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Monitoring System of Agriculture Fields using ZigBee Modules

  • Ayurzana, Odgerel;Tsagaanchuluun, Sugir
    • International journal of advanced smart convergence
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    • v.10 no.1
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    • pp.89-96
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    • 2021
  • The goal of this study is to develop experiment monitoring system of agriculture fields using ZigBee wireless modules. Soil moisture, ambient temperature, atmospheric pressure and intensity of sunlight are the most important factorsto grow a wheat crop and other vegetables. In orderto monitorthe factorssoil moisture (YL69), air pressure (BMP180), temperature (DS18B20), photoresistor were used for sensing environment data. The TI CC2530 RF SoC chip was used in the system. ZigBee modules were connected to star topology. ZigBee modules send data wirelessly to a data center. This data can be displayed and analyzed on the main monitoring program as needed also sent to the client mobile. Characteristics of the sensors were determined by experiment results.

Study on Angular Rate Sensor using Sol-Gel PZT thin film (Sol-gel 압전체 박막을 이용한 각속도 센서에 대한 연구)

  • Lee, S. H.;R. Meada;M. Esashi
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.34-34
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    • 2003
  • Piezoelectric or magnetostrictive materials, known as smart materials, have been researched widely for sensors or actuators in micro system technology. In our research, thick sol-gel lead zirconate titanate(Pb(Zr$\sub$1-x/Ti$\sub$x/)O$_3$) films were fabricated and their characteristics were investigated f3r angular rate sensor applications. The thickness of the PZT films is 1.5${\mu}$m, which is required by a vibration angular rate sensor for a good actuation and sensing. The remnant polarization of the PZT flms is 12.0 ${\mu}$C/$\textrm{cm}^2$. The electromechanical constants of PZT thin film showed the value of susceptance(B) of 4800${\mu}$ s at capacitance of 790pF. The PZT films were applied to the vibration angular rate sensor structure and the vibration of 1.78 ${\mu}$m in amplitude at the resonant frequency of 35.8㎑ was obtained by driving voltage of 5V$\sub$p-p/ of bulk piezoelectric materials with out of phase signal through voltage and inverting amplifier.

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The PTCR Characteristics of the Laminated SMD-Type PTC Thermistor as a Function of the Heat Treatment Conditions (적층 SMD형 PTC 써미스터의 열처리 조건에 따른 PTCR 특성 변화)

  • Lee, Mi-Jai;Jang, Jae-Woon;Lim, Tae-Young;Park, Seong-Chul;Song, Jun-Baek;Han, Cheong-Hwa
    • Journal of the Korean Ceramic Society
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    • v.49 no.5
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    • pp.432-437
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    • 2012
  • Electrical properties of the laminated SMD-type PTC thermistor for microcircuit protection were investigated as a function of calcination and sintering temperature. $BaTiO_3$ with $Y_2O_3$ and $MnO_2$ were calcined at 1000 to $1150^{\circ}C$ for 2h and the laminated SMD-type PTC thermistor was sintered at 1350 to $1400^{\circ}C$ for 2h in a reduced atmosphere (1% $H_2/N_2$). Sintered density of the sample was dependent on the calcination and sintering temperature. Electrical properties of the sintered samples were strongly dependent on the densities of samples. For the samples with density below 4.6 g/$cm^3$, the insulator characteristics were observed, while PTC jump characteristics (R150/R30) were disappeared for the sample with density above 5.05 g/$m^3$. Optimal PTC characteristics were obtained for the sintered samples with density of 5.05 g/$m^3$. The laminated SMD-type PTC thermistor prepared by calcination at $1100^{\circ}C$ for 2h and sintering at $1270^{\circ}C$ for 2h showed the room temperature resistivity of $11{\Omega}{\cdot}cm$ and PTC jump characteristics of $10^2$ order.

Study on Relation between $H_2$ Evolution and Photoelectrical Properties of Photoanode (광어노드의 수소 제조와 광전기 특성에 관한 상관관계 연구)

  • Bae, Sang-Hyun;Kang, Joon-Won;Shim, Eun-Jung;Yoon, Jae-Kyung;Joo, Hyun-Ku
    • Transactions of the Korean hydrogen and new energy society
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    • v.18 no.3
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    • pp.244-249
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    • 2007
  • The present work considers the concept of enzymatic photoelectrochemical generation of hydrogen through water splitting using a Xe lamp as a source of light. A solar cell was applied to the system in order to shift the level of electrochemical energy of the system, resulting in the rate of hydrogen production at $43\;{\mu}mol/(cm^2{\times}hr)$ in cathodic compartment with an anodized tubular $TiO_2$ electrode(ATTE, $5^{\circ}C$/1hr in 0.5 wt% HF-$650^{\circ}C$/5hr). The trend of the rate of hydrogen production, for the ATTEs with different annealing temperature from $350^{\circ}C$ to $850^{\circ}C$, fairly well coincided with the photoelectrical properties measured by potentiostat. The actual chemical bias through imposition of two electrolytes of different pHs between anode(13.68) and cathode(7.5) was 0.24eV.

Characteristics of the ( Pb, La ) $TiO_3$ Thin Films with Pb/La Compositions (Pb/La 조성에 따른 ( Pb, La ) $TiO_3$ 박막의 특성 변화)

  • Kang, Seong-Jun;Joung, Yang-Hee;Yoon, Yung-Sup
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.1
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    • pp.29-37
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    • 1999
  • In this study, we have prepared PLT thin films having various La concentrations by using sol-gel method and studied on the effect of La concentration on the electrical properties of PLT thin films. As the La concentration increases from 5mol% to 28mol%, the dielectric constant at 10kHz increases from 428 to 761, while the loss tangent decreases from 0.063 to 0.024. Also, the leakage current density at 150kV/cm has a tendency to decrease from 6.96${\mu}A/cm^2$ to 0.79${\mu}A/cm^2$. In the result of hysteresis loops of PLT thin films, the remanent polariation and the coercive field decrease from 9.55${\mu}C/cm^2$ to 1.10${\mu}C/cm^2$ and from 46.4kV/cm to 13.7kV/cm, respectively. With the result of the fatigue test on the PLT thin films, we have found that the fatigue properties are improved remarkably as the La concentration increases from 5 mol% to 28mol%. In particular, the PLT28) has paraelectric phase and its charge storage clensity and leakage current density at 5V are 134fC/${\mu}cm^2$ and 1.01${\mu}A/cm^2$, respectively. The remanent polarization and coercive field of the PLT(10) film are 6.96${\mu}C/cm^2$ and 40.2kV/cm, respectively. After applying of $10^9$ square pulses with ${\pm}5V$, the remanent polarilzation of the PLT(10) film decreases about 20% from the initial state. In the results, we conclude that the 10mol% and the 28mol% La doped PLT thin films are very suitable for the capacitor dielectrics of new generation of DRAM and NVFRAM respecitively.

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Implementation of Multi-Core Processor for Beamforming Algorithm of Mobile Ultrasound Image Signals (모바일 초음파 영상신호의 빔포밍 알고리즘을 위한 멀티코어 프로세서 구현)

  • Choi, Byong-Kook;Kim, Jong-Myon
    • The KIPS Transactions:PartA
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    • v.18A no.2
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    • pp.45-52
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    • 2011
  • In the past, a patient went to the room where an ultrasound image diagnosis device was set, and then he or she was examined by a doctor. However, currently a doctor can go and examine the patient with a handheld ultrasound device who stays in a room. However, it was implemented with only fundamental functions, and can not meet the high performance required by the focusing algorithm of ultrasound beam which determines the quality of ultrasound image. In addition, low energy consumption was satisfied for the mobile ultrasound device. To satisfy these requirements, this paper proposes a high-performance and low-power single instruction, multiple data (SIMD) based multi-core processor that supports a representative beamforming algorithm out of several focusing methods of mobile ultrasound image signals. The proposed SIMD multi-core processor, which consists of 16 processing elements (PEs), satisfies the high-performance required by the beamforming algorithm by exploiting considerable data-level parallelism inherent in the echo image data of ultrasound. Experimental results showed that the proposed multi-core processor outperforms a commercial high-performance processor, TI DSP C6416, in terms of execution time (15.8 times better), energy efficiency (6.9 times better), and area efficiency (10 times better).

Analysis of Apparent Fracture Toughness of a Thick-Walled Cylinder with an FGM Coating at the Inner Surface Containing a Radial Edge Crack (반경방향의 모서리 균열을 갖고 내면이 경사기능재료(FGM)로 코팅된 두꺼운 실린더의 겉보기 파괴인성해석)

  • Afsar, A.M.;Rasel, S.M.;Song, J.I.
    • Composites Research
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    • v.23 no.2
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    • pp.1-9
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    • 2010
  • This study analyzes the apparent fracture toughness of a thick-walled cylinder with a functionally graded material (FGM) coating at the inner surface of the cylinder. The cylinder is assumed to have a single radial edge crack emanating from its inner surface. The crack surfaces and the inner surface of the cylinder are subjected to an internal pressure. The incompatible eigenstrain developed in the cylinder due to nonuniform coefficient of thermal expansion as a result of cooling from sintering temperature is taken into account. Based on a method of evaluating stress intensity factor introduced in our previous study, an approach is developed to calculate apparent fracture toughness. The approach is demonstrated for a cylinder with a TiC/$Al_{2}O_{3}$ FGM coating and some numerical results of apparent fracture toughness are presented graphically. The effects of material distribution profile, cylinder wall thickness, application temperature, and coating thickness on the apparent fracture toughness are investigated in details. It is found that all of these factors play an important role in controlling the apparent fracture toughness of the cylinder.

Copper Filling to TSV (Through-Si-Via) and Simplification of Bumping Process (비아 홀(TSV)의 Cu 충전 및 범핑 공정 단순화)

  • Hong, Sung-Jun;Hong, Sung-Chul;Kim, Won-Joong;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.79-84
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    • 2010
  • Formation of TSV (Through-Si-Via) with an Au seed layer and Cu filling to the via, simplification of bumping process for three dimensional stacking of Si dice were investigated. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process using $SF_6$ and $C_4F_8$ plasmas alternately. The vias were 40 ${\mu}m$ in diameter, 80 ${\mu}m$ in depth, and were produced by etching for 1.92 ks. On the via side wall, a dielectric layer of $SiO_2$ was formed by thermal oxidation, and an adhesion layer of Ti, and a seed layer of Au were applied by sputtering. Electroplating with pulsed DC was applied to fill the via holes with Cu. The plating condition was at a forward pulse current density of 1000 mA/$dm^2$ for 5 s and a reverse pulse current density of 190 mA/$dm^2$ for 25 s. By using these parameters, sound Cu filling was obtained in the vias with a total plating time of 57.6 ks. Sn bumping was performed on the Cu plugs without lithography process. The bumps were produced on the Si die successfully by the simplified process without serious defect.

Fabrication and Electrical Properties of PZT/BFO Multilayer Thin Films

  • Jo, Seo-Hyeon;Nam, Sung-Pil;Lee, Sung-Gap;Lee, Seung-Hwan;Lee, Young-Hie;Kim, Young-Gon
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.5
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    • pp.193-196
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    • 2011
  • Lead zirconate titanate (PZT)/ bismuth ferrite (BFO) multilayer thin films have been fabricated by the spin-coating method on Pt(200 nm)/Ti(10 nm)/$SiO_2$(100 nm)/p-Si(100) substrates using $BiFeO_3$ and $Pb(Zr_{0.52}Ti_{0.48})O_3$ metal alkoxide solutions. The PZT/BFO multilayer thin films show a uniform and void-free grain structure, and the grain size is smaller than that of PZT single films. The reason for this is assumed to be that the lower BFO layers play an important role as a nucleation site or seed layer for the formation of homogeneous and uniform upper PZT layers. The dielectric constant and dielectric losses decreased with increasing number of coatings, and the six-layer PZT/BFO thin film has good properties of 162 (dielectric constant) and 0.017 (dielectric losses) at 1 kHz. The remnant polarization and coercive field of three-layer PZT/BFO thin films were 13.86 ${\mu}C/cm^2$ and 37 kV/cm respectively.

Temperature vs. Resistance Characteristics by Dopants of VO2 Thick-Film Critical Temperature Sensors (불순물 첨가에 따른 VO2 후막 급변온도센서의 온도-저항 특성)

  • Choi, Jung Bum;Kang, Chong Yun;Yoon, Seok-Jin;Yoo, Kwang Soo
    • Journal of Sensor Science and Technology
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    • v.23 no.5
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    • pp.337-341
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    • 2014
  • For various additives doped-$VO_2$ critical temperature sensors using the nature of semiconductor to metal transition, the crystallinity, microstructure, and temperature vs. resistance characteristics were systematically investigated. As a starting material of $VO_2$ sensor, vanadium pentoxide ($V_2O_5$) powders were used, and CaO, SrO, $Bi_2O_3$, $TiO_2$, and PbO dopants were used, respectively. The $V_2O_5$ powders with dopants were mixed with a vehicle to form paste. This paste was silk screen-printed on $Al_2O_3$ substrates and then $V_2O_5$-based thick films were heat-treated at $500^{\circ}C$ for 2 hours in $N_2$ gas atmosphere for the reduction to $VO_2$. From X-ray diffraction analysis, $VO_2$ phases for pure $VO_2$, and CaO and SrO-doped $VO_2$ thick films were confirmed and their grain sizes were 0.57 to $0.59{\mu}m$. The on/off resistance ratio of the $VO_2$ sensor in phase transition temperature range was $5.3{\times}10^3$ and that of the 0.5 wt.% CaO-doped $VO_2$ sensor was $5.46{\times}10^3$. The presented critical temperature sensors could be commercialized for fire-protection and control systems.