• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3319-3325
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• 2012

This paper describes the development of the TrackSim, which is a discrete event simulation tool for photolithography equipment of semiconductor industry. The TrackSim is focused on the accurate simulation model of the photolithography equipment and easy-to-use user interfaces. TrackSim provides 3D simulation environment for evaluating, validating, and scheduling the photolithography process. One of the major characteristics of TrackSim is in that it is developed based on Applied Materials' AutoMod, a discrete event simulation software broadly used in semiconductor industry. Accordingly, the photolithography model of TrackSim can be used to perform simulation connected with other simulation models built with AutoMod.

• Korean Journal of Optics and Photonics
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• v.32 no.3
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• pp.101-107
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• 2021

In this paper, a study of the design of automotive communication lamps using microlens arrays (MLAs) was conducted. With the development of autonomous driving technology, automobiles need communication lamps to communicate with pedestrians. To reduce the size of the optical system and secure high light intensity, the communication lamp's optical system was designed using an MLA. In addition, to secure a clear image on inclined ground, the design was carried out considering the overlap method. After that, the improved performance was confirmed by comparing it to the MLA optical system before overlapping.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.16-21
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• 2017

In this paper, the effect of battery-package shape of electric vehicle on the forced convection around a group of battery cells has been numerically investigated. Simulations for the two package shapes with straight/curved ducts have been conducted to examine the two design factors; the maximum temperature and the temperature deviation of a group of cells which influence the cell durability. The simulation of the conjugate heat transfer has been simplified by employing an equivalent thermal conductivity of cell that consists of various materials. It has been found that the maximum temperature and the temperature deviation of curved duct were lower than those of straight duct. Velocity fields have also been examined to describe the temperature distribution of a group of cells and the position of maximum temperature was found to be related to the dead zone of flow field.

• Journal of IKEEE
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• v.27 no.4
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• pp.368-378
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• 2023

Automotive headlamp with LED matrix exploits low-cost low-speed serial buses such as I2C and SPI for digital LED control. When headlamp resolution increases, LED control data significantly increases to exceed capacity of control bus. This paper proposes HLCP (Headlamp LED Control Protocol), a novel LED maxtrix headlamp protocol. The proposed protocol exploits dedicated instructions to control many LEDs simultaneously, so it can control much more LEDs than conventional control buses although it is basically based on I2C bus. It is designed and verified in Verilog HDL. Simulation results show that HLCP can control LED matrix headlamp more efficiently than I2C and SPI.

• Journal of Technology Innovation
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• v.26 no.3
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• pp.37-68
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• 2018

Since the 20th century, automobiles, which are the most common means of transportation, have been evolving as the use of electronic control devices and automotive semiconductors increases dramatically. Automotive semiconductors are a key component in automotive electronic control devices and are used to provide stability, efficiency of fuel use, and stability of operation to consumers. For example, automotive semiconductors include engines control, technologies for managing electric motors, transmission control units, hybrid vehicle control, start/stop systems, electronic motor control, automotive radar and LIDAR, smart head lamps, head-up displays, lane keeping systems. As such, semiconductors are being applied to almost all electronic control devices that make up an automobile, and they are creating more effects than simply combining mechanical devices. Since automotive semiconductors have a high data rate basically, a microprocessor unit is being used instead of a micro control unit. For example, semiconductors based on ARM processors are being used in telematics, audio/video multi-medias and navigation. Automotive semiconductors require characteristics such as high reliability, durability and long-term supply, considering the period of use of the automobile for more than 10 years. The reliability of automotive semiconductors is directly linked to the safety of automobiles. The semiconductor industry uses JEDEC and AEC standards to evaluate the reliability of automotive semiconductors. In addition, the life expectancy of the product is estimated at the early stage of development and at the early stage of mass production by using the reliability test method and results that are presented as standard in the automobile industry. However, there are limitations in predicting the failure rate caused by various parameters such as customer's various conditions of use and usage time. To overcome these limitations, much research has been done in academia and industry. Among them, researches using data mining techniques have been carried out in many semiconductor fields, but application and research on automotive semiconductors have not yet been studied. In this regard, this study investigates the relationship between data generated during semiconductor assembly and package test process by using data mining technique, and uses data mining technique suitable for predicting potential failure rate using customer bad data.

• Journal of the Semiconductor & Display Technology
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• v.7 no.3
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• pp.23-27
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• 2008

The Paper presents some potential new uses for Head-Up Displays (HUDs) in vehicular applications, where the information conveyed to the driver goes well beyond the content of today's production HUDs. Such information potentially related to the use of cellular telephones, navigation systems, vehicle to roadside communications systems, and many others. Improvements in flat panel display technologies are enabling the presentation of larger, more reconfigurable, more daylight-viewable HUD images. In addition, A Formal test and evaluation is proposed to ensure that new information displays support the driver tasks. The above developments suggest increased future opportunities for HUDs to present useful information in an as-needed, eyes-on-the-road manner.

• Journal of the Semiconductor & Display Technology
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• v.9 no.3
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• pp.11-16
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• 2010

The performance of an OLED fabrication system strongly depends on the design of the evaporation cell-source. Therefore, necessity of the preceding study for cell source development of new concept is becoming increase. A development plan to substitute for experiment is applied as use simulation. In this study interpret behavior of a particle through DSMC techniques, and in this paper presenting a form to make so as to have better performance of the pointtype cell source which had a nozzle.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2022.05a
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• pp.507-509
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• 2022

In order to collect vehicle internal diagnostic data, it is necessary to collect diagnostic data of ECU (Electronic Control Unit) included in various automotive parts. Diagnostic communication can be used to collect diagnostic data of ECU. In this paper, the method of collecting diagnostic data according to ECU function through standard diagnostic communication and the diagnostic communication module were analyzed. Among the standard modules of AUTOSAR, a standard for automotive electronics used by many automobile manufacturers, the diagnostic communication module was studied, and the process of diagnostic data processing through ECU was studied.

• Journal of IKEEE
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• v.27 no.4
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• pp.501-511
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• 2023

This paper introduces and analyzes SAE J2716 SENT (Single Edge Nibble Transmission) protocol, a technical standard for serial transmission of digital sensor data in automotive applications. SENT can transmit both high-speed sensor data and low-speed sensor data in one data frame and has a total of 6 transmission modes, including 3 high-speed channel modes and 3 low-speed channel modes. In this paper, a SENT controller that supports all six modes of the SENT protocol was designed in Verilog HDL, implemented in FPGA, and verified with an oscilloscope and PC.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.12-17
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• 2016

In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.