• Title/Summary/Keyword: automotive semiconductor

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CFD Analysis on the Flow Characteristics with Flow Coefficient in a PFA Lined Ball Valve for Different Opening Degrees (개폐각도에 따른 PFA 라이닝 볼밸브의 유동특성 및 유랑계수 전산해석)

  • Jeon, Hong-Pil;Kim, Dong-Yoel;Lee, Jong-Chul
    • The KSFM Journal of Fluid Machinery
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    • v.17 no.4
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    • pp.76-80
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    • 2014
  • PFA fluoropolymer lined technology revolutionized ball valve development and design decades ago and continues to be pivotal for many products and valve solutions in diverse industries and applications, such as chemical process, semiconductor/LCD manufacturing processes, pharmaceutical and others. Because of the extreme operating conditions such as high-temperature (${\sim}120^{\circ}C$) and high-pressure (~10 bar), the reliability of the valve is very important for minimizing in-line leakage and fugitive emissions of strong corrosive chemicals (hydrochloric acid, hydrofluoric acid, nitric acid, etc.) transported through the lines. In this study, we investigated the flow characteristics with flow coefficient in a PFA lined ball valve for different opening degrees using CFD analyses. The results should be the guidance for a new PFA lined ball valve design that will incorporate all the acclaimed and demonstrated benefits of the current design approaches.

Design of Manufacturing Data Analysis System using Data Mining Techniques (데이터마이닝 기법을 이용한 생산데이터 분석시스템 설계)

  • Lee H.W.;Lee G.A.;Choi S.;Park H.K.;Bae S.M.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.611-612
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    • 2006
  • Many data mining techniques have been proved useful in revealing important patterns from large data sets. Especially, data mining techniques play an important role in a customer data analysis in a financial industry and an electronic commerce. Also, there are many data mining related research papers in a semiconductor industry and an automotive industry. In addition, data mining techniques are applied to the bioinformatics area. To satisfy customers' various requirements, each industry should develop new processes with more accurate production criteria. Also, they spend more money to guarantee their products' quality. In this manner, we apply data mining techniques to the production-related data such as a test data, a field claim data, and POP (point of production) data in the automotive parts industry. Data collection and transformation techniques should be applied to enhance the analysis results. Also, we classify various types of manufacturing processes and proposed an analysis scheme according to the type of manufacturing process. As a result, we could find inter- or intra-process relationships and critical features to monitor the current status of the each process. Finally, it helps an industry to raise their profit and reduce their failure cost.

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Study on Heat Transfer Characteristics by Heater Conditions of Hydrogen Sensor for Fuel Cell Electric Vehicle (연료전지 자동차용 수소센서의 히터 조건에 따른 열전달 특성에 관한 연구)

  • Suh, Hocheol;Park, Kyoungsuk
    • Transactions of the Korean Society of Automotive Engineers
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    • v.21 no.1
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    • pp.23-29
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    • 2013
  • In recent years, development of energy conversion systems using hydrogen as an energy source has been accelerated globally. Even though hydrogen is an environment-friendly energy source, safety and effectiveness issues in storage, transportation, and usage of hydrogen should be clearly resolved in every application. Therefore, sensors for detecting hydrogen leakage, especially for fuel cell electric vehicles, should be designed to have much higher resolution and accuracy in comparison with conventional gas sensors. In this study, we conducted to determine the design parameters for the semiconductor hydrogen sensor with optimized sensing conditions under the thermal distribution characteristic and thermal transfer characteristic. The heat generation study on power supply voltage was studied for correlation analysis of thermal energy according to the power supply voltage variation from 1.0 voltage to 10.0 voltage every 0.5 voltage. And we studied for the temperature coefficient of resistance with hydrogen sensor.

Study on the Fugitive Emissions of a PFA Lined Ball Valve through Helium Leak Detection (PFA 라이닝 볼밸브의 헬륨누설 검출 및 비산배출에 관한 연구)

  • Lee, Won-Ho;Kim, Dong-Yeol;Lee, Jong-Chul
    • The KSFM Journal of Fluid Machinery
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    • v.19 no.4
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    • pp.39-42
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    • 2016
  • A PFA lined ball valve, which is machined with fluorinated resin PFA to its inner part for improving corrosion resistance, non-stickness, heat-resistance, has been widely used to the chemical/pharmaceutical industries, the semiconductor/LCD manufacturing processes, etc. with the high purity chemicals as working fluid. EPA stated that 60% of all fugitive emissions come from the valve stem packing in a typical petroleum or chemical processing plant. They monitor regulated components for leaks and maintain seal performance at acceptable levels. Korean industrial standards only deals with the bubble test for in-line leakage of valves, which has the detectable leak rate of $10^{-4}$ [$mbar{\cdot}L{\cdot}s^{-1}$], therefore, it is not sufficient to check fugitive emissions. In this study, we conducted Helium leak detection from a PFA lined ball valve and evaluated fugitive emissions according to ISO 15848-1, which has the detectable leak rate of $10^{-9}$ [$mbar{\cdot}L{\cdot}s^{-1}$], for manufacturing the high-reliable PFA lined ball valves against fugitive emissions.

A Study of Fatigue Lifetime Evaluation on the Interconnect of Semiconductor Pressure Sensor According to the Various Materials (재료에 따른 반도체 압력 센서 배선의 피로 수명 평가에 관한 연구)

  • Shim Jae-Joon;Han Dong-Seop;Han Geun-Jo;Lee Sang-Suk
    • Journal of Navigation and Port Research
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    • v.29 no.10 s.106
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    • pp.871-876
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    • 2005
  • Application of semiconductor sensors has been widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis. The Fatigue lifetime in its bottom is smaller than others and bending load have not an effect on the fatigue lifetime of the interconnect but the stress distribution.

Diagnosis Method for Stator-Faults in Induction Motor using Park's Vector Pattern and Convolution Neural Network (Park's Vector 패턴과 CNN을 이용한 유도전동기 고정자 고장진단방법)

  • Goh, Yeong-Jin;Kim, Gwi-Nam;Kim, YongHyeon;Lee, Buhm;Kim, Kyoung-Min
    • Journal of IKEEE
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    • v.24 no.3
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    • pp.883-889
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    • 2020
  • In this paper, we propose a method to use PV(Park's Vector) pattern for inductive motor stator fault diagnosis using CNN(Convolution Neural Network). The conventional CNN based fault diagnosis method was performed by imaging three-phase currents, but this method was troublesome to perform normalization by artificially setting the starting point and phase of current. However, when using PV pattern, the problem of normalization could be solved because the 3-phase current shows a certain circular pattern. In addition, the proposed method is proved to be superior in the accuracy of CNN by 18.18[%] compared to the previous current data image due to the autonomic normalization.

AN INTRODUCTION TO SEMICONDUCTOR INITIATION OF ELECTROEXPLOSIVE DEVICES

  • Willis K. E.;Whang, D. S.;Chang, S. T.
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 1994.11a
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    • pp.21-26
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    • 1994
  • Conventional electroexplosive devices (EED) commonly use a very small metal bridgewire to ignite explosive materials i.e. pyrotechnics, primary and secondary explosives. The use of semiconductor devices to replace “hot-wire” resistance heating elements in automotive safety systems pyrotechnic devices has been under development for several years. In a typical 1 amp/1 watt electroexplosive devices, ignition takes place a few milliseconds after a current pulse of at least 25 mJ is applied to the bridgewire. In contrast, as for a SCB devices, ignition takes place in a few tens of microseconds and only require approximately one-tenth the input energy of a conventional electroexplosive devices. Typically, when SCB device is driven by a short (20 $\mu\textrm{s}$), low energy pulse (less than 5 mJ), the SCB produces a hot plasma that ignites explosive materials. The advantages and disadvantages of this technology are strongly dependent upon the particular technology selected. To date, three distinct technologies have evolved, each of which utilizes a hot, silicon plasma as the pyrotechnic initiation element. These technologies are 1.) Heavily doped silicon as the resistive heating initiation mechanism, 2.) Tungsten enhanced silicon which utilizes a chemically vapor deposited layer of tungsten as the initiation element, and 3.) a junction diode, fabricated with standard CMOS processes, which creates the initial thermal environment by avalanche breakdown of the diode. This paper describes the three technologies, discusses the advantages and disadvantages of each as they apply to electroexplosive devises, and recommends a methodology for selection of the best device for a particular system environment. The important parameters in this analysis are: All-Fire energy, All-Fire voltage, response time, ease of integration with other semiconductor devices, cost (overall system cost), and reliability. The potential for significant cost savings by integrating several safety functions into the initiator makes this technology worthy of attention by the safety system designer.

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The Study of Fatigue Lifetime Evaluation on the Interconnect of semiconductor sensor according to the various materials (재료에 따른 반도체 센서 배선의 피로 수명 평가에 관한 연구)

  • Shim Jae-Joon;Ran Dong-seop;Ran Geun-Jo;Kim Tae-Hyung
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 2005.10a
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    • pp.283-288
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    • 2005
  • Application of semiconductor sensors has widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis.

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Advances in Power Semiconductor Devices for Automotive Power Inverters: SiC and GaN (전기자동차 파워 인버터용 전력반도체 소자의 발전: SiC 및 GaN)

  • Dongjin Kim;Junghwan Bang;Min-Su Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.2
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    • pp.43-51
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    • 2023
  • In this paper, we introduce the development trends of power devices which is the key component for power conversion system in electric vehicles, and discuss the characteristics of the next-generation wide-bandgap (WBG) power devices. We provide an overview of the characteristics of the present mainstream Si insulated gate bipolar transistor (IGBT) devices and technology roadmap of Si IGBT by different manufacturers. Next, recent progress and advantages of SiC metal-oxide-semiconductor field-effect transistor (MOSFET) which are the most important unipolar devices, is described compared with conventional Si IGBT. Furthermore, due to the limitations of the current GaN power device technology, the issues encountered in applying the power conversion module for electric vehicles were described.

Design of a Delayed Dual-Core Lock-Step Processor with Automatic Recovery in Soft Errors (소프트 에러 발생 시 자동 복구하는 이중 코어 지연 락스텝 프로세서의 설계)

  • Juho Kim;Seonghyun Yang;Seongsoo Lee
    • Journal of IKEEE
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    • v.27 no.4
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    • pp.683-686
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    • 2023
  • In this paper, we designed a Delayed Dual Core Lock-Step (D-DCLS) processor where two cores operate same instructions with delay and the result is compared to mitigate soft errors and common mode failures in automotive electronic systems. Because D-DCLS does not know which core an error occurred in, each core must be recovered to the point before the error occurred, but complex hardware modifications are required to return all intermediate values on the pipeline stage. In this paper, in order for easy hardware implementation, all register values are saved to a buffer whenever a branch instruction is executed. When an error is detected, the saved register values are automatically restored, and then 'BX LR' instruction is executed to return to the last branch point. The proposed D-DCLS processor was designed using Verilog HDL and was confirmed to continue normal operation after automatically recovering error.