Polishing Pad Analysis and Improvement to Control Performance
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Park, Jae-Hong
(니따하스 주식회사)
Kinoshita, Masaharu (니따하스 주식회사) Yoshida, Koichi (니따하스 주식회사) Park, Ki-Hyun (부산대학교 정밀정형 및 금형가공 연구소) Jeong, Hae-Do (부산대학교 정밀정형 및 금형가공 연구소) |
1 | Huey. S, 'Thecnology breakthrough in pad pad life improvement and its impact on CMP CoC', Advanced Semiconductor Manufacturing, IEEE/SEMI, p. 54, 1999 |
2 | Tatkwan Yu, 'A statistical polishing pad model for chemical-mechanical polishing', Electron Device Meeting, p. 865, 1993 |
3 | A. Scot Lawing, 'Pad conditioning and textual effect in chemical mechanical polishing', 9th CMP-MIC, Session 2, p. 33, 2005 |
4 | Gregory P. Muldowney, 'Optimization CMF pad groove arrays for improve slurry transport, wafer profile correction, and defectivity reduction', 9th CMP-MIC, Session 4, p. 156, 2005 |
5 | N. H. Kim, 'Temperature effects of pad conditioning process on oxide CMF: Polishing pad, slurry characteristics, and surlace reactions', Microelectronic Engineering, Vol. 83, p. 362, 2007 |
6 | 박기현, 정재우, 박범영, 서헌덕, 이현섭, 정해도, 'CMP 패드강성에 따른 산화막 불균일성(WIWNU)에 관한 연구', 전기전자재료학회논문지, 18권, 6호, p. 521, 2005 |
7 | 이현섭, 박범영, 서헌덕, 박기현, 정해도, 'CMP에서의 스틱-슬립 마찰특성에 관한 연구', 전기전자재료학회논문지, 18권, 4호, p. 313, 2005 |
8 | Gregory P. Muldowney, 'On the contact mechanics and fluid mechanics of CMP oad texture', 10th International CMP Symposium, 2005 |
9 | S. H. Lee, 'Development of CMP pad with controlled micro features for improved performance', Semiconductor Manufacturing, IEEE International Symposium, p. 173, 2005 |
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