• Title/Summary/Keyword: adhesive binder

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Properties and Glue Shear Strength of the Water Soluble Urea-Phenol Copolymer Adhesive as a High Temperature Curing Binder for Plywood (합판용(合板用) 고온경화형(高温硬化型) 수용성(水溶性) 요소(尿素)·페놀공축합수지(共縮合樹脂)의 성질(性質)과 그 접착강도(接着強度))

  • Lee, Hwa Hyoung
    • Journal of Korean Society of Forest Science
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    • v.60 no.1
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    • pp.51-57
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    • 1983
  • Properties and glue shear strength of each water soluble rues-phenol copolymer adhesive and phenolic resin adhesive were examined as a high temperature curing binder through the manufacture of plywood made of Kapur veneer. The former has different molar ratio and the latter was made from different catalyst method. The results are summarized as follows: 1) Specific gravities of air dried plywood manufactured from each adhesive ranged from 0.67 to 0.82 and their moisture contents met the K.S. standard 2) In dry and wet shear strength, adhesives with 60 percent of non volatile content showed higher values than those with 50 percent except phenolic resin. Urea-phenol copolymer resin with 20 percent of phenol content exhibited the highest, and that with 70 percent the lowest. Filling effect of wood flour on the bonding strength is great in urea-phenol copolymer resin with more than 50 percent of phenol content, especially significant in 50 percent of non volatile content including alkali catalyst phenolic resin. Alkali and acid catalyst methods were the highest among the adhesive manufacture methods. In wet strength, urea resin belongs to the lowest group. 3) In glue shear strength after boiling and drying test, no method for manufacturing phenolic formaldehyde resin adhesive was stronger than alkali and acid catalyst methods. Phenolic resin made from alkali catalyst method needs a wood flour filler to improve the bonding quality. Urea-phenol copolymer resin with 10 percent of phenol content showed the reasonable water resistance.

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A Study on the Electromagnetic shielding Effectiveness Using Conductive Polymers (전도성 고분자를 이용한 전자파 차폐효과의 연구)

  • 하남규;이보현;김태영;김종은;서광석
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.3
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    • pp.207-214
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    • 2001
  • The conductive polymers, polyaniline (PANI) emeralidin base and 3,4-polyethylene dioxythiophene(PEDOT) were synthesized and coated on the PET film dealt with acryl type primer to study the electromagnetic shielding effectiveness. When both PANI and PEDOT were coated on the PET film dealt with acryl type priemer, their surface properties such as he adhesive increased. For PANI, when blended with the binder such as PMMA, it adhesive and surface hardness increased, too. The visible light transmittance decreased, while the electromagnetic shielding effectiveness increased, when coated thickness of PANI and PEDOT increased. For PANI, the electromagnetic shielding effectiveness increased as its surface resistance decreased. For PANI, when the surface resistance was 140 Ω/$\square$, the shielding effectiveness was found to be 11 dB in the far field, and 13 dB in the near field at 1 GHz. For PEDOT, when the surface resistance was 200 Ω/$\square$, the shielding effectiveness was found to be 3 dB in the far field, and 7dB in the near field.

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Anisotropic Conductive Film (ACF) Prepared from Epoxy/Rubber Resins and Its Fabrication and Reliability for LCD

  • Kim, Jin-Yeol;Kim, Eung-Ryul;Ihm, Dae-Woo
    • Journal of Information Display
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    • v.4 no.1
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    • pp.17-23
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    • 2003
  • A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

Manufacture of Alkyl Acrylate Multi Core-shell Composite Particle (알킬 아크릴레이트계의 다중 Core-shell 복합입자의 제조)

  • Cho, Dae-Hoon;Choi, Sung-Il;Go, Hyun-Mi;Seul, Soo-Duk
    • Journal of Adhesion and Interface
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    • v.12 no.1
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    • pp.16-25
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    • 2011
  • Multi core-shell composite particles were prepared by the water-born emulsion polymerization of various core monomer such as methyl methacrylate (MMA), n-butyl methacrylate (BMA), and shell monomer such as MMA, BMA, stylene (St), 2-hydroxyl ethyl methacrylate (2-HEMA) and acrylic acid (AA) in the presence of different concentration of sodium dodecyl benzene sulfonate (SDBS). The following conclusions are drawn from the measured conversion, particle size and distribution, average molecular weight, molecular structure, glass transition temperature with DSC, morphology, tensile strength and elongation. In the case of the concentration of 0.02 wt% SDBS, the conversion of MMA core-(BMA/St/AA) shell composite particle was excellent as 98%. In the case of the concentration of 0.03 wt% SDBS, the particle size of BMA core-(MMA/St/AA) shell composite particle was high as $0.47{\mu}m$. We confirmed that 3 points of glass transition temperatures appear for multi core-shell composite particles compared to 2 points of glass transition temperatures appear for general core-shell composite particles. We showed that it is possible to adjust glass transition temperatures according to the kind and composition of the inner shell monomer that it is can be used as a adhesive binder material with improved adhesive power.

A Study on Stability according to the Conservation Environment for Fixative of Korean Mural Painting Layers (한국 흙벽화 채색층 고착제의 보존환경에 따른 안정성 연구)

  • Jin, Byung-hyuk;Wi, Koang-chul
    • Korean Journal of Heritage: History & Science
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    • v.46 no.3
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    • pp.150-171
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    • 2013
  • The most important part of conservation treatment of murals is to preserve them against the risk of a damage by injecting fixative into them when the painting loses its cohesion or powderization of pigments occurred due to occurrence of cracks inside the painting layer. However, studies on the stability of fixative used for painting layers of murals are still insufficient. This study manufactured a mural as a specimen and colored it with four kinds of pigments including oyster shell white, cinnabar, malachite and red clay and applied four kinds of fixative, including, Paraloid $B-72^{(R)}$, Caparol-$binder^{(R)}$, glue and Hydoxypropyl $cellulose^{(R)}$. artificially generated environmental changes in temperature, humidity and ultraviolet rays which may occur after the completion of conservation treatment. Then the changes in physical properties were observed in multifaceted ways such as color stability, contact angle, brilliance, adhesive strength and surface. As a result, this study found that ultraviolet rays and hot?humid environment have a large impact on color stability causing changes in brightness and chroma of all painting layers where the fixative were applied, except for oyster shell white and are considered the main factors of decomposition by accelerating the aging process of fixatives applied. In comparison to the synthetic resins that were also tested in this study, the traditional glue showed satisfactory results in terms of color stability and influence preservation and the hydrophile property. As it showed exceptionally outstanding adhesive strength in all painting layers in the aspect of adhesive strength, it is considered to be highly stabile for the fixation treatment of painting layers of mural.

Effect of Mixing Ratio of Amphoteric and Anionic Latices on Print Quality of Coated Papers (라텍스의 혼합비율이 도공지 품질에 미치는 영향)

  • 강태근;박규재;이용규
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.31 no.1
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    • pp.72-79
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    • 1999
  • The binder plays important roles in determining the quality of pigment coating. In addition to its primary role of binding the pigment to the base paper, the binder performs several other important functions. The binder, also referred to as the adhesive, is the dominant in the aqueous phase of the formulation. Thus it plays a major role in determining viscosity, rheology, water release, and setting time for the coating. Latices based on styrene-butadiene dominate the market for synthetic paper coating binders. Consumption is high and is expected to increase further due to the present tendeyncy toward high-solids coating. The purpose of this study is understanding the impact of various parameters of latex(i.e. Tg, Particle size) affecting prontabilities and optical properties of the coated papers, as well as providing basic information on the use of amphoteric latex for improving print qualities of coated papers. Recently, amphoteric latices, Which are cationic at low pH's but turn anionic at high pH's have attracted interests of paper scientists and engineers. Therefore we investigated the effect of the Tg(glass transition temperature) and particle size of amphoteric latex on the coating qualities. We also studied the effect of mixing ratios (Amphoteric / Anionic)of latex on the coating qualities. Our results showed that Tg and particle size of amphoteric latex have to be controlled for optimizing coated paper qualities. The formulation consisting of 10 parts of amphoteric latex and 5 parts of anionic latex gave best results in ink receptivity, smoothness, air permeability, opacity and sheet gloss. If the results hold for the industrial paper coatings, the amount of expensive amphoteric latex can be reduced while achieving best available printing quality.

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Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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Adhesive Strength and Electrochemical Properties of Li(Ni0.5Co0.2Mn0.3)O2Electrodes with Lean Binder Composition (바인더 함량에 따른 Li(Ni0.5Co0.2Mn0.3)O2 전극의 접착력 및 전기화학 성능에 관한 연구)

  • Roh, Youngjoon;Byun, Seoungwoo;Ryou, Myung-Hyun;Lee, Yong Min
    • Journal of the Korean Electrochemical Society
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    • v.21 no.3
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    • pp.47-54
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    • 2018
  • To maximize the areal capacity($mAh\;cm^{-2}$) of $LiNi_{0.5}Co_{0.2}Mn_{0.3}O_2$(NCM523) electrode with the same loading level of $15mg\;cm^{-2}$, three NCM523 electrodes with 4, 2, and 1 wt% poly(vinylidene fluoride)(PVdF) binder content are fabricated. Due to the delamination issue of electrode composite at the edge during punching process, the 1 wt% electrode is excluded for further evaluation. When the PVdF binder content decreases from 4 to 2 wt%, both adhesion strength and shear stress decrease from 0.4846 to $0.2627kN\;m^{-1}$ by -46% and from 3.847 to 2.013 MPa by -48%, respectively. Regardless of these substantial decline of mechanical properties, their initial electrochemical properties such as initial coulombic efficiency and voltage profile are almost the same. However, owing to high loading level, the 2 wt% electrode not only exhibits worse cycle performance than the 4 wt% electrode, but also cannot maintain its mechanical integrity only after 80 cycles. Therefore, if the binder content is reduced to increase the area capacity, the mechanical properties as well as the cycle performance must be carefully evaluated.

PEDOT:PSS/Single Wall Carbon Nanotube Composite Nanoparticles as an Additive for Electric-double Layer Capacitor

  • Park, Jong Hyeok;Lee, Sang Young;Kim, Jong Hun;Ahn, Sunho
    • Journal of Electrochemical Science and Technology
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    • v.3 no.3
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    • pp.143-148
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    • 2012
  • The unique effects of highly conductive conducting polymer/SWNT (single walled carbon nanotube) composite nanoparticles in electric double layer capacitors are studied for the enhancement of the adhesive properties, specific capacitance and power characteristics of the electrode. Because the conducting polymer/SWNT composite material, which is believed to act as a polymer binder, an active material for charge storage and a conducting agent, is well distributed on the activated carbon, greatly enhanced adhesion properties, cell capacitance and power characteristics were obtained.

Effect of protective colloid on the synthesis of Poly(Vinyl acetate-co-Ethyl acrylate) (Poly(VAc-co-EA) 공중합체 제조에 있어 보호콜로이드의 영향에 관한 연구)

  • Kim, Nam-Seok;Kim, Sung-Hoon
    • Journal of the Korean Applied Science and Technology
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    • v.27 no.2
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    • pp.216-221
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    • 2010
  • Polyvinyl acetate (PVAc) prepared by emulsion polymerization has broad applications for additive such as paint binder, adhesive for wood and paper due to its low glass transition temperature which help to plasticize substrate resins. Since emulsion polymerization has a disadvantage that surfactant and ionic initiator degrade properties of the product polymer, poly (vinyl acetate-eo-ethyl acrylate) (VAc-EA) was synthesized using potassium persulfate as catalyst and polyvinylalcohol (PVA) as protective colloid to prevent the degradation. The copolymer latex product was internally plasticized and has enhanced adhesion, water resistance during VAc-EA emulsion polymerization. No coagulation and complete conversion occur with the reactant mixture of 10 mmol/L potassium persulfate, 10 mmol/L poly ( vinyl alcohol) (PVA 17). As the concentrations of PVA increase, the viscosity becomes increase.