• Advances in aircraft and spacecraft science
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• v.4 no.1
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• pp.37-52
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• 2017

Gas turbines operating in dusty or sandy environment polluted with micron-sized solid particles are highly prone to blade surface erosion damage in compressor stages and molten sand attack in the hot-sections of turbine stages. Commercial/Military fixed-wing aircraft engines and helicopter engines often have to operate over sandy terrains in the middle eastern countries or in volcanic zones; on the other hand gas turbines in marine applications are subjected to salt spray, while the coal-burning industrial power generation turbines are subjected to fly-ash. The presence of solid particles in the working fluid medium has an adverse effect on the durability of these engines as well as performance. Typical turbine blade damages include blade coating wear, sand glazing, Calcia-Magnesia-Alumina-Silicate (CMAS) attack, oxidation, plugged cooling holes, all of which can cause rapid performance deterioration including loss of aircraft. The focus of this research work is to simulate particle-surface kinetic interaction on typical turbomachinery material targets using non-linear dynamic impact analysis. The objective of this research is to understand the interfacial kinetic behaviors that can provide insights into the physics of particle interactions and to enable leap ahead technologies in material choices and to develop sand-phobic thermal barrier coatings for turbine blades. This paper outlines the research efforts at the U.S Army Research Laboratory to come up with novel turbine blade multifunctional protective coatings that are sand-phobic, sand impact wear resistant, as well as have very low thermal conductivity for improved performance of future gas turbine engines. The research scope includes development of protective coatings for both nickel-based super alloys and ceramic matrix composites.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.5
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• pp.234-239
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• 2002

The spinel was calcined at temperatures in the range of $1000^{\circ}C$ to $1300^{\circ}C$ with $100^{\circ}C$ interval to evaluate the effect of calcination temperature on mechanical properties of spinel-glass dental composites. Although the average particle size of spinel calcined at temperatures from $1000^{\circ}C$ to $1200^{\circ}C$ was within 2.8~3.0 $\mu\textrm{m}$, the spinel calcined at $1300^{\circ}C$ was 4.66 $\mu\textrm{m}$ due to abnormal grain growth. Shrinkage and pore size of the spinel preform decreased and increased, respectively, as calcination temperature increased, indicating that the calcination temperature was significant to the powder compaction and the densification of the composites as a result of particle size and distribution. The optimum strength and the fracture toughness of the composite calcined at $1200^{\circ}C$ were 284$\pm$40 MPa, 2.5$\pm$0.1 MPaㆍ$m^{1/2}$ respectively. Optical experimental results showed that transmittance of the spinel-glass composite in the visible region was twice higher than that of the alumina-glass composite, suggesting that the spinel-glass composites possessed better aesthetic properties for all-ceramic dental crown application.

• Journal of Ocean Engineering and Technology
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• v.20 no.5 s.72
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• pp.77-81
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• 2006

In this study, monolithic liquid phase sintered SiC (LPS-SiC) was made by the hot pressing method with nano-SiC powder, whose particle size is 30 nm and less on the average. Alumina ($Al_{2}O_{3}$), yttria ($Y_{2}O_{3}$), and silica ($S_{i}O_{2}$) were used for sintering additives. To investigate the effects of $S_{i}O_{2}$, the $Al_{2}O_{3}/Y_{2}O_{3}$ composition was fixed and the ratio of $S_{i}O_{2}$ was changed, with seven different ratios tested. And to investigate the effects of the sintering temperature, the sintering temperature was changed, with $1760^{\circ}C,\;1780_{\circ}C$, and $1800_{\circ}C$ being used with a $S_{i}O_{2}$ ratio of 3 wt%. The materials were sintered for 1 hour at $1760^{\circ}C,\;1780^{\circ}C$ and $1800^{\circ}C$ under a pressure of 20 MPa. The effects on sintering from the sintering system used, as well as from the composition of the sintering additives, were investigated by density measurements. Mechanical properties, such as flexural strength, were investigated to ensure the optimum conditions for a matrix of SiCf/SiC composites. Sintered densityand the flexural strength of fabricated LPS-SiC increased with an increase in sintering temperature. Particularly, the relative density of a sintered body at $1800^{\circ}C$ with a non-content of $S_{i}O_{2}$, a specimen of AYSO-1800, was 95%. Also, flexural strength was about 750MPa.

• Journal of Conservation Science
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• v.8 no.1 s.11
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• pp.10-15
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• 1999

The chemical compositions and microstructure of the punch'ong excavated from Bokwangri, Kangnung were investigated by the scanning electron microscope (SEM) with an energy dispersive X-ray spectrometer (EDS), X-ray diffractometer (XRD), and dilatometer. The compositions of body were $SiO_2(73-78\%),\;Al_2O_3(13-16\%)$, $RO{\cdot}R_2O(4-5\%,\;R=Ca,\;Mg,\;Na,\;K),\;R_xO_y(3-6\%,\;R=Fe,Ti)$ in weight ratio, which were higher silica and flux $(RO{\cdot}R_2O)$ but lower alumina. Owing to the high content$(21-30\%)$ of calcium oxide the glaze is considered lime type. Firing temperature range for the ceramic was presumed to about $1150^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.207-207
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• 2011

Amorphous transparent oxide semiconductors (a-TOS) have been widely studied for many optoelectronic devices such as AM-OLED (active-matrix organic light emitting diodes). Recently, Nomura et al. demonstrated high performance amorphous IGZO (In-Ga-Zn-O) TFTs.1 Despite the amorphous structure, due to the conduction band minimum (CBM) that made of spherically extended s-orbitals of the constituent metals, an a-IGZO TFT shows high mobility.2,3 But IGZO films contain high cost rare metals. Therefore, we need to investigate the alternatives. Because Aluminum has a high bond enthalpy with oxygen atom and Alumina has a high lattice energy, we try to replace Gallium with Aluminum that is high reserve low cost material. In this study, we focused on the electrical properties of IZO:Al thin films as a channel layer of TFTs. IZO:Al were deposited on unheated non-alkali glass substrates (5 cm ${\times}$ 5 cm) by magnetron co-sputtering system with two cathodes equipped with IZO target and Al target, respectively. The sintered ceramic IZO disc (3 inch ${\phi}$, 5 mm t) and metal Al target (3 inch ${\phi}$, 5 mm t) are used for deposition. The O2 gas was used as the reactive gas to control carrier concentration and mobility. Deposition was carried out under various sputtering conditions to investigate the effect of sputtering process on the characteristics of IZO:Al thin films. Correlation between sputtering factors and electronic properties of the film will be discussed in detail.

• Journal of Sensor Science and Technology
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• v.18 no.6
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• pp.456-461
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• 2009

Perovskite-structure $Sr(Ti_{1-x}Fe_x)O_3$ thick films, in which x is 0.4 or 0.6, were prepared by normal ceramic process on alumina substrate. Electrical resistance was measured as a function of thermal treatment condition including atmosphere, time, and temperature. The resistance of $Sr(Ti_{1-x}Fe_x)O_3$ films is lower than those of $SrTiO_3$ or $SrFeO_3$ films. The temperature coefficient of resistance over $550^{\circ}C$ was measured to be 0 for the $Sr(Ti_{1-x}Fe_x)O_3$ films after thermal treatment at $1100^{\circ}C$ in air. The sensing property of the films was also measured as a function of temperature and gas such as $O_2$, CO, $CO_2$, NO and $NO_2$. $Sr(Ti_{1-x}Fe_x)O_3$ films showed a good sensing property for $O_2$, but no sensing signal for CO, $CO_2$, NO and $NO_2$.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.297-302
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• 2011

Recently, low temperature co-fired ceramic (LTCC) technology is widely used in sensors, actuators and microsystems fields because of its very good electrical and mechanical properties, high reliability and stability as well as possibility of making 3D micro structures. In this study, we investigated the effects of sputtering gas ratio and annealing temperature on the crystal structure of $Pb(ZrTi)O_3$ (PZT) thin films deposited on LTCC substrate. The LTCC substrate with thickness of $400\;{\mu}m$ were fabricated by laminating 4 green tapes which consist of alumina and glass particle in an organic binder. The PZT thin films were deposited on Pt / Ti / LTCC substrates by RF magnetron sputtering method. The results showed that the crystallization of the films were enhanced as increasing $O_2$ mixing ratio. At about 25% $O_2$ mixing ratio, was well crystallized in the perovskite structure. PZT thin films was annealed at various temperatures. When the annealing temperature is lower, the PZT thin films become a phyrochlore phase. However, when the annealing temperature is higher than $600^{\circ}C$, the PZT thin films become a perovskite phase. At the annealing temperature of $700^{\circ}C$, perovskite PZT thin films with good quality structure was obtained.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.6
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• pp.1-6
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• 2017

Recently, the brittle materials such as ceramics, glass, sapphire and textile material have been widely used in semiconductors, aerospace and automobile owing to high functional characteristics. On the other hand, it has the characteristics of difficult-to-cut material relative to all materials. In this study, diamond electro-deposited band-saw machine was developed to operate stably using water-coolant type through relative motion between band-saw tool and $Al_2O_3$ material. High densified $Al_2O_3$ material was manufactured by spark plasma sintering method. The bulk density was observed by the Archimedes law and the theoretical density was estimated to be $3.88g/cm^3$ and its hardness 14.7 MPa. From the dicing sawing test of $Al_2O_3$ specimen, behavior of surface roughness and band-saw wear are dominantly affected by the increase of the band-saw linear velocity. Additionally, an continuous pattern type of diamond band-saw was a very effective due to entry impact as a one-off for brittle material.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.38.1-38.1
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• 2009

Plasma etching is an essential process for electronic device industries and the particulate contamination during plasma etching has been interested as a big issue for the yield of productivity. The oxynitride glasses have a merit to prevent particulate contamination due to their amorphous structure and plasma etching resistance. The YSiAlON oxynitride glasses with increasing nitrogen content were manufactured. Each oxynitride glasses were fluorine-plasma etched and their plasma etching rate and surface roughness were compared with reference materials such as sapphire, alumina and quartz. The reinforcement mechanism of plasma etching resistance of the YSiAlON glasses studied by depth profiling at plasma etched surface using electron spectroscopy for chemical analysis. The plasma etching rate decreased with nitrogen content and there was no selective etching at the plasma etched surface of the oxynitride glasses. The concentration of silicon was very low due to the generation of SiF4 very volatile byproduct and the concentration of aluminum and yttrium was relatively constant. The elimination of silicon atoms during plasma etching was reduced with increasing nitrogen content because the content of the nitrogen was constant. And besides, the concentration of oxygen was very low on the plasma etched surface. From the study, the plasma etching resistance of the glasses may be improved by the generation of nitrogen related structural groups and those are proved by chemical composition analysis at plasma etched surface of the YSiAlON oxynitride glasses.