Thin Films Deposition Study Using Plasma Enhanced CVD with Low Dielectric Materials DEMS(diethoxymethlysiliane) below 45nm (PE-CVD를 이용한 45nm이하급 저유전물질 DEMS(Diethoxymethylsiliane) 박막증착연구)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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- pp.148-148
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- 2008