• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.10
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• pp.5906-5911
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• 2014

Currently, there are many processes of package assembly and inspections of real fields that examine whether a manufactured semiconductor can be operated regularly and can endure low humidity or high temperatures. As the inspection equipment of a semiconductor test handler picker has been used at the inspection process, these inspection equipment frames were modelled in 3D and these models were analyzed using 3 kinds of fatigue loadings. As the analysis result, maximum deformation occurred at the midparts of the frames at cases 1 and 2. Among the cases of nonuniform fatigue loads, the 'SAE bracket history' with the severest change in load became the most unstable but the 'Sample history' became the most stable. Fatigue analysis result can be used effectively with the design of an inspecting equipment frame of a semiconductor test handler picker to examine the prevention and durability against damage.

• Journal of IKEEE
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• v.27 no.4
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• pp.524-530
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• 2023

This paper proposes an efficient algorithm to detect CAN (Controller Area Network) bus attack based on a lightweight CNN (Convolutional Neural Network), and an IDS(Intrusion Detection System) was designed, implemented, and verified with FPGA. Compared to conventional CNN-based IDS, the proposed IDS detects CAN bus attack on a frame-by-frame basis, enabling accurate and rapid response. Furthermore, the proposed IDS can significantly reduce hardware since it exploits only one convolutional layer, compared to conventional CNN-based IDS. Simulation and implementation results show that the proposed IDS effectively detects various attacks on the CAN bus.

• Journal of IKEEE
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• v.28 no.1
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• pp.6-13
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• 2024

This paper proposes an approach to detect abnormal data in automotive controller area network (CAN) using an unsupervised learning model, i.e. autoencoder and Gaussian kernel density estimation function. The proposed autoencoder model is trained with only message ID of CAN data frames. Afterwards, by employing the Gaussian kernel density estimation function, it effectively detects abnormal data based on the trained model characterized by the optimally determined number of frames and a loss threshold. It was verified and evaluated using four types of attack data, i.e. DoS attacks, gear spoofing attacks, RPM spoofing attacks, and fuzzy attacks. Compared with conventional unsupervised learning-based models, it has achieved over 99% detection performance across all evaluation metrics.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.29-34
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• 2006

In order to design an OLED(Organic Luminescent Emitting Device) evaporation system, geometric simulation of film thickness distribution profile is required. For the OLED evaporation process, thin film thickness uniformity is of great practical importance. In this paper, a geometric modeling algorithm is introduced for process simulation of the OLED evaporating process. The physical fact of the evaporating process is modeled mathematically. Based on the developed method, the thickness of the thin-film layer can be successfully controlled.

• Journal of the korean Society of Automotive Engineers
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• v.14 no.5
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• pp.107-116
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• 1992

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circle and medical world. An Ultrasonic wave transmitted from a focused beam tranducer is being expected as a powerful tool for NDE of the delamination. The Ultrasonic NDE of the delamination is based on the form of the wave reflected from the interface. In this study results, automatically repeated discrimination analysis method can be devided in the category of all kinds of defects on semiconductor package, and also can be possible to have a sampling of partial delamination.

• Journal of Practical Engineering Education
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• v.7 no.2
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• pp.125-134
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• 2015

The purpose of this study is to develop semiconductor equipment maintenance technician train program for the effective train of professional maintenance technician in the semiconductor industry. To achieve the purpose, both of the actual condition survey and the literature investigation had been proceeded for the prediction of educational train manpower requirements in the field of semiconductor equipment maintenance in and outside the country. In addition, tasks and education contents were also analyzed through job analysis. Based on the result, we suggest that the education program for semiconductor equipment maintenance technician train.

• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.39-43
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• 2008

Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

• 한국가시화정보학회:학술대회논문집
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• 2002.11a
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• pp.53-54
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• 2002

Plasma ignition method has been applied in various fields particularly to the rocket propulsion, pyrotechnics, explosives, and to the automotive air-bag system. Ignition method for those applications should be safe and also operate reliably in hostile environments such as; electromagnetic noise, drift voltage, electrostatic background and so on. In the present study, a semiconductor bridge (SCB) plasma ignition device was fabricated and its plasma characteristics including the propagation speed of the plasma, plasma size, and plasma temperature were investigated with the aid of the visualization of micro scale plasma $(i.e.,\;\leq\;350\;{\mu}m)$, which generated from a Micro-Electro-Mechanical poly-silicon semiconductor bridge (SCB).

• International journal of advanced smart convergence
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• v.13 no.2
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• pp.25-34
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• 2024

The paper investigates how the semiconductor and electric vehicle industries are addressing safety and security concerns in the era of autonomous driving, emphasizing the prioritization of safety over security for market competitiveness. Collaboration between these sectors is deemed essential for maintaining competitiveness and value. The research suggests solutions such as advanced autonomous driving technologies and enhanced battery safety measures, with the integration of AI chips playing a pivotal role. However, challenges persist, including the limitations of big data and potential errors in semiconductor-related issues. Legacy automotive manufacturers are transitioning towards software-driven cars, leveraging artificial intelligence to mitigate risks associated with safety and security. Conflicting safety expectations and security concerns can lead to accidents, underscoring the continuous need for safety improvements. We analyzed the expansion of electric vehicles as a means to enhance safety within a framework of converging security concerns, with AI chips being instrumental in this process. Ultimately, the paper advocates for informed safety and security decisions to drive technological advancements in electric vehicles, ensuring significant strides in safety innovation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.1
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• pp.48-55
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• 2017

This paper proposes a new link structure that transmits power, clock, and data through a single optical fiber for a future automotive network. A pulse-position modulation (PPM) technique is adopted to guarantee a DC-balanced signal for robust power transmission regardless of transmitted data pattern. Further, circuit implementations and theoretical analyses for the proposed PPM transceiver are described in this paper. A prototype transceiver fabricated in 65-nm CMOS technology, is used to verify the PPM signaling part of the proposed system. The prototype achieves a $10^{-13}$ bit-error rate and 0.188-UI high frequency jitter tolerance while consuming 14 mW at 800 Mb/s.