• Journal of Powder Materials
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• v.28 no.1
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• pp.25-30
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• 2021

The surface of silicon dummy wafers is contaminated with metallic impurities owing to the reaction with and adhesion of chemicals during the oxidation process. These metallic impurities negatively affect the device performance, reliability, and yield. To solve this problem, a wafer-cleaning process that removes metallic impurities is essential. RCA (Radio Corporation of America) cleaning is commonly used, but there are problems such as increased surface roughness and formation of metal hydroxides. Herein, we attempt to use a chelating agent (EDTA) to reduce the surface roughness, improve the stability of cleaning solutions, and prevent the re-adsorption of impurities. The bonding between the cleaning solution and metal powder is analyzed by referring to the Pourbaix diagram. The changes in the ionic conductivity, H2O2 decomposition behavior, and degree of dissolution are checked with a conductivity meter, and the changes in the absorbance and particle size before and after the reaction are confirmed by ultraviolet-visible spectroscopy (UV-vis) and dynamic light scattering (DLS) analyses. Thus, the addition of a chelating agent prevents the decomposition of H2O2 and improves the life of the silicon wafer cleaning solution, allowing it to react smoothly with metallic impurities.

• Journal of Korean Society for Quality Management
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• v.51 no.4
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• pp.735-749
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• 2023

Purpose: The purpose of this study is to derive solutions and prevent similar cases from occurring by analyzing the causes of cracks found in temperature cycling tests of rocket motor. Methods: By combining the results of the current state confirmation test, non-destructive test, domestic and foreign rocket motor comparison test, cutting test, and adhesion test according to the number of times to apply mold release agent, a Cause and Effect Diagram analysis was performed to derive the cause of cracks. Results: Through this study, 26 factors that could cause cracking in rocket motors during temperature cycling tests were identified. Through various additional test results, a total of five causes were identified, including chemical and structural design of the joint between the propellant and stress relief insert, omission of procedure in the manufacturing procedures, natural aging due to temperature, and load accumulation due to temperature changes. The fundamental cause was confirmed to be insufficient consideration of the release properties of the propellant and stress relief insert. Conclusion: During the design process, it was confirmed that this could be solved by structurally or chemically designing the insert so that it does not combine with the propellant, or by applying a mold release agent during the manufacturing process.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.75-75
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• 2009

연성회로기판은 일반적으로 절연체를 이루는 폴리이미드와 전도체를 이루는 구리로 구성되어 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 기계적 특성, 공정성 등의 장점으로 인해 연성회로기판의 절연체로서 제안되었지만 전도체를 이루는 구리와의 접합 특성이 우수하지 않기 때문에 많은 연구가 현재까지 진행되고 있고, 그 결과 연성회로기판의 접합 특성에 많은 개선이 이루어짐과 동시에 다양한 공정 방법이 제안되고 있다. 하지만 고온다습한 환경에서 사용될 경우 폴리이미드의 높은 흡습성과, 구리와 seed layer의 산화 문제로 인해 접합 특성이 저하된다는 단점 또한 가지고 있다. 따라서 본 연구를 통해 고온다습한 조건하에서 seed layer가 80Ni/20Cr 합금으로 구성된 연성회로기판의 seed layer의 두께와 시효시간으로 인해 발생하는 접합 신뢰성의 차이를 관찰하였다. 본 연구에서는 두께 $25{\mu}m$의 폴리이미드 위에 각각 100, 200, $300{\AA}$ 두께의 80Ni/20Cr의 합금 조성을 가지는 seed layer를 스퍼터링 공정을 통해 형성한 후 전해도금법을 이용하여 $8{\mu}m$ 두께의 구리 전도층을 형성하였다. 접합 특성 평가를 위해 ICP 규격에 따라 전도층 패턴을 폭 3.2mm, 길이 230mm로 시편을 제작하여 50.8mm/min의 이송 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 또한 $85^{\circ}C$/85% 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효 처리 후 같은 방법으로 연성회로기판의 접합 특성을 평가하였다. 파면의 형상과 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 파면의 잔여물 분석을 위해 EPMA (Energy probe microanalysis)를 사용하였고 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.77-82
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• 2012

In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.6
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• pp.1018-1023
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• 2012

In order to substitute and recycle the existing automobile parts for GMT-sheet, researches on the effects of GMT-sheet on the establishment of precise joining strength, joining condition that are lap length of joining part, compression ratio, and closure speed must be carried out but until now. Besides, many researches on adhesion joint had been conducted until now but no systematic research on press lap joint of GMT-sheet has been implemented until recently and the reliability of joining strength is not yet established. In press lap joining molding of GMT-sheet, tensile stress and lap joining connection efficiency was increased according to the increase of lap length L. However, as the increase of compression ratio and fiber content ratio per unit area was higher in tensile test, it has caused the deterioration of lap joining efficiency after joining molding of GMT-sheet. Clarify joining strength and lap joining efficiency during high temperature compression press lap joining molding of GMT-sheet and research data regarding to the lap length of joining part was presented. The purpose of this study is to contribute to the substitution of existing products as well as usage development in non-automobile field and also to find out precise dynamic characteristics as designing data of structures.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.5
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• pp.1320-1329
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• 1990

A static performance tester for a torque rod assembly was developed to evaluate the three characteristics of the rod rubber bushing : radial spring characteristic, thrust spring characteristic, and rotational torque characteristic. Among the various schemes considered in the conceptual design stage, the final versatile type was determined to perform three different tests in one machine. The performance testing machine carried out radial spring test, thrust spring test, and torque test of the torque rod assembly. Static performance of the torque rod assembly was evaluated with the tester developed and fatigue strength of the assembly was also tested with the servo-hydraulic structural fatigue testing machine. The life of the component was found to be related with the rubber quality and adhesionability between the rubber and the steel rod. The optimum rubber hardness was experimentally found by changing the chemical compositions of rubber, and the adhesion was improved by optimizing the shape of the outer section of a the rubber, this study ensured the development of a reliable torque rod assembly.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.193-197
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• 2002

The tribological properties and van der Waals attractive forces and the thermal stability of films are very important characteristics of highly hydrophobic fluorocarbon (FC) films for the long-term reliability of nano system. The effect of thermal annealing on films and van der Waals attractive forces and friction coefficient of films have been investigate d in this study. It was coated Al wafer which was treated O2 and Ar that ocatfluorocyclobutane ($C_4_{8}$) and Ar were supplied to the CVD chamber in the ratio of 2:3 for deposition of FC Films. Static contact angle and dynamic contact angle were used to characterize FC films. Thickness of films was measured by variable angle spectroscopy ellipsometer (VASE). Nanotribological data was got by atomic force microscopy (AFM) to measure roughness, lateral force microscopy (LFM) to measure friction force, and force vs. distance (FD) curve to evaluate adhesion force. FC films were cured in N2 and vacuum. The film showed the slight changes in its properties after 3 hr annealing. FTIR ATR studies showed the decrease of C-F peak intensity in the spectra as the annealing time increased. A significant decrease of film thickness has been observed. The friction force of Al surface was at least thirty times higher than ones with FC films. The adhesive force of bare Al was greater than 100 nN. After deposit FC films adhesive force was decreased to 40 nN. The adhesive force of films was decreased down to 10 nN after 24 hr annealing. During 24 hr annealing in $N_2$and vacuum at $100^{\circ}C$ film properties were not changed so much.

• Journal of the Korean Geosynthetics Society
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• v.22 no.4
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• pp.27-34
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• 2023

This paper describes the results of a pile pullout test considering the confine pressure and fines content of the ground. The Pullout tests were conducted under various ground conditions using model piles. The effect of ground confine pressure on the pullout resistance and the pullout resistance parameters of the pile were evaluated based on the experimental results. The results of pullout test showed that the maximum pullout resistance occurred at a pullout displacement of about 7mm to 9mm, regardless of the fines content and the confine pressure of the ground. The maximum pullout resistance of the pile decreased as the fines content of the ground increased, and this trend became clearer as the confine pressure increased. The pullout resistance calculated by theoretical formula was compared with the experimental results in order to ensure the reliability of the pullout test results. The comparative results showed that the experimental and theoretical values showed a tendency to decrease the pullout resistance as the fines content increased, in all confine pressure conditions. The analysis result of the pullout resistance parameters confirmed that the pullout resistance was greatly influenced by the adhesion compared to the interface friction angle, as the fines content of the ground around the pile increased.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Polymer(Korea)
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• v.36 no.3
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• pp.344-350
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• 2012

New pressure sensitive adhesives (PSAs) for polarizer film were prepared by electron beam (e-beam) radiation to acrylic copolymers, and their adhesive properties were investigated. The acrylic copolymers were synthesized by free radical polymerization of $n$-butylacrylate (BA), 2-hydroxyethyl methacrylate (HEMA), and acrylic acid (AA). The acrylic copolymers were coated on PET release films to a thickness of 25 ${\mu}m$, laminated to polarizer films, and then radiated with e-beam at room temperature. Gel fractions of all the acrylic copolymers after e-beam radiation at 50 kGy were higher than 93%, and their crosslinking densities were increased with increasing the content of HEMA units. PSA prepared by e-beam radiation of acrylic copolymer synthesized with a feed ratio of BA/HEMA/AA = 89.5/10/0.5 (w/w/w) at a dose of 50 kGy exhibited the best adhesion performances in terms of peel strength, creep resistance, durability and reliability, and light leakage. It is expected that the preparation method of PSAs via e-beam irradiation will improve the producibility and workability of polarizer film for liquid crystal display.