한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

  • 제16권6호
  • /
  • Pages.1-6
  • /
  • 2017
  • /
  • 1598-6721(pISSN)
  • /
  • 2288-0771(eISSN)
한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
권호 표지
DOI QR코드

DOI QR Code

다이아몬드전착 밴드쏘우장비를 이용한 고치밀도 알루미나소결체의 다이싱가공 성능평가

Performance Evaluation of Dicing Sawing of High-densified Al2O3 Bulk using Diamond Electroplated Band-saw Machine

  • Lee, Yong-Moon (Graduate school of convergence science, Pusan National University) ;
  • Park, Young-Chan (Graduate school of convergence science, Pusan National University) ;
  • Kim, Dong-Hyun (Business Support Division, Korea institute of ceramic engineering & technology) ;
  • Lee, Man-Young (MTI Diamond, Ltd) ;
  • Kang, Myung Chang (Graduate school of convergence science, Pusan National University)
  • 투고 : 2017.11.21
  • 심사 : 2017.12.05
  • 발행 : 2017.12.31
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Recently, the brittle materials such as ceramics, glass, sapphire and textile material have been widely used in semiconductors, aerospace and automobile owing to high functional characteristics. On the other hand, it has the characteristics of difficult-to-cut material relative to all materials. In this study, diamond electro-deposited band-saw machine was developed to operate stably using water-coolant type through relative motion between band-saw tool and $Al_2O_3$ material. High densified $Al_2O_3$ material was manufactured by spark plasma sintering method. The bulk density was observed by the Archimedes law and the theoretical density was estimated to be $3.88g/cm^3$ and its hardness 14.7 MPa. From the dicing sawing test of $Al_2O_3$ specimen, behavior of surface roughness and band-saw wear are dominantly affected by the increase of the band-saw linear velocity. Additionally, an continuous pattern type of diamond band-saw was a very effective due to entry impact as a one-off for brittle material.

키워드

참고문헌

  1. Park, K. D., Go, G. H., Lee, D. J., Kim, J. H. and kang, M. C., "Feasibility Evaluation of Micro Hole Drilling and the Material Properties of $Si_3N_4 $/hBN Ceramic with hBN Contents," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 16, pp. 36-41, 2017. https://doi.org/10.14775/ksmpe.2016.16.1.036
  2. Jeong, H. A., Lee, C. H. and Kang, M. C., "Fabrication of Micro-electrodes using Liner Block Moving Electrical Discharge Grinding and Characteristics of Micro-hole Machining of Graphene Nanoplatelet-reinforced $Al_2O_3$ Compos ites," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 16, pp. 149-156, 2017.
  3. Shin, G. H., Kang, B. O. and Kwak, T. S., "Effect of the Elasticity Modulus of the Jig Material on the Blade Edge Shape in the Grinding Process of Sapphire Medical Knife-Part 2 Verification of the Chipping Phenomenon and Elastic Modulus of the Jig Material," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 16, No. 5, pp. 63-68, 2017.
  4. Shen, J. Y., Wang, J. Q., Jiang, B. and Xu, X. P., "Study on wear of diamond wheel in ultrasonic vibration-assisted grinnding ceramic," Wear, Vol. 332-333, pp. 788-793, 2015. https://doi.org/10.1016/j.wear.2015.02.047
  5. Kim, K. T., Hong, Y. H., Park, K. H. and Lee, S. W., "Development of Ultrasonic Grinding Wheel for Hybrid Grinding System," Journal of the Korean Society for Precision Engineering, Vol. 30, No. 11, pp. 1121-1128, 2013. https://doi.org/10.7736/KSPE.2013.30.11.1121
  6. Kim, H. J., Kim, D. Y., Kim, C. M. and Jeong, H. D., "Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires," CIRP, Vol. 62, pp. 335-338, 2013. https://doi.org/10.1016/j.cirp.2013.03.122
  7. Cvetkovic, S., Morsbach, C. and Rissing, L., "Ultra-precision dicing and wire sawing of silicon carbide (SIC)," Morcroelectronic Engineering, Vol. 88, pp. 2500-2504, 2011. https://doi.org/10.1016/j.mee.2011.02.026
  8. Gao, C. and Yuan, J. T., "Efficient drilling of holes in $Al_2O_3$ armor ceramic using impregnated diamond bits," Journal of Materials Processing Technology, Vol. 211, pp. 1719-1728, 2011. https://doi.org/10.1016/j.jmatprotec.2011.05.013
  9. Zhu, Z., To, S., Xiao, G., Ehmann, K. F. and Zhang, G., "Rotary spatial vibration-assisted diamond cutting of brittle materials," Precision Engineering, Vol. 44, pp. 211-219, 2016. https://doi.org/10.1016/j.precisioneng.2015.12.007
  10. Back, I. H., Kim, J. S., Jeon, U. C., Kim, N. K., Choi, M. S. and Lee, D. W., "Machine Tools-Driving Mechanisms and Design Principles," Chung Moon Kack, pp. 257-266, 2001.
  11. Bouzakis, K. D., Makrimallakis, S., Katirtzoglou, G. and Bouzakis, E., "Coated tools' wear description in down and up milling based on the cutting edge entry impact duration," CIRP Annals-Manufacturing Technology, Vol. 61, pp. 115-118, 2016.
  12. Kim, J. S., Kang, S. K. and Shin, M. J., "Effect of Cutting off Processing SCM415 on Surface Roughness and Thickness of Materials," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 12, pp. 20-26, 2013.

피인용 문헌

  1. 고강도 경량화 산업용 풀리 개발을 위한 이종접합 사출풀리 제작에 관한 연구 vol.18, pp.6, 2017, https://doi.org/10.14775/ksmpe.2019.18.6.076