• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.1
• /
• pp.51-59
• /
• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Korean Society for Precision Engineering
• /
• v.16 no.4 s.97
• /
• pp.148-154
• /
• 1999

This study was carried out to verify grinding performance of dental diamond bur and investigate the possibility of AE application in dentistry field. Workpieces were made of acryl and bovine respectively for the experiments in this study. Grinding test was conducted to get the data of grinding resistance and specific grinding energy of four different types of diamond bur by using tool dynamometer. AE signal was acquired to verify grinding process in the AE measuring system. Tool wear was observed to find parameters about grinding characteristics of diamond bur by means of SEM picture. It was found that the wear of dental diamond bur could be detected with polishing of grinding material, removal of adhesive parts, wear of particles neighboring cutting nose, loss of material and elevation of temperature. The wear of B, C, D type diamond bur is due to wear and fracture of grain size. Abnormal state can be found through the behavior of AE signal in the grinding working. As a result, it is expected that forecast of abnormal state is possible using AE equipments under real time process.

• Current Photovoltaic Research
• /
• v.5 no.3
• /
• pp.83-88
• /
• 2017

The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

• Journal of Power System Engineering
• /
• v.22 no.1
• /
• pp.64-71
• /
• 2018

Currently, functional patterns are formed by screen printing on stretchable films, and they are applied to wearable and stretchable devices. In this study, three types of silver paste were prepared using three polyester binders with different Tg and molecular weights in order to impart elasticity to the conductive pattern itself. Rheological properties and DSC measurements were performed for each silver paste. Then, each silver paste was screen printing and cured by an IR dryer to evaluate adhesive strength, pencil hardness, resistance and surface shape change according to strain. As a result, it was found that the silver paste using a binder with a low Tg and a high molecular weight has the smallest resistance change depending on the strain. Namely, it was found that it is most preferable to use a binder with a low Tg and a high molecular weight as the stretchable electrode.

• International Journal of Advanced Culture Technology
• /
• v.3 no.2
• /
• pp.34-41
• /
• 2015

Bonding strength of a thermal sprayed coating is difficult to measure using a conventional pull-off test method. Scratch test is a potential alternative testing method. An adhesive and a cohesive bond strength of the coating can be measured by the pull-off test while the scratch test performed on the cross-section of the thermal sprayed coating can only demonstrate the cohesive bond strength of the coating. Nevertheless, it is still beneficial to perform the scratch testing on the cross-section of the coating for the sake of comparison thus providing an alternative to the pull-off test. The scratch test method can reduce testing time and cost in the long run due to a significant cost reduction in consumables and energy and time saving from the curing step of the glue used in the pull-off test. This research investigates the possibility of using the scratch test to measure the cohesive bond strength of Mo/NiCrBSi composite coating. The results from the pull-off test and the scratch test indicate that the cohesive bond strengths of the Mo composite coating show similar trend and that the cohesive bond strength are increased when increasing NiCrBSi content.

• Steel and Composite Structures
• /
• v.17 no.2
• /
• pp.199-213
• /
• 2014

The damage characters of scarf repaired composite laminates subjected to low-velocity impact with various energy levels at different locations are studied experimentally. The results are compared with those of the original laminates which have no initial damage and don't need repair. The impact load-time history of the specimens, the velocity-time curves of the impactor, the post impact compressive strength of the specimens and the C-scan photographs of the damaged regions are obtained. The delamination threshold load and damage character of the specimen section at impact point are also studied. The results have shown that the impact response of a repaired composite laminate is sensitive to the location of the impact. The impact load and the delamination threshold load have shown different characters for specimens with different impact locations. The debonding characters of the adhesive and compressive strength after impact of the specimens are also influenced by impact locations.

• Journal of the Korean Society of Safety
• /
• v.26 no.4
• /
• pp.1-6
• /
• 2011

New methods for joining sheet of metal are being sought. One of the most promising methods is MPJ (mechanical press joining). It has been used in thin metal work because of its simple process and relative advantages over other methods, as it requires no fasteners such as bolts or rivets, consumes less energy than welding, and produces less ecological problems than adhesive methods. In this study, the joining process and static behavior of single overlap joints has been investigated. During fixed die type joining process for SPCC plates, the optimal applied punching force was found. The maximum tensile-shear strength of the specimen produced at the optimal punching force was 1.75 kN. The FEM analysis result on the tensile-shear specimen showed the maximum von-Mises stress of 373 MPa under the applied load of 1.7 kN, which is very close to the maximum tensile strength of the SPCC sheet(= 382 MPa). This suggests that the FEM analysis is capable of predicting the maximum tensile load of the joint.

• Tribology and Lubricants
• /
• v.27 no.6
• /
• pp.351-355
• /
• 2011

Al/SiC composites were fabricated by thermal spray process, and the dry sliding wear tests were performed using the various sliding speed of 10, 30, 60 and 90 RPM through 1000 cycles. The applied load was 10 N and radius of wear track was 15 mm. Wear tracks on the Al/SiC composites were investigated using scanning electron microscope(SEM) and energy dispersive X-ray spectroscopy (EDS). In the case of sliding speed of 10 RPM, adhesive wear behavior caused by plastic deformation of composits surface was observed. In the cases of sliding speed of 30, 60, 90 RPM, abrasive wear behavior on the adhered layer formed by debris were observed. Through this study, it was found that the wear behavior of Al/SiC composites was mainly influenced by the sliding speed.

• Korean Journal of Optics and Photonics
• /
• v.17 no.5
• /
• pp.480-486
• /
• 2006

Generally, IR cut-off filters for mobile phone is coated on the glass substrate at high temperature(above $300^{\circ}C$). In this work, we prepared IR cut-off filters on the poly(methyl methacrylate)(PMMA) substrates at low temperature(about $70^{\circ}C$ ). using the $CeO_2\;and\;SiO_2$ coatings by physical vapor deposition. The surface energies of coated and uncoated PMMA, and adhesive properties of IR cut-off filters coatings were examined using contact angle measurements. We demonstrate the improve of mobile phone optical system using these results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.35 no.5
• /
• pp.488-493
• /
• 2022

Generally, diamond-like carbon films (a-C:H, DLC) have been shown to have a low coefficient of friction, a high hardness and a low wear rate. Pd-doped C thin film was fabricated using a dual magnetron sputtering with two targets of graphite and palladium. Graphite target RF power was fixed and palladium target RF power was varied. The structural, physical, and surface properties of the deposited thin film were investigated, and the correlation among these properties was examined. The doping ratio of Pd increased as the RF power increased, and the surface roughness of the thin film decreased somewhat as the RF power increased. In addition, the hardness value of the thin film increased, and the adhesive strength was improved. It was confirmed that the value of the contact angle indicating the surface energy increases as the RF power increases. It was concluded that the increase in RF power contributed to the improvement of the physical properties of Pd-doped C thin film.