• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.711-714
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• 2004

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. However, it still has various problems to the CMP equipment, in particular, among the CMP components, process variables are very important parameters in determining the removal rate and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the interaction between the various parameters such as turntable and head speed, down force and back pressure during CMP. Using statistical analysis techniques, a better understanding of the interaction behavior between the various parameters and the effect on removal rate, no-uniformity and ETC (edge to center) is achieved.

• The Journal of Korean Academy of Prosthodontics
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• v.48 no.3
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• pp.209-214
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• 2010

Purpose: The purpose of this study was to investigate whether the re-osseointegration of the implants that had mechanical unscrewing possibly occurred or not. Furthermore, if it happened, the degree of re-osseointegration was evaluated by comparing with previous osseointegration. Materials and methods: The smooth implant (commercial pure titanium 99%) specimens, whose diameter and length was 3.75 mm, 4 mm, respectively were produced. Two implants were inserted into each tibia of 7 New Zealand female white rabbits weighing at least 3.0 kg. The torque removal force for each implant after 6 weeks of implants placement was measured and included in group I. The torque removal forces were assessed after the fixtures were re-screwed to original position and the subjects were allowed to have 4 more weeks for healing and included in group II. One rabbit was sacrificed after first measurement and produced 4 slide specimens in group I, and two rabbits were sacrificed after 2nd measurement, 7 slide specimens, in group II for histomorphologic investigations. All slide specimens were assessed based on the proportion of BIC (bone-implant contact) as well as CBa (Bone area in the cortical passage) value produced by counting the screw threads embedded in the compact bones under the optical microscopic analysis (${\times}20$). Statistical analysis was conducted to evaluate the torque removal force, BIC and CBa between group I and II. Results: As for the torque removal force, the result was $10.8{\pm}3.6$ Ncm for group I and $20.2{\pm}9.7$ Ncm for group II. Furthermore, the torque removal force of group II increased by 98.1% in average compared to group I (P<.05). On the other hand, histomorphologic analysis displayed that there was no statistical significance in BIC and CBa values between group I and the group II (P>.05), and RT/BIC and RT/CBa between group I and group II were statistically significant (P<.05). Conclusion: It is possible to obtain more substantial re-osseointegration within shorter periods than the period needed for the initial osseointegration in case of iatrogenically unscrewed implants.

• Journal of Advanced Marine Engineering and Technology
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• v.17 no.4
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• pp.20-27
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• 1993

Emulsified oily wastewater is generally hard to treat in separating oil and water by conventional separators. In this paper the magnetohydrodynamic water treatment device was used to separate oil from emulsified oily wastewater which contained high conductivity. The emulsified oil removal rates and economic ranges of oil separation at various factors were investigated to confirm the influence of the magnetic field in MHD water treatment device according to the characteristics of emulsion brake. Experimental results proved that the oil removal rates were proportional to Lorentz force which depends on the intensity of magnetic field, conductivity and velocity of wastewater.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.5
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• pp.669-682
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• 1998

The purpose of this study was to compare the retentive force of cast half round circumferential clasps, cast round circumferential clasps and wrought wire clasps on three different depths of undercut(10G,20G.30G), and to determine the proper amount of undercut for cast round circumferential clasp. Three different lower second premolar crowns were cast and each of clasp was made. Each of clasp affixed to the different types of clasp. Their retentive forces were measured with universal testing machine. The results were as follows : 1. When the depth of undercut was same, the greatest retentive force was exerted by cast half round circumferential clasp, followed by cast round - 33 - circumferential clasp and wrought wire clasp. 2. The degree of variation amount of retentive force according to depth of undercut was greatest for cast round circumferential clasp. 3. Not only elastic deformation but also permanent deformation of the retentive arm was observed after insertion and removal of the clasp. The results of this study show that the retentive force of cast round circumferential clasp falls between those of cast half round circumferential clasp and wrought wire clasp, and suggest that a 20G undercut is suitable for ensuring an appropriate degree of the retentive force.

• International Journal of Concrete Structures and Materials
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• v.5 no.1
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• pp.19-28
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• 2011

This paper documents an experimental study of dynamic response of reinforced concrete beams following instantaneous removal of a bearing column. Four half-scale specimens representing two-span beam bridging across the removed column were tested. The test boundary conditions simulated rotational and longitudinal restraints imposed on a frame beam by the neighboring structural components. The gravity loads were simulated by attaching mass blocks on the beams at three locations. Dynamic loading effects due to sudden removal of a column were simulated by quickly releasing the supporting force at the middle of the specimens. The experimental study investigated the load-carrying capacity of beams restrained longitudinally at the boundaries and dynamic impact on forces. The tests confirmed the extra flexural strength provided by compressive arch action under dynamic loading. The tests also indicated that the dynamic amplification effects on forces were much lower than that assumed in the current design guideline for progressive collapse.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.36 no.4
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• pp.695-704
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• 2016

Rubber deposited during aircraft landing is known as the main cause of reducing surface friction force on wet surfaces. Thus, rubber deposits are removed at regular intervals for sae airplane landing. The high-pressure waterblast method, widely used for the removal of rubber deposits, is regarded as the main cause for the loss of surface material because in this method, water hits the surface directly at a high pressure. In this study, a rubber removal primer is developed to reduce surface damage by lowering the pressure of waterblast relatively during the removal of rubber deposits such that the deposits are removed efficiently even with a lower water pressure. To achieve this, basic materials appropriate for the primer were selected and their performance, penetration rate, and site applicability were evaluated. Based on the evaluations, the proportion of additive required for improving the performance of the basic materials was first determined. Then, the optimum mix ratio was derived through the evaluation of the effect on pavements, and the development of the rubber removal primer was completed.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.33 no.5
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• pp.455-462
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• 2000

The objective of this study was to examine the physicochemical characteristics of coagulation reaction between loess and red tide organisms (RTO) and its feasibility, in developing a technology for the removal of RTO bloom in coastal sea. The physicochemical characteristics of loess were examined for a particle size distribution, surface characteristics by scanning electron microscope, zeta potential, and alkalinity and pH variations in sea water. Two kinds of RTO that were used in this study, Cylindrothen closterium and Skeietonema costatum, were sampled in Masan bay and were cultured in laboratory. Coagulation experiments were conducted using various concentrations of loess, RTO, and a jar tester. The supernatant and RTO culture solution were analyzed for pH, alkalinity, RTO cell number. A negative zeta potential of loess increased with increasing pH at $10^(-3)M$ NaCl solution and had -71.3 mV at pH 9.36. Loess had a positive zeta potential of +1,8 mV at pH 1.98, which resulted in a characteristic of material having an amphoteric surface charge. In NaCl and $CaCl_2$, solutions, loess had a decreasing negative zeta potential with increasing $Na^+\;and\;Ca^(+2)$ ion concentration and then didn't result in a charge reversal due to not occurring specific adsorption for $Na^+$ ion while resulted in a charge reversal due to occurring specific adsorption for $Ca^(+2)$ ion. In sea water, loess and RTO showed the similar zeta potential values of -112,1 and -9.2 mV, respectively and sea sand powder showed the highest zeta potential value of -25.7 mV in the clays. EDLs (electrical double-layers) of loess and RTO were extremely compressed due to high concentration of salts included in sea water, As a result, there didn't almost exist EDL repulsive force between loess and RTO approaching each other and then LVDW (London-yan der Waals) attractive force was always larger than EDL repulsive force to easily form a floe. Removal rates of RTO exponentially increased with increasing a loess concentration. The removal rates steeply increased until $800 mg/l$ of loess, and reached $100{\%}$ at 6,400 mg/l of loess. Removal rates of RTO exponentially increased with increasing a G-value. This indicated that mixing (i.e., collision among particles) was very important for a coagulation reaction. Loess showed the highest RTO removal rates in the clays.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.227-230
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• 2004

As the organic acids were added in the slurry, zeta potential of alumina was changed to negative value and IEP value was shifted from alkaline to acidic pH. In citric acid based slurry, Cu surface continuously dissolved and etching depth linearly increased. On the contrary, passivation layer was grown on Cu surface in oxalic acid based slurry. As the platen rotation speed increased, Preston coefficient decreased in both slurries. With oxalic acid based slurry, at low velocity, removal rate is high value because of high friction force compared to citric acid based slurry. As platen velocity increased, removal of Cu in citric acid based slurry became higher value than oxalic acid based slurry. Typical lubrication behaviors were observed in both slurries. As Sommerfeld number increased, COF values gradually decreased and then re-increased. It indicated that lubrication was changed to direct contact or semi-direct contact mode to hydro-lubrication mode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.1
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• pp.24-29
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• 2005

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. Copper has been the candidate metallization material for ultra-large scale integrated circuits (ULSIs), owing to its excellent electro-migration resistance and low electrical resistance. However, it still has various problems in copper CMP process. Thus, it is important to understand the effect of the process variables such as turntable speed, head speed, down force and back pressure are very important parameters that must be carefully formulated in order to achieve desired the removal rates and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the variables and the interaction between the various parameters during CMP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate, non-uniformity and ETC (edge to center) is achieved by using the statistical analysis techniques. In the experimental tests, the optimum parameters which were derived from the statistical analysis could be found for higher removal rate and lower non-uniformity through the above DOE results.