• 한국자동차공학회논문집
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• 제6권4호
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• pp.56-65
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• 1998

The bonding strength evaluation of the light weight materials for an electrical vehicle has been performed through the T-peel joint test in which the design paramete- rs such as joint style, adherend type, adherend thickness, adhesive thickness, and adhesive type are considered. It is experimentally observed that the peel strength of joint increases with the increase of the adherend thickness. With the increase of the adhesive thickness, however, the peel strength of joint increases a little. Aluminum-FRP adherend combination shows such higher peel strength than that of Aluminum-Aluminum adherend combination. For the adhesive bonded joint, the results of FEM analysis agree with those of experiment. The adhesive bonded joint reinfored with a rivet gives higher peel strength than that of the joint without rivet.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.517-520
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• 2008

Recently, use of adhesive bonding technology is increased to achieve the multi-material design for lightweight structure in automobile industry. In this paper, the fracture strength of adhesive has been studied with the single lap shear test conducted at different temperatures. The joint specimens are made from Al 5052 and SPRC 440 bonded with structural epoxy adhesive. The operating temperature has been considered up to $150[^{\circ}C]$ and the single lap shear test has been conducted with 5mm/min tensile rate. Fracture strength of adhesive bonded joint has been decreased with increase of operating temperature. The fracture strength at the $100[^{\circ}C]$ was shown about half of that at room temperature.

• 한국재료학회지
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• 제20권12호
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• 한국자동차공학회논문집
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• 제13권4호
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• pp.129-134
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• 2005

There is a strong industrial demand for the development of light-weight vehicle to improve fuel efficiency and dynamic performance. The effective method of achieving the weight reduction is to use low-density materials such as aluminum and magnesium. In applying these materials to the vehicle, it is often required to join dissimilar materials such as aluminum and steel. However, conventional joining method, namely resistance spot welding cannot be used in joining dissimilar materials. Self·piercing rivet(SPR) and adhesive bonding is a good alternative to resistance spot welding. In this study, the impact test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding was performed. As a result, various parameters of crashworthiness were analyzed and evaluated. Also, the applicability of SPR and adhesive bonding as an alternative to resistance spot welding was suggested.

• 대한소아치과학회지
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• 제28권2호
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• pp.228-237
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• 2001

본 연구의 목적은 와동 충전시 충전재와 치질 사이에 개재되는 상아질 결합제가, 수복물에서 유리되는 불소가 와동 벽으로 침투하는 과정에 어떠한 영향을 주는지를 조사함이었고, 부가적으로 레진 강화형-글라스 아이오노머 시멘트의 접착에도 상아질 결합제를 도포 하는것이 치질과의 결합력을 강화시킬 수 있는지에 대해 평가하고자 하였다. Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 선정하여 상아질 결합제의 도포 여부에 따른 불소 유리량 측정과 전단 결합 강도를 비교분석하였으며, 치질 내로의 불소 침투 양상은 교환 시기에 있는 제2유구치에 Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 충전하고 3주내에 발거하여 EPMA로 분석하였다. 상아질 결합제는 불소 유리량을 현저하게 감소시키는 것으로 나타났으며(p<0.05) Fuji II $LC^{(R)}$의 경우 상아질 결합제의 도포가 결합강도를 증가시키지 못하였다. EPMA 분석결과 상아질 결합제는 충전재로부터 유리되어 나오는 불소가 치질 내로 확산되는 것을 방해하는 것으로 확인되었다.

• 대한치과교정학회지
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• 제22권2호
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• pp.449-474
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• 1992

The purpose of this study was to evaluate the in vitro shear bond strengths to enamel and the failure sites of three ceramic brackets and one metal bracket in combination with light cured orthodontic adhesive. The brackets were divided into four groups. Each ceramic bracket group had different bonding mechanisms with adhesive. Group A; metal bracket with foil-mesh base (control group) Group B; ceramic bracket with micromechanical retention Group C; ceramic bracket with chemical bonding Group D; ceramic bracket with mechanical retention and chemical bonding. Forty extracted human lower first premolars were prepared for bonding and 10 brackets for each group were bonded to prepared enamel surfaces with $Transbond^{\circledR}$ light cured ortho dontic adhesive. Twenty four hours after bonding, the Instron universal testing machine was used to test the shear bond strength of brackets to enamel. After debonding, brackets and enamel surfaces were examined under stereoscopic microscope to determine the failure sites, Statistical analysis of the data was carried out with ANOVA test and $Scheff\acute{e}$ test using SPSS PC+. The results were as follows. 1 . There were statistically significant differences in mean shear bond strengths of three ceramic bracket groups (p < 0.05). Shear bond strengths of group C and D were significantly higher than that of group B and shear bond strength of group C was significantly higher than that of group D. 2. Group C and D both had significantly higher shear bond strengths than metal bracket (group A), but there were no significant differences in shear bond strengths between group A and B (p < 0.05). 3. The failure sites of four bracket groups were also different. Group C and D failed primarily at enamel-adhesive interface, but group A and B failed primarily at bracket base-adhesive interface. 4. Among all ceramic bracket groups, group B was very similar to metal bracket in the aspect of shear bond strength and failure site.

• 접착 및 계면
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• 제4권2호
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• 한국기계가공학회지
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• 제20권4호
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• pp.127-134
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• 2021

In this study, the adhesive fracturing characteristics of a DCB specimen due to single and heterogeneous bonding materials under tearing load was investigated. The experiments were conducted to examine the fracturing properties of the adhesive DCB specimen. As an experimental condition, a forced displacement of 3mm/min was applied to one side while the other side was fixed. As a result of the experiment, it was found that the AL6061-T6 material was superior to the CFRP material in terms of maximum stress, specific strength, and energy release rate when compared to the adhesive fracturing property of a single material. We tested CFRP-AL, a heterogeneous bonding material, and compared its experimental results to the results from the single materials. Based on these results, CFRP-AL with a heterogeneous bonding material was observed to have the superior structural safety compared to single materials for the mode III fracture type.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Journal of the Korean Wood Science and Technology
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• 제34권3호
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• pp.22-29
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• 2006

친환경 건축자재에 대한 관심이 높아짐에 따라서 가구 및 건축 내외장재로 사용되는 목질복합재료에 대한 친환경적 성능에 대한 요구는 점차 커져가는 추세이다. 목질 복합재료는 일반적으로 그 자체로 사용하기 보다는 표면재를 붙여서 사용하는데 이때 사용되는 요소포름알데히드 접착제를 친환경적인 SIS계 핫벨트 점착제로 대체코자 하는 데 이 연구의 목적이 있다. 본 연구에서는 기질고분자의 diblock 함량, 점착부여수지의 연화점 및 함량 등을 변화시키면서 여러 종류의 핫벨트 점착제를 제조하고 각각의 점착제에 의한 무늬목 부착성능을 평가함으로써 점착형 표면재에 대한 가능성을 제기하였다.