• 한국식품조리과학회지
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• 제26권2호
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• pp.165-170
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• 2010

Although the demand of ready-to-eat (RTE) foods such as Kimbab is growing, large quantities and wide distribution of these foods is difficult due to their short shelf-life, exposed packaging with hygienic risk, and decreased quality at refrigerator temperatures. This study was undertaken to develop preservation and storage methods to extend the shelf-life of RTE rice products using microwave and packaging methods such as vacuum and modified atmosphere packages. RTE rice ball samples inoculated with Escherichia coli, Salmonella Typhimurium, Listeria monocytogenes, Staphylococcus aureus or Bacillus cereus were microwave treated for 0, 30, 60, 90 and 120 seconds. Populations of pathogens on the rice balls were significantly reduced with an increase in treatment time. There were more than 5 log reductions of all pathogens when the samples were microwave treated for 60 seconds. RTE rice balls inoculated with two pathogens (S. aureus and B. cereus) were packaged via air, vacuum, $N_2$ gas, and $CO_2$ gas following microwave treatment for 90 seconds. The initial S. aureus and B. cereus concentration before treatment was 7.60 and 6.59 log CFU/g, and these levels were reduced by 3.37 and 2.18 log CFU/g after microwave treatment. The levels of pathogens were significantly increased during storage time at room temperature. $CO_2$ packaging was the most effective at inhibiting microbial growth among the tested packaging methods. The levels of total mesophilic count, S. aureus and B. cereus after 5 days of storage were 7.7, 8.8 and 9.3 log CFU/g in air packaged samples and 2.4, 3.2 and 8.3 log CFU/g in $CO_2$ gas packaged samples, respectively. However, after 3 days of storage higher levels of B. cereus were observed in all samples, indicating that the samples were not safe to be consumed. Base on these results, microwave treatment and MAP packaging methods using $CO_2$ gas could be used as a potential method for extending the shelf-life of RTE foods.

• 한국화재소방학회논문지
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• 제30권4호
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• pp.121-127
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• 2016

본 논문에서는 대전류공급장치(PCITS)에 의해 소손된 강이음쇠형(iron fittings type) 금속플렉시블호스(CSST)의 구조 및 전기적 특성을 해석하였다. CSST는 보호 피막, 튜브, 너트, 클램프 링, 플레어 캡, 소켓, 볼 밸브 등으로 구성되어 있다. CSST의 내전압 평가는 전기 충전부와 비충전부 사이에 교류 전압 220 V를 1분간 인가하여 견뎌야 한다. 직류 500 V에 의한 절연 성능의 평가는 온도 상승 시험 전에 $1M{\Omega}$ 이상, 시험이 끝난 후에는 $0.3M{\Omega}$ 이상을 요구한다. 정상 제품의 평균 저항은 $11.5m{\Omega}$이었으나 PCITS로 130 A를 흘려 소손된 제품의 평균 저항 $11.50m{\Omega}$이었다. 또한 130 A가 약 10 s 흘렀을 때 튜브의 보호 피막이 일부 용융되었고, 검정색의 연기가 발생하였다. 60 s 경과되면 튜브의 대부분이 적색으로 발열되며, 전류가 120 s 흘렀을 때는 적열 범위가 넓어졌다. 95%의 신뢰 구간(CI)의 검증에서 P 값은 0.019로 정규 분포를 갖지 못하였으나 Anderson-Darling (AD) 통계량은 0.896, 표준 편차는 0.5573 등으로 양호한 특성을 나타냈다.

• 한국자기학회지
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• 제7권1호
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• pp.13-18
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• 1997

기본 조성 N $i_{0.18}$Z $n_{0.68}$C $u_{0.14}$F $e_{2}$ $O_{4}$와 N $i_{0.14}$Z $n_{0.64}$C $u_{0.22}$F $e_{2}$ $O_{4}$ 및 N $i_{0.24}$Z $n_{0.64}$C $u_{0.12}$F $e_{2}$ $O_{4}$에 입계의 고저항층을 형성하고 소결을 촉진시키기 위해서 0.1 mol %의 Ca $Co_{3}$와 입자의 성장을 촉진시키고 높은 투자율을 얻을 목적으로 $V_{2}$ $O_{5}$를 0.04 mol% 첨가하였다. 이들 원료들을 혼합한 후 950 .deg. C에서 3시간 하소 과정을 거친후 ball mill해서 toroid 시편을 만들고 1030 .deg. C, 1050 .deg. C 및 1070 .deg. C 에서 2시간 동안 공기중에서 소결 시켰다. Raw material의 조성비 변화 및 소결 온도 변화에 따른 여러 가지 물리적 특성들을 조사하였다. X-선 회절 분석 결과 이들 시편들이 spinel 구조를 이루고 있음을 확인하였고 금속현미경으로 측정한 결정 입자의 크기는 6 .mu. m ~ 16 .mu. m 이었다. 초투자율, 자기 유도는 소결 온도가 1030 .deg. C에서 1050 .deg. C로 증가함에 따라 증가하였고 Q factor와 보자력은 감소하였다. 보자력과 큐리온도는 각각 0.17 Oe 및 220 .deg. C 근처로 모든 시편들에서 거의 비슷하였다. 본 시편의 사용 주파수 범위는 0.4 ~ 20 MHz로 확인되었으며, 소결 온도 1050 .deg.C와 기본 조성 N $i_{0.14}$Z $n_{0.64}$C $u_{0.22}$F $e_{2}$ $O_{4}$ 에서 다른 사람들 보다 더욱 더 우수한 자기유도값(B, $B_{m}$ )을 얻을 수 있었다.

• 한국운동역학회지
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• 제19권1호
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• pp.67-75
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• 2009

이 연구는 목표위치가 볼링투구동작에 미치는 영향을 분석하는데 그 목적이 있다. 이를 위해서 볼링경력이 4년이상의 여자 고교선수 4명을 대상으로 비디오카메라를 이용한 3차원영상을 통해 볼링투구동작을 분석하였다. 이 결과를 보면, 1번 핀을 처리할 때는 목표위치를 향하여 고관절회전각은 다운스윙에서 백스윙정점까지 크게 유지하고 있는 것을 알 수 있었다. 7번 핀을 처리할 때는 투구하는 오른쪽 어깨측에 대하여 7번 핀은 좌측에 위치하고 있기 때문에 연구대상자의 볼중심위치의 좌우이동이 가장 낮게 나타났고, 릴리즈구간에서 소요시간과 수평속도가 가장 높게 나타났다. 어깨기울기각은 백스윙정점에서 릴리즈구간으로 갈수록 크게 증가하였으며, 좌측방향으로 투구동작이 이루어지고 있기 때문에 어깨회전각이 작게 나타나는 것을 알 수 있었다. 10번 핀을 처리할 때는 릴리즈구간에서 어깨회전각과 동체뒤틀림각이 가장 크게 나타나는 것을 알 수 있었다. 따라서 목표위치는 볼링투구동작에 영향을 미친다고 할 수 있다.

• 한국운동역학회지
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• 제19권1호
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• pp.149-157
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• 2009

본 연구의 목적은 한국의 대표적인 배드민턴화(A Type)와 외국 배드민턴 브랜드제품(B Type)의 생체역학적인 변인들을 비교함으로서 한국제품의 착화감과 기능을 향상시켜 세계적인 수준의 배드민턴화 개발에 일조하는데 목적을 두었다. 분석변인들로는 동작 간 신발 안에서 발의 상대적인 움직임, 지면반력과 압력분포, 아웃솔의 마찰력등을 분석하였다. 또한 17명의 피험자를 통한 주관적인 착화감과 기능에 관련된 주관적인 실험이 실시되었다. A Type 배드민턴화의 경우 높은 뒤꿈치의 위치와 밋밋한 뒷굽의 형태로 신발 안에서 뒤꿈치를 잘 잡아주지 못하는 것으로 나타났다. 따라서 A Type 배드민턴화가 약 40%이상 발이 신발 안에서의 미끄러짐 현상이 일어났으며 충격력의 형태나 최대 압력분포도 높게 나타났다. Type A 신발의 경우 Type B와 같이 자연스러운 굴곡이 발의 볼쪽에서 일어나지 않고 전족부근에서 일어났다. 요약을 하면, 두 신발 간에 몇몇 차이점들이 발견되었고 A Type 배드민턴화의 기능을 향상하기 위해서 보완가능 요인들이 제시되었다.

• Parasites, Hosts and Diseases
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• 제56권3호
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• pp.275-280
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• 2018

In the present study, we identified a Spirometra species of Myanmar origin (plerocercoid) by molecular analysis using mitochondrial cox1 and nad1 genes, as well as by morphological observations of an adult tapeworm. Spargana specimens were collected from a paddy-field in Taik Kyi Township Tarkwa Village, Yangon, Myanmar in December 2017. A total of 5 spargana were obtained from 20 frogs Hoplobatrachus rugulosus; syn: Rana rugulosa (Wiegmann, 1834) or R. tigrina (Steindachner, 1867). The plerocercoids were used for experimental infection of a dog. After 4 weeks of infection, an adult tapeworm was recovered from the intestine of the dog. Morphologically, the distinct features of Spirometra sp. (Myanmar origin) relative to S. erinaceieuropaei and S. decipiens include a uterine morphology comprising posterior uterine coils that larger than the terminal uterine ball and coiling of the uteri diagonally (swirling) rather than spirally. The cox1 sequences (1,566 bp) of the Myanmar-origin Spirometra species showed 97.9% similarity to a reference sequence of S. decipiens (GenBank no. KJ599679) and 90.5% similarity to a reference sequence of S. erinaceieuropaei (GenBank no. KJ599680). Phylogenetic tree topologies were identical and presented high confidence level of values for the 3 major branches of the 3 Spirometra species in cox1 and nad1 genes. These results indicated that Myanmar-origin Spirometra species coincided with those of S. ranarum and may be considered as a valid species.

• Journal of Welding and Joining
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• 제30권5호
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 한국재료학회지
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• 제7권1호
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• pp.40-49
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• 1997

기계적 합금화 공정과 가압소결법으로 $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ 열전재료를 제조하여, 가압소결온도 및 dopant첨가에 따른 미세구조와 열전특성의변화를 연구하였다. 평균 3.6mm 크기의 Bi, Te, Se granule을 볼과 원료금속의 무게비 5:1에서 3 시간 기계적 합금화 하므로써 $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ 합금분말의 형성이 완료되었다. $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ 가압소결체의 성능지수는 $450^{\circ}C$ 이상의 온도에서 가압소결시 급격히 증가하였으며, $550^{\circ}C$에서 가압소결한 시편에서 $1.9{\times}10^{-3}/K$의 값을 얻었다. $550^{\circ}C$에서 가압소결한 $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$의 성능지수는 acceptor dopant 인 Bi를 0.015wt %첨가함에 따라 $2.1{\times}10^{-3}/K$로 향상되었다.

• 한국분말재료학회지
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• 제24권2호
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• pp.133-140
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• 2017

This study investigates the oxidation properties of Fe-14Cr ferritic oxide-dispersion-strengthened (ODS) steel at various high temperatures (900, 1000, and $1100^{\circ}C$ for 24 h). The initial microstructure shows that no clear structural change occurs even under high-temperature heat treatment, and the average measured grain size is 0.4 and $1.1{\mu}m$ for the as-fabricated and heat-treated specimens, respectively. Y-Ti-O nanoclusters 10-50 nm in size are observed. High-temperature oxidation results show that the weight increases by 0.27 and $0.29mg/cm^2$ for the as-fabricated and heat-treated ($900^{\circ}C$) specimens, and by 0.47 and $0.50mg/cm^2$ for the as-fabricated and heat-treated ($1000^{\circ}C$) specimens, respectively. Further, after 24 h oxidation tests, the weight increases by 56.50 and $100.60mg/cm^2$ for the as-fabricated and heat-treated ($1100^{\circ}C$) specimens, respectively; the latter increase is approximately 100 times higher than that at $1000^{\circ}C$. Observation of the surface after the oxidation test shows that $Cr_2O_3$ is the main oxide on a specimen tested at $1000^{\circ}C$, whereas $Fe_2O_3$ and $Fe_3O_4$ phases also form on a specimen tested at $1100^{\circ}C$, where the weight increases rapidly. The high-temperature oxidation behavior of Fe-14Cr ODS steel is confirmed to be dominated by changes in the $Cr_2O_3$ layer and generation of Fe-based oxides through evaporation.