• Title/Summary/Keyword: bandgap

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Electrical Characteristics of InAlAs/InGaAs/InAlAs Pseudomorphic High Electron Mobility Transistors under Sub-Bandgap Photonic Excitation

  • Kim, H.T.;Kim, D.M.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.3
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    • pp.145-152
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    • 2003
  • Electrical gate and drain characteristics of double heterostructure InAlAs/InGaAs pseudomorphic HEMTs have been investigated under sub-bandgap photonic excitation ($hv). Drain $(V_{DS})-,{\;}gate($V_{DS})-$, and optical power($P_{opt}$)-dependent variation of the abnormal gate leakage current and associated physical mechanisms in the PHEMTs have been characterized. Peak gate voltage ($V_{GS,P}$) and the onset voltage for the impact ionization ($V_{GS.II}$) have been extracted and empirical model for their dependence on the $V_{DS}$ and $P_{opt} have been proposed. Anomalous gate and drain current, both under dark and under sub-bandgap photonic excitation, have been modeled as a parallel connection of high performance PHEMT with a poor satellite FET as a parasitic channel. Sub-bandgap photonic characterization, as a function of the optical power with $h\nu=0.799eV$, has been comparatively combined with those under dark condition for characterizing the bell-shaped negative humps in the gate current and subthreshold drain leakage under a large drain bias.

Bandgap capability of hybrid Kirigami inspired cellular structures

  • Del Broccolo, S.;Ouisse, M.;Foltete, E.;Scarpa, F.
    • Advances in aircraft and spacecraft science
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    • v.6 no.6
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    • pp.479-495
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    • 2019
  • Periodic cellular core structures included in sandwich panels possess good stiffness while saving weight and only lately their potential to act as passive vibration filters is increasingly being studied. Classical homogeneous honeycombs show poor vibracoustic performance and only by varying certain geometrical features, a shift and/or variation in bandgap frequency range occurs. This work aims to investigate the vibration filtering properties of the AUXHEX "hybrid" core, which is a cellular structure containing cells of different shapes. Numerical simulations are carried out using two different approaches. The first technique used is the harmonic analysis with commercially available software, and the second one, which has been proved to be computationally more efficient, consists in the Wave Finite Element Method (WFEM), which still makes use of finite elements (FEM) packages, but instead of working with large models, it exploits the periodicity of the structure by analysing only the unit cell, thanks to the Floquet-Bloch theorem. Both techniques allow to produce graphs such as frequency response plots (FRF's) and dispersion curves, which are powerful tools used to identify the spectral bandgap signature of the considered structure. The hybrid cellular core pattern AUXHEX is analysed and results are discussed, focusing the investigation on the possible spectral bandgap signature heritage that a hybrid core experiences from their "parents" homogeneous cell cores.

A Low Voltage Bandgap Reference Voltage Generator Design and Measurement (저전압 밴드갭 기준 전압 발생기 설계)

  • Shim, Oe-Yong;Lee, Jae-Hyung;Kim, Jong-Hee;Kim, Tae-Hoon;Park, Mu-Hun;Ha, Pan-Bong;Kim, Young-Hee
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.10a
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    • pp.785-788
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    • 2007
  • The newly proposed badgap reference voltage generator is insensible to PVT(process, voltage, temperature) variation and has a lower minimum supply voltage, which is required for stable operation. The simulation result is that the bandgap reference voltage generator starts operation at 1.0V of supply voltage. The layout of the bandgap reference voltage generator is designed using Magnachip $0.18{\mu}m$ DDI process, and the size is $409.36{\mu}m$ ${\times}$ $435.46{\mu}m$.

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The Change of Energy Band Gap and Transmittance Depending on Ag Thinkness of IGZO, ZnO, AZO OMO

  • Lee, Seung-Min;Kim, Hong-Bae;Lee, Sang-Ryeol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.340.1-340.1
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    • 2014
  • 본 실험에서는 Ag두께 변화에 따른 투과율과 Energy bandgap의 변화를 알아보기 위해 RF Sputter장비와 Evaporator장비를 사용하여 IGZO, ZnO, AZO OMO 구조로 Low-e 코팅된 Glass를 제작하였다. $3cm{\times}3cm$의 Corning1737 유리기판에 RF Sputtering 방식으로 Oxide layer를 증착 하였고 Evaporator장비로는 Metal layer인 Ag막을 증착하였다. Oxide layer 증착 시 RF Sputter장비의 조건은 $3.0{\times}10^{-6}Torr$이하로 하였으며, 증착압력은 $6.0{\times}10^{-3}Torr$, 증착온도는 실온으로 고정하였다. Metal layer 증착 시 Evaporator장비의 조건은 $5.0{\times}10^{-6}Torr$이하, 전압은 0.3 V, Rotate 2 rpm으로 고정하였다. 실험 변수로는 Ag 두께를 5,7,9,11,13 nm로 변화를 주어 실험을 진행하였다. 투과도 측정 장비를 사용하여 각 샘플을 측정한 결과 IGZO의 경우 가시광영역의 평균 투과율이 80% 이상이며 Ag두께가 5nm일 때부터 자외선 영역의 빛을 차단하여 low-e 특성을 나타내었다. 이는 산화물인 IGZO가 결정질인 AZO, ZnO 보다 낮은 표면거칠기를 가지기 때문이다. Ag 두께에 따른 각 물질의 Optical energy bandgap 분석결과 Ag 두께가 증가할수록 IGZO는 4.65~4.5 eV, AZO는 4.6~4.4 eV, ZnO는 4.55~4.45 eV로 Energy bandgap은 감소하였다. AFM장비를 이용하여 각 샘플의 표면 Roughness 측정 결과 Ag 두께가 증가할수록 표면거칠기도 증가하는 경향을 나타내었다.

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Bandgap Voltage Reference Circuit Design Technology Suitable for Driving Large OLED Display Panel (대형 OLED 디스플레이 패널 구동에 적합한 밴드갭 레퍼런스 회로 설계 및 결과)

  • Moon, Jong Il;Cho, Sang Jun;Cho, Eou Sik;Nam, Chul;Kwon, Sang Jik
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.2
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    • pp.53-56
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    • 2018
  • In this paper, a CMOS bandgap voltage reference that is not sensitive to changes in the external environment is presented. Large OLED display panels need high supply voltage. MOSFET devices with high voltage are sensitive to the output voltage due to the channel length modulation effect. The self-cascode circuit was applied to the bandgap reference circuit. Simulation results show that the maximum output voltage change of the basic circuit is 77mV when the supply voltage is changed from 10.5V to 13.5V, but the proposed circuit change is improved to 0.0422mV. The improved circuit has a low temperature coefficient of $9.1ppm/^{\circ}C$ when changing the temperature from $-40^{\circ}C$ to $140^{\circ}C$. Therefore, the proposed circuit can be used as a reference voltage source for circuits that require a high supply voltage.

Electrical and Optical Properties for TCO/Si Junction of EWT Solar Cells (TCO/Si 접합 EWT 태양전지에 관한 전기적 및 광학적 특성)

  • Song, Jinseob;Yang, Jungyup;Lee, Junseok;Hong, Jinpyo;Cho, Younghyun
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.39.2-39.2
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    • 2010
  • In this work we have investigated electrical and optical properties of interface for ITO/Si with shallow doped emitter. The ITO is prepared by DC magnetron sputter on p-type monocrystalline silicon substrate. As an experimental result, The transmittance at 640nm spectra is obtained an average transmittance over 85% in the visible range of the optical spectrum. The energy bandgap of ITO at oxygen flow from 0% to 4% obtained between 3.57eV and 3.68eV (ITO : 3.75eV). The energy bandgap of ITO is depending on the thickness, sturcture and doping concentration. Because the bandgap and position of absorption edge for degenerated semiconductor oxide are determined by two competing mechanism; i) bandgap narrowing due to electron-electron and electron-impurity effects on the valance and conduction bands (> 3.38eV), ii) bandgap widening by the Burstein-Moss effect, a blocking of the lowest states of the conduction band by excess electrons( < 4.15eV). The resistivity of ITO layer obtained about $6{\times}10^{-4}{\Omega}cm$ at 4% of oxygen flow. In case of decrease resistivity of ITO, the carrier concentration and carrier mobility of ITO film will be increased. The contact resistance of ITO/Si with shallow doped emitter was measured by the transmission line method(TLM). As an experimental result, the contact resistance was obtained $0.0705{\Omega}cm^2$ at 2% oxygen flow. It is formed ohmic-contact of interface ITO/Si substrate. The emitter series resistance of ITO/Si with shallow doped emitter was obtained $0.1821{\Omega}cm^2$. Therefore, As an PC1D simulation result, the fill factor of EWT solar cell obtained above 80%. The details will be presented in conference.

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Ag Sintering Die Attach Technology for Wide-bandgap Power Semiconductor Packaging (Wide-bandgap 전력반도체 패키징을 위한 Ag 소결 다이접합 기술)

  • Min-Su Kim;Dongjin Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.1
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    • pp.1-16
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    • 2023
  • Recently, the shift to next-generation wide-bandgap (WBG) power semiconductor for electric vehicle is accelerated due to the need to improve power conversion efficiency and to overcome the limitation of conventional Si power semiconductor. With the adoption of WBG semiconductor, it is also required that the packaging materials for power modules have high temperature durability. As an alternative to conventional high-temperature Pb-based solder, Ag sintering die attach, which is one of the power module packaging process, is receiving attention. In this study, we will introduce the recent research trends on the Ag sintering die attach process. The effects of sintering parameters on the bonding properties and methodology on the exact physical properties of Ag sintered layer by the realization 3D image are discussed. In addition, trends in thermal shock and power cycle reliability test results for power module are discussed.

Control of Ni/β-Ga2O3 Vertical Schottky Diode Output Parameters at Forward Bias by Insertion of a Graphene Layer

  • Madani Labed;Nouredine Sengouga;You Seung Rim
    • Nanomaterials
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    • v.12 no.5
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    • pp.827-838
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    • 2022
  • Controlling the Schottky barrier height (φB) and other parameters of Schottky barrier diodes (SBD) is critical for many applications. In this work, the effect of inserting a graphene interfacial monolayer between a Ni Schottky metal and a β-Ga2O3 semiconductor was investigated using numerical simulation. We confirmed that the simulation-based on Ni workfunction, interfacial trap concentration, and surface electron affinity was well-matched with the actual device characterization. Insertion of the graphene layer achieved a remarkable decrease in the barrier height (φB), from 1.32 to 0.43 eV, and in the series resistance (Rs), from 60.3 to 2.90 mΩ.cm2. However, the saturation current (Js) increased from 1.26×10-11 to 8.3×10-7(A/cm2). The effects of a graphene bandgap and workfunction were studied. With an increase in the graphene workfunction and bandgap, the Schottky barrier height and series resistance increased and the saturation current decreased. This behavior was related to the tunneling rate variations in the graphene layer. Therefore, control of Schottky barrier diode output parameters was achieved by monitoring the tunneling rate in the graphene layer (through the control of the bandgap) and by controlling the Schottky barrier height according to the Schottky-Mott role (through the control of the workfunction). Furthermore, a zero-bandgap and low-workfunction graphene layer behaves as an ohmic contact, which is in agreement with published results.

Characterisation of $TiO_2$ film synthesized using titaniumtetrachlo precusor ($TiCl_3$를 이용해서 합성된 $TiO_2$ 박막의 특성)

  • 김강혁;이창근;이규환;김인수
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.111-111
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    • 2003
  • The peroxo titanic acid solution was successfully prepared using titanium trichloride as a precursor. The basic properties of the TiO2 film prepared by the solution were investigated in view of phase change, bandgap energy, crystalline size etc. The film displayed amorphous TiO$_2$ at room temperature, anatase above 281$^{\circ}C$ and a mixture of anatase and rutile at 99$0^{\circ}C$, The crystalline size increases with annealing temperatures, while the bandgap energies decrease due to the quantum size effect and the formation of rutile phase which has low bandgap energy. As a result of TG-DTA, it was found that annealing treatment at 99$0^{\circ}C$ for 2h formed a mixtures of anatase and rutile through three steps: (1) the removal of physically adsorbed water (2) the decomposition of peroxo group (3) amorphous-anatase or anatase-rutile phase transformation.

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Wideband Suppression of Radiated Emissions from a Power Bus in High-Speed Printed Circuit Boards

  • Shim, Yujeong;Kim, Myunghoi
    • Journal of information and communication convergence engineering
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    • v.14 no.3
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    • pp.184-190
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    • 2016
  • We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS-EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.