• Title/Summary/Keyword: active packaging

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Comparative Analysis of Phenolic Compound of Mutant Lines of Sorghum (Sorghum bicolor)

  • Ye-Jin Lee;Baul Yang;Dong-Gun Kim;Sang Hoon Kim;Soon-Jae Kwon;Jae Hoon Kim;Joon-Woo Ahn;Chang-Hyu Bae;Jaihyunk Ryu
    • Proceedings of the Plant Resources Society of Korea Conference
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    • 2022.09a
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    • pp.86-86
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    • 2022
  • Sorghum (Sorghum bicolor) is increasingly important as a biomass crop worldwide. Its genetic diversity provides a large range of biochemical composition suitable for various uses as bioplastics. Phenolic compounds are the main compounds of lignocellulosic residues, which can be used as a source of active components for their use in active packaging materials. In this research, we investigated the total phenolic content (TPC) and the total flavonoid content (TFC) among 60 mutant lines (early heading, high biomass and dwarfness) and their original cultivars. Sixty sorghum mutant lines were developed by treatment with gamma-ray or proton irradiation in 14 sorghum cultivars. The levels of TPC and TFC of 14 original cultivars were ranging from 3.27 to 11.54 mg/100 g and 2.39 to 6.74 mg/100 g, respectively. The TPCs of the mutant lines were ranging from 1.92 to 13.10 mg/100 g with average content of 6.35 mg/100 g. The TFCs of the mutant lines were ranging from 1.72 to 8.30 mg/100 g with average content of 4.20 mg/100 g. Three mutant lines derived from gamma-ray showed significant lower TPC and TFC than those of the original cultivar. While, five mutant lines showed significant higher TPC and TFC. These findings will be useful for the selection of sorghum genotypes with improved phenolic compounds.

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Storage Quality of Ready-to-Eat Campbell Table Grapes as Affected by Active Modified Atmosphere Packaging (기체충진 포장조건에 따른 신선편이 캠벨 포도의 저장 중 품질변화)

  • Lee, Hyun-Hee;Hong, Seok-In;Kim, Dongman
    • Korean Journal of Food Science and Technology
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    • v.44 no.5
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    • pp.559-567
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    • 2012
  • The storage quality of ready-to-eat Campbell table grapes which were packaged under modified atmospheres was investigated in order to examine the effect of high $O_2$ and $CO_2$ on the fruit. Fresh table grapes with 10-15 berries were packed into polypropylene (PP) trays and were top-sealed with polythylene terephthalate/PP film. The initial gas compositions inside the packages were air, 20% $O_2$/10% $CO_2$/70% $N_2$, and 40% $O_2$/60% $N_2$. Sealed packages with low density polyethylene film bags and perforated PP trays were also used as a further treatment and control, respectively. The quality attributes were assessed during storage at $5^{\circ}C$ for 28 days. Fruit packaged in high $CO_2$ concentration showed the lowest viable cell counts of inherent microorganisms among all samples, although they suffered from severe off-flavors. High levels of $O_2$ significantly lowered flesh weight loss and maintained the flavor of grape. In an overall sensory aspect, the high $O_2$ and $CO_2$ packages exhibited greater scores than the air and control at the end of the storage period. Other quality attributes showed no significant differences among treatments. Results suggest that packaging with an appropriate combination of high $O_2$ and $CO_2$ can be used as an effective processing treatment for improvement of the storability of ready-to-eat table grapes.

Effect of Gas Absorbents on Quality Attributes and Respiration Characteristics of Mature-Green Mume (Prunus mume Sieb. et Zucc) Fruits during Storage at Ambient Temperature (가스흡착제 처리가 상온 유통 청매실의 품질 및 호흡특성에 미치는 영향)

  • Cha, Hwan-Soo;Hong, Seok-In;Chung, Myong-Soo
    • Korean Journal of Food Science and Technology
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    • v.34 no.6
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    • pp.1036-1042
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    • 2002
  • During storage at $25^{\circ}C$, the effect of gas absorbents, such as carbon dioxide scavenger, ethylene absorber, and their combinations, on respiration characteristics and quality attributes of mature-green Mume fruits packaged in $30\;{\mu}m$ low density polyethylene (LDPE) film was examined. Changes in quality attributes of the fruits were observed in terms of weight loss, titratable acidity, pH, fish firmness, color, water-soluble solid, and chlorophyll contents. In the presence of ethylene absorber $(KMnO_4)$, the physiological injury was remarkably suppressed, and there was no significant injury in Mume fruits at $25^{\circ}C$ for 10 days. Yellowing and softening were also noticeably reduced by the combination of plastic film packaging and inclusion of ethylene absorber. The respiration rate was slower in fruits sealed with ethylene absorber than in those with absorbent-free packaging. Using ethylene absorber, levels of oxygen and carbon dioxide were maintained at 2-3 and 7-8%, respectively, during storage at $25^{\circ}C$ for 10 days. The addition of carbon dioxide scavenger $(Ca(OH)_2)$, negatively affected the quality attributes and respiration characteristics of the fruits. Overall results showed that ethylene removal by gas absorbent in the film packages significantly prolonged the shelf life of the fruits at ambient temperature.

A Review on the Bonding Characteristics of SiCN for Low-temperature Cu Hybrid Bonding (저온 Cu 하이브리드 본딩을 위한 SiCN의 본딩 특성 리뷰)

  • Yeonju Kim;Sang Woo Park;Min Seong Jung;Ji Hun Kim;Jong Kyung Park
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.4
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    • pp.8-16
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    • 2023
  • The importance of next-generation packaging technologies is being emphasized as a solution as the miniaturization of devices reaches its limits. To address the bottleneck issue, there is an increasing need for 2.5D and 3D interconnect pitches. This aims to minimize signal delays while meeting requirements such as small size, low power consumption, and a high number of I/Os. Hybrid bonding technology is gaining attention as an alternative to conventional solder bumps due to their limitations such as miniaturization constraints and reliability issues in high-temperature processes. Recently, there has been active research conducted on SiCN to address and enhance the limitations of the Cu/SiO2 structure. This paper introduces the advantages of Cu/SiCN over the Cu/SiO2 structure, taking into account various deposition conditions including precursor, deposition temperature, and substrate temperature. Additionally, it provides insights into the core mechanisms of SiCN, such as the role of Dangling bonds and OH groups, and the effects of plasma surface treatment, which explain the differences from SiO2. Through this discussion, we aim to ultimately present the achievable advantages of applying the Cu/SiCN hybrid bonding structure.

Design Development of Outdoor Wear for Trail Running (트레일 러닝을 위한 아웃도어 웨어 디자인 개발)

  • Kim, Yoon
    • Journal of the Korean Society of Costume
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    • v.65 no.3
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    • pp.151-166
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    • 2015
  • This research aims to study the needs of the trail runners as trail running has become a popular outdoor activity, and give suggestions for high functional outdoor menswear design that can satisfy the needs of the highly demanding taste of runners. The design development is as follows: 1) The design had to be made of lightweight material and be easily packable in all situations, and 2) we also considered the ergonomic and compact fit for activity, 3) the functional location of high functional fabric, 4) the reflective use and layering system giving a wide range of outdoor workout time and 5) the trend in 2016 S/S active sports and outdoor wear. Based on the above elements, the men's outdoor wear design has been developed for trail running in spring and summer. The design development includes a total of 7 items. The design focused on lightweight, availability of packaging, "comfortability" and freshness in activity, functional suitability of location of highly functional materials and the layering system to protect body temperature under the changing environment. In particular, the layering system was implemented to provide ventilation, and it was done in body parts that released the most body heat. Therefore, mesh materials were actively used on the side panel, sleeves and center of the back piece for necessary sweat emission without any problems and ventilation for trail running.

Importance and Satisfaction with Selection Attributes when Purchasing Kimchi (시판 김치의 구매시 중요도 및 만족도)

  • You, Jung-Hee;Shin, Min-Ja;Choi, Soo-Keun
    • Journal of the East Asian Society of Dietary Life
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    • v.18 no.4
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    • pp.624-632
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    • 2008
  • This study was conducted to estimate the drift of change for in Kimchi purchases, and to contribute to the efforts to improve the quality improvement of Kimchi sold at markets. Questionnaires were distributed to 450 adults, and 396 samples were statistically analyzed. There were significant differences in the average values of importance and satisfaction. Based on analyses of the 14 factors, the level of satisfaction was significantly lower than the level of importance. Importance-factors such as 'taste' ($4.56{\pm}0.81$) and consistency of 'quality' ($4.37{\pm}0.79$) are very important to consumers, whereas 'package volume' ($3.79{\pm}0.91$) and 'price cutting' ($3.84{\pm}1.01$) are rarely considered by consumers. Fourteen significance factors were three factors. Overall significance for selection attributes when purchasing Kimchi differed according to gender, age and marital status. Fourteen satisfaction factors were extracted to four factors. Overall satisfaction for selection attributes when purchasing Kimchi differed according to martrial status. Total satisfaction with selection attributes when purchasing the food was greatly affected by its quality and packaging. These findings confirmed that Kimchi products should be diversified and active marketing should be carried out if Kimchi is to become a global product.

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Appropriate Package Structure to Improve Reliability of IC Pattern in Memory Devices (메모리 반도체 회로 손상의 예방을 위한 패키지 구조 개선에 관한 연구)

  • 이성민
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.32-35
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    • 2002
  • The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

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Fabrication and Reliability Test of Device Embedded Flexible Module (디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가)

  • Kim, Dae Gon;Hong, Sung Taik;Kim, Deok Heung;Hong, Won Sik;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.84-88
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    • 2013
  • These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

PSPICE Modeling and Characterization of Optical Transmitter with 1550 nm InGaAsP LDs (1550 nm InGaAsP LD 광송신회로의 PSPICE 모델 및 광변조 특성 해석)

  • Goo, Yu-Rim;Kim, Jong-Dae;Yi, Jong-Chang
    • Korean Journal of Optics and Photonics
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    • v.22 no.1
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    • pp.35-39
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    • 2011
  • The PSPICE equivalent circuit elements of a 1550 nm InGaAsP laser diode were derived by using multi-level rate equations. The device parameters were extracted by using a self-consistent numerical method for the optical gain properties of the MQW active regions. The resulting equivalent circuit model is also applied to an actual optical transmitter, and its PSPICE simulation results show good agreement with the measured results once the parasitic capacitance due to the packaging is taken into account.

A Study on the Long-Term Integrity of Polymer Concrete for High Integrity Containers

  • Young Hwan Hwang;Mi-Hyun Lee;Seok-Ju Hwang;Jung-Kwon Son;Cheon-Woo Kim;Suknam Lim
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.21 no.3
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    • pp.411-417
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    • 2023
  • During the operation of a nuclear power plant (NPP), the generation of radioactive waste, including dry active waste (DAW), concentrates, spent resin, and filters, mandates the implementation of appropriate disposal methods to adhere to Korea's waste acceptance criteria (WAC). In this context, this study investigates the potential use of polymer concrete (PC) as a high-integrity container (HIC) material for solidifying and packaging these waste materials. PC is a versatile composite material comprising binding polymers, aggregates, and additives, known for its exceptional strength and chemical stability. A comprehensive analysis of PC's long-term integrity was conducted in this study. First, its compressive strength, which is crucial for ensuring the structural stability of HICs over extended periods, was evaluated. Subsequently, the resilience of PC was tested under various stress conditions, including biological, radiological, thermal, and chemical stressors. The findings of this study indicate that PC exhibits remarkable long-term properties, demonstrating exceptional stability even when subjected to diverse stressors. The results therefore underscore the potential viability of PC as a reliable material for constructing high-integrity containers, thus contributing to the safe and sustainable management of radioactive waste in NPPs.