트레스의 크기에 따라 증가하는 것을 검증하였다. 따라서 부착거동 특성 연구에서 도출된 부착파괴 해석모델은 긴장 시스템에 적합하도록 유효프리스트레스를 고려할 수 있도록 수정 제안하였다.

• The Journal of Advanced Prosthodontics
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• 제10권4호
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• pp.286-290
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• 2018

PURPOSE. Conventional resin-bonded fixed partial dentures (RBFPDs) are usually made with a two-retainer design. Unlike conventional RBFPDs, cantilever resin-bonded fixed partial dentures (Cantilever RBFPDs) are, for their part, made with a single-retainer design. The aim of this study was to compare the effect of tooth surface preparation on the bond strength of zirconia cantilever single-retainer RBFPDs. The objective is to evaluate the shear bond strength of these single-retainer RBFPDs bonded on 3 different amount of tooth surface preparation. MATERIALS AND METHODS. Thirty extracted bovine incisors were categorized to 3 groups (n=10), with different amounts of tooth surface preparations. Teeth were restored with single-retainer RBFPDs with different retainer surfaces: large retainer of $32mm^2$; medium retainer of $22mm^2$; no retainer and only a proximal connecting box of $12mm^2$. All RBFPDs were made of zirconia and were bonded using an adhesive system without adhesive capacity. Shear forces were applied to these restorations until debonding. RESULTS. Mean shear bond strength values for the groups I, II, and II were $2.39{\pm}0.53MPa$, $3.13{\pm}0.69MPa$, and $5.40{\pm}0.96MPa$, respectively. Statistical analyses were performed using a one-way ANOVA test with Bonferroni post-hoc test, at a significance level of 0.001. Failure modes were observed and showed a 100% adhesive fracture. CONCLUSION. It can be concluded that the preparation of large tooth surface preparation might be irrelevant. For zirconia single-retainer RBFPD, only the preparation of a proximal connecting box seems to be a reliable and minimally invasive approach. The differences are statistically significant.

• 대한치과보철학회지
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• 제31권3호
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• pp.385-393
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• 1993

Injection processing of denture base resin was introduced by Pryer in 1942, in an attempt to reduce processing shrinkage. More recently a continuous-pressure injection type technique has been developed (SR-Ivocap, Ivoclar AG, Schaan, Liechtenstein.), and it reduced processing error and increased resin density. The purpose of this study was to compare tensile bond strength of heat-cured, cold-cured, and light-cured denture base resin bonded to continuous-pressure injection type resin. To know it, 60 cylindrical resin specimens were fabricated, and tensile bond strength were measured. The results were as follows : 1. The mean tensile bond strength bonded to continuous-pressure injection type resin was lower than bonded to conventional heat cured resin. But tensile bond strength of conventional heat cured resin bonding with light cured resin was lower than continuous-pressure injection type resin. 2. Of the tensile bond strength bonded to continuous-pressure injection type resin, tensile bond strength bonding with continuous-pressure injection type resin was the greatest(but not significantly different from bonding with conventional heat cured resin), followed by cold-cured, light-cured resin. 3. Of the tensile bond strength bonded to conventional heat cured resin, tensile bond strength bonding with conventional heat cured resin was the greatest and followed by continuous-pressure injection type resin, cold-cured resin, light-cured resin. According to these results, bonding of continuous-pressure injection type resin with conventional heat cured resin or continuous-pressure injection type resin is acceptable, but bonding with light-cured resin is questionable.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• 대한치과보철학회지
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• 제32권3호
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• pp.378-395
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• 1994

The purpose of this study was to investigate the effect of various metal surface treatments and adhesive systems on the flexural bond strength of composite resin to Au-Ag-Cu-Pd alloy. The specimens were divided into nine groups by the combinations of surface treatment methods and adhesive systems. The types of surface treatment in this study were alumina blasting only, alumina blasting-Sn plating, alumina blasting-heating and three kinds of adhesive system used in this study were Silicoater system(Heraeus Kulzer GmbH,Germany), Superbond C & B(Sun Medical Co.,Ltd.,Japan) and Cesead opaque primer(Kurary Co.,Ltd.,Japan). After surface treatments and adhesive systems were applied, each specimen was built up with Dentacolor composite resin (Heraeus Kulzer GmbH,Germany). Four-point flexural bond strength was measured by Instron universal testing machine (Model 4301,U.S.A.) and modes of failure were observed by SEM(JEOL,SSM-840A,Japan). The obtained results were as follows: 1. The group that was bonded with Superbond C & B after alumina blasting-heating shelved the highest bond strength with significant difference among the groups, except the group with Cesead opaque primer after alumina blasting-Sn plating(P<0.05). 2. In the groups bonded with Cesead opaque primer, there was significant difference only in the bond strength between the alumina blasting-Sn plating group and alumina blasting group, where the former showed a higher bond strength(P<0.05). 3. In the groups bonded with Silicoater system, there were no significant differences in bond strength regardless of the surface treatment method(P<0.05). 4. In SEM evaluation, the groups of high bond strength, especially bonded with Superbond C & B after alumina blasting-heating and Cesead opaque primer after alumina blasting-Sn plating, revealed mainly cohesive-adhesive failure, whereas the others showed the tendency of adhesive failure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 제5회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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• pp.38-42
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• 2003

The use of VPI impregnated mica tape as high voltage insulation for large rotating electric machines requires a careful balance of processes and materials to obtain the desired electrical, mechanical and thermal characteristics. The stator insulation systems such as epoxy bonded high voltage mica tape have been produced for many years. One such system employing an epoxy and anhydride impregnating resin developed by Hyundai Heavy Industries, Co. (hereafter, HHI), to satisfy customer requests for an epoxy bonded insulation system. HHI applies the following electrical and thermal evaluations such as dielectric breakdown, voltage endurance, dissipation factor vs. temperature, isothermal weight loss, and so on. A detailed laboratory evaluation can describe specific physical limitations for an insulation system and permit development of long-term operation guidelines that permit full utilization of the proposed system. HHI has found these evaluations very helpful in qualifying insulation system for the repair of both large motors and generators.

• 대한치과보철학회지
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• 제29권3호
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• pp.33-41
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• 1991

Cermic has been widely used because of its excellent esthetics and strength. The recently introduced castable ceramic system is regarded as the more esthetic and biocompatible restorative material. The purpose of this study was to compare the shear bond strength of Dicer & G-Cera porcelain laminate veneer according to the type of cement and surface treatment and to observe the surface of bonding failure with SEM. Total forty disks(3.5mm $diam.\times2.0mm$ thickness) were prepared. Forty extracted human maxillary central incisor teeth were stored in saline solution. Ten teeth were bonded to Dicer specimen with Dicer ZPC cement and ten teeth were bonded with Dicer resin cement. Ten silicoated G-Cera specimen and ten non-silicoated G-Cera specimen were bonded to teeth with G-Cera resin cement. Bonded units were mounted in a plastic tube with hard stone and stored in a humidor at $37^{\circ}C$ for 24 hours. Shear bond strength was measured by Instron Universal Testing Machine (Model 1125) and all the specimen were observed with SEM(JEOL, JSM-T2000)and modes of failure were recorded. The obtained results were as follows: 1. The mean shear bond strength of Dicer bonded with Dicer resin cement was 11.62 MPa and that bonded with Dicor ZPC cement was 0.88 MPa : Shear bond strength of Dicer bonded with Dicer resin cement was significantly increased(P<0.05). 2. The mean shear bond strength of silicoated G-Cera was 13.10 MPa and that of non silicoated G-Cera was 10.93 MPa : Shear bond strength of silicoated G-Cera was not significantly increased (P>0.05). 3. Shear bond strength of Dicer and G-Cera porcelain laminate veneer was not significantly different (P>0.05). 4. In observation of bond failure with SEM, Dicer bonded with Dicer ZPC cement exhibited adhesive failure. Dicer bonded with Dicer resin cement and silicoated and non silicoated G-Cera exhibited cohesive failure.