• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Materials Research
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• v.7 no.1
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• pp.40-49
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• 1997

$Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ thermoelectric matcrials havc 11et:n fahricxted hy mechanical alloying and hot pressing methods. Microstructure and thermoelectric properties of the hot 11resseii $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ have been investigated Lvith variations of hot pressing temperature and dopmt atltiition Formation of $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ alloy powders was completed by mechanical alloying of the as-mixed Ri. Te, arid Sc grmules of ~3.6mm size for 3 hours at ball-to-material weight ratio of 5 : 1. Figure of merit of $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ was markedly incrcwieti hy hot pressing at temperatures above $450^{\circ}C$, and value of $1.9{\times}10^{-3}/K$ was obtained for the specimen hot pressed at $550^{\circ}C$. With addition of 0.015 wt% Ri as acceptor dopant, figure of merit ol $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ hot pressed $550^{\circ}C$$2.1{\times}10^{-3}/K$.

• Journal of Powder Materials
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• v.24 no.2
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• pp.133-140
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• 2017

This study investigates the oxidation properties of Fe-14Cr ferritic oxide-dispersion-strengthened (ODS) steel at various high temperatures (900, 1000, and $1100^{\circ}C$ for 24 h). The initial microstructure shows that no clear structural change occurs even under high-temperature heat treatment, and the average measured grain size is 0.4 and $1.1{\mu}m$ for the as-fabricated and heat-treated specimens, respectively. Y-Ti-O nanoclusters 10-50 nm in size are observed. High-temperature oxidation results show that the weight increases by 0.27 and $0.29mg/cm^2$ for the as-fabricated and heat-treated ($900^{\circ}C$) specimens, and by 0.47 and $0.50mg/cm^2$ for the as-fabricated and heat-treated ($1000^{\circ}C$) specimens, respectively. Further, after 24 h oxidation tests, the weight increases by 56.50 and $100.60mg/cm^2$ for the as-fabricated and heat-treated ($1100^{\circ}C$) specimens, respectively; the latter increase is approximately 100 times higher than that at $1000^{\circ}C$. Observation of the surface after the oxidation test shows that $Cr_2O_3$ is the main oxide on a specimen tested at $1000^{\circ}C$, whereas $Fe_2O_3$ and $Fe_3O_4$ phases also form on a specimen tested at $1100^{\circ}C$, where the weight increases rapidly. The high-temperature oxidation behavior of Fe-14Cr ODS steel is confirmed to be dominated by changes in the $Cr_2O_3$ layer and generation of Fe-based oxides through evaporation.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.7 no.3
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• pp.175-182
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• 2009

The spent cationic exchange resins and anionic exchange resins were separated from mixed spent exchange resins by a fluidized bed gravimetric separator. The separated resins were identified by an elemental analysis and thermogravimetric analysis. The each test sample was prepared by diluting the slurry made by wet ball milling the cationic exchange resins and the anionic exchange resins separated as a spherical granular form for 24 hours. The resulting test samples showed a slurry form of less than $75{\mu}m$ of particle size and 25,000ppm of $COD_{cr}$. The decomposition conditions of each test samples from a thermal power plant were obtained with a lab-scale(reactor volume : 220mL) supercritical water oxidation(SCWO) facility. Then pilot plant(reactor volume : 24 L) tests were performed with the test samples from a thermal power plant and a nuclear power plant successively. Based on the optimal decomposition conditions and the operation experiences by lab-scale facility and the pilot plant, a commercial plant(capacity : 150kg/h) can be installed in a nuclear power plant was designed.

• Journal of the Korean institute of surface engineering
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• v.46 no.2
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• pp.68-74
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• 2013

For the coating of diamond films on WC-Co tools, a buffer interlayer is needed because Co catalyzes diamond into graphite. W and Ti were chosen as candidate interlayer materials to prevent the diffusion of Co during diamond deposition. W or Ti interlayer of $1{\mu}m$ thickness was deposited on WC-Co substrate under Ar in a DC magnetron sputter. After seeding treatment of the interlayer-deposited specimens in an ultrasonic bath containing nanometer diamond powders, $2{\mu}m$ thick nanocrystalline diamond (NCD) films were deposited at $600^{\circ}C$ over the metal layers in a 2.45 GHz microwave plasma CVD system. The cross-sectional morphology of films was observed by FESEM. X-ray diffraction and visual Raman spectroscopy were used to confirm the NCD crystal structure. Micro hardness was measured by nano-indenter. The coefficient of friction (COF) was measured by tribology test using ball on disk method. After tribology test, wear tracks were examined by optical microscope and alpha step profiler. Rockwell C indentation test was performed to characterize the adhesion between films and substrate. Ti and W were found good interlayer materials to act as Co diffusion barriers and diamond nucleation layers. The COFs on NCD films with W or Ti interlayer were measured as less than 0.1 whereas that on bare WC-Co was 0.6~1.0. However, W interlayer exhibited better results than Ti in terms of the adhesion to WC-Co substrate and to NCD film. This result is believed to be due to smaller difference in the coefficients of thermal expansion of the related films in the case of W interlayer than Ti one. By varying the thickness of W interlayer as 1, 2, and $4{\mu}m$ with a fixed $2{\mu}m$ thick NCD film, no difference in COF and wear behavior but a significant change in adhesion was observed. It was shown that the thicker the interlayer, the stronger the adhesion. It is suggested that thicker W interlayer is more effective in relieving the residual stress of NCD film during cooling after deposition and results in stronger adhesion.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.4
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• pp.516-530
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• 1999

The current clinical technique for occlusal vertical dimension recording is based on marking the skin reference points on the patient's face and measuring between these points using caliper-like device. And it is difficult to achieve reliable measurements by this technique because of movable soft tissue. The purpose of this study is to reveal the stability of skin reference points by comparing the relative movement between extra-oral skin reference points and intra-oral reference points using X-ray fluoroscope. 10 test subjects were divided into 2 groups : Group I (natural dentition) and Group II (denture-wearer whose vertical dimension was lost) and Group III consists of identical test subjects to Group II with their upper denture removed and record base inserted. Attaching the 3 mm diameter steel ball to nose tip, lower lip, chin and to existing denture (or record base), fluoroscopic examination and recording were taken during 2 jaw opening and closing movements. After subsequent digitization using personal computer, 1219 still pictures with 0.1 second interval were made. Using the 2 dimensional graphic software, measurements between reference points were executed. Dividing the entire jaw movement into 3 ranges (total, 1st half opening, 2nd half opening), rate of movement and relative movement between extra-oral and intra-oral reference points were calculated and statistically analyzed. The results of this study are as follows. 1 Within the same experimental group, no statistical difference was found in the stability of skin reference between lower lip point and chin point during total range of jaw opening and closing movement (p>.05) 2. In the first half range of jaw opening, statistical difference was found between Group I (natural dentition) and Group II (denture wearer) (p<.05) Group I has greater skin reference stability than Group II. 3. In the first half range of jaw opening, statistical difference was found between Group I and Group III (record base wearer) (p<.05). Group I has greater skin reference stability than Group III. 4. In the first half range of jaw opening, no statistical difference was found in the stability of skin reference between Group II and Group III (p>.05). 5. In the second half range of jaw opening, no statistical difference was found in the stability of skin reference between any experimental groups (p>.05). 6. In patients with their occlusal vertical dimension lost, employing other measuring references rather than skin is recommended because of low stability.

• Journal of The Korean Association For Science Education
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• v.19 no.1
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• pp.8-18
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• 1999

The purpose of this study is to investigate middle school student's conceptual change about Force and Motion by the courseware based on constructivism. It is well known to science educators that misconcrptions about physics concepts are hardly changed into scientific ones. So as to change student's misconceptions about force and motion, the courseware was developed through the analysis of students' conceptions. 20 students were tested before and after learning through the courseware. One of the questions was about the direction of force acting on the ball thrown in the air when it is rising, at the top, and falling. The other was about the magnitudes and directions of forces acting on a car when it is accelerating, in uniform velocity, and decelerating. The results are as follows: In case of vertical motion, all students had misconceptions before learning, but after learning 5 students(25%) have changed their ideas into scientific ones. In case of horizontal motion, 9(45%) out of 20 students who had misconceptions about force and motion have changed their ideas into scientific ones.

• Journal of Dental Rehabilitation and Applied Science
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• v.29 no.3
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• pp.249-258
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• 2013

The purpose of this study was to investigate how image magnification in dental panoramic radiography is influenced by object position. Five metal balls (4 mm in diameter, 2 for the anterior and 3 for the posterior region on the right side) were placed above alveolar crest of dry skull considering extraction socket and dental arch. Dry skull was radiographed using OP-100D (Instrumentarium Imaging Co., Tuusula, Finland) at proper and displaced position along the sagittal and transverse plane at 3 mm, 6 mm, 9 mm, 12 mm and 15 mm using special mount which can control precise movement. Images were stored in DICOM files and were measured by ruler equipped within INFINITT PACS software (Infinitt Co., Ltd., Seoul, Korea). The mean horizontal magnification was 1.224-1.439 and mean vertical magnification was 1.286 - 1.345 at proper position. Vertical magnification resulted in less variation (1.245-1.418) than horizontal magnification (0.798-6.297) according to the sagittal and transverse displacements. Head positioning is important for linear measurement on panoramic radiography and inclusion of standard object (for instance, metal ball) is helpful to anticipate exact magnification of panoramic radiographs at various location.

• Tuberculosis and Respiratory Diseases
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• v.73 no.2
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• pp.107-114
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• 2012

Background: This study attempted to investigate the main causes of hemoptysis, the type of examinations used for diagnosis, the treatment modalities and outcomes. Methods: A retrospective study was conducted on the medical records of 221 patients admitted to the Chonnam National University Hospital, between January 2005 and February 2010, with hemoptysis. Results: Bronchiectasis (32.6%), active pulmonary tuberculosis (18.5%), fungus ball (10.8%), and lung cancer (5.9%) accounted for most causes of hemoptysis. Computed tomography scan was the most sensitive diagnostic test when employed alone, with positive yield of 93.2%. There were 161 cases of conservative treatment (72.9%), 42 cases of bronchial artery embolization (BAE) (19.0%), and 18 cases of surgery (8.1%). Regarding the amount of hemoptysis, 70 cases, out of 221 cases, were mild (31.5%), 36 cases moderate (16.2%), and 115 cases massive hemoptysis (52.0%). Most of the patients were treated conservatively, but if there was more bleeding present, BAE or surgery was more commonly performed than the conservative treatment ($p{\leq}0.0001$). In the multivariate model, severe hemoptysis and lung cancer were independently associated with short-term recurrence. BAE was independently associated with long-term recurrence, and lung cancer was associated with in-hospital mortality. The overall in-hospital mortality rate was 11.3%. Conclusion: Hemoptysis is a common symptom with a good prognosis in most cases. However, patients exhibiting massive bleeding or those with malignancy had a poorer prognosis. In-hospital mortality was strongly related to the cause, especially in lung cancer.