• 제목/요약/키워드: X2 Interface

검색결과 588건 처리시간 0.029초

Extended-FEM for the solid-fluid mixture two-scale problems with BCC and FCC microstructures

  • Sawada, Tomohiro;Nakasumi, Shogo;Tezuka, Akira;Fukushima, Manabu;Yoshizawa, Yu-Ichi
    • Interaction and multiscale mechanics
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    • 제2권1호
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    • pp.45-68
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    • 2009
  • An aim of the study is to develop an efficient numerical simulation technique that can handle the two-scale analysis of fluid permeation filters fabricated by the partial sintering technique of small spherical ceramics. A solid-fluid mixture homogenization method is introduced to predict the mechanical characters such as rigidity and permeability of the porous ceramic filters from the micro-scale geometry and configuration of partially-sintered particles. An extended finite element (X-FE) discretization technique based on the enriched interpolations of respective characteristic functions at fluid-solid interfaces is proposed for the non-interface-fitted mesh solution of the micro-scale analysis that needs non-slip condition at the interface between solid and fluid phases of the unit cell. The homogenization and localization performances of the proposed method are shown in a typical two-dimensional benchmark problem whose model has a hole in center. Three-dimensional applications to the body-centered cubic (BCC) and face-centered cubic (FCC) unit cell models are also shown in the paper. The 3D application is prepared toward the computer-aided optimal design of ceramic filters. The accuracy and stability of the X-FEM based method are comparable to those of the standard interface-fitted FEM, and are superior to those of the voxel type FEM that is often used in such complex micro geometry cases.

Eutectic-based Phase-change Recording Materials for 1-2X and 4X Speed Blu-ray Disc

  • Seo Hun;Lee Seung-Yoon;Lee Kwang- Lyul;Kim Jin-Hong;Bae Byeong-Soo
    • 정보저장시스템학회논문집
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    • 제1권1호
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    • pp.34-41
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    • 2005
  • We report some recent results in the rewritable Blu-ray Disc with enhanced overwrite cyclability by using the growth dominant eutectic based Ge(Sb70Te30)+Sb recording layer, GeN interface layer and write strategy optimization. We have developed phase-change optical media with appropriate write strategy for 36(i.e., 1X)-72Mbps(i.e., 2X) dual speed Blu-ray Disc system and fur the future high speed optical data storage. For recording layer, eutectic-based Ge(Sb70Te30)+Sb material was used and Sb/Te ratio and Ge content were optimized to obtain proper erasability and archival stability of recorded amorphous marks. The recording layer is wrapped up in GeN interface layers to obtain overwrite cyclability and higher crystallization speed. In addition, we designed appropriate write strategy so called Time-Shifted Multipulse (TSMP) write strategy where starting position of multipulse parts are shined from reference clock. With this write strategy, the jitter characteristics of the disc was improved and we found that leading edge jitter was improved much more than trailing edge jitter in 1X-2X speed recording. Finally, we investigated the higher speed feasibility of 144Mbps(i.e., 4X) by adopting some elemental doping to the eutectic based Ag-In-Sb-Te recording layer and structural optimization of constitution layers in Blu-ray Disc. In the paper, we report the effect of Sn addition for the feasibility of higher speed recording. The addition of Sn shows increases of the crystallization speed of phase change recording layer.

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질산산화법을 이용한 SiO2/Si 구조의 계면결함 제거 (Removal of Interface State Density of SiO2/Si Structure by Nitric Acid Oxidation Method)

  • 최재영;김도연;김우병
    • 한국재료학회지
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    • 제28권2호
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    • pp.118-123
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    • 2018
  • 5 nm-thick $SiO_2$ layers formed by plasma-enhanced chemical vapor deposition (PECVD) are densified to improve the electrical and interface properties by using nitric acid oxidation of Si (NAOS) method at a low temperature of $121^{\circ}C$. The physical and electrical properties are clearly investigated according to NAOS times and post-metallization annealing (PMA) at $250^{\circ}C$ for 10 min in 5 vol% hydrogen atmosphere. The leakage current density is significantly decreased about three orders of magnitude from $3.110{\times}10^{-5}A/cm^2$ after NAOS 5 hours with PMA treatment, although the $SiO_2$ layers are not changed. These dramatically decreases of leakage current density are resulted from improvement of the interface properties. Concentration of suboxide species ($Si^{1+}$, $Si^{2+}$ and $Si^{3+}$) in $SiO_x$ transition layers as well as the interface state density ($D_{it}$) in $SiO_2/Si$ interface region are critically decreased about 1/3 and one order of magnitude, respectively. The decrease in leakage current density is attributed to improvement of interface properties though chemical method of NAOS with PMA treatment which can perform the oxidation and remove the OH species and dangling bond.

고성능 DSP를 이용한 톤 송수신기의 실시간 구현 (Real-time Implementation of a Tone Sender/Receiver on a High Performance DSP)

  • 최용수;함정표;조성범;강태익;윤정현
    • 한국음향학회지
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    • 제22권4호
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    • pp.276-285
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    • 2003
  • 본 논문에서는 고성능 DSP (Digital Signal Processor)를 사용하여 R2MFC/DTMF (R2 Multi Frequency Combinations/Dual Tone Multiple Frequency) 톤 송수신기를 실시간 구현하여 대용량 VoIP (Voice over Internet Protocol) 게이트웨이 시스템에 적용한다. 수신기는 Goertzel 필터를, 송출기는 고조파 공명 필터를 이용한다. DMA (Direct Memory Access)와 McBSP(Multi Channel Buffered Serial Port)를 사용한 효과적인 PCM 입출력, HPI (Host Port Interface)를 통한 MPU (Main Processing Unit)와의 메시지 통신 등 Texas Instruments TMS320C62x DSP를 이용한 다채널 실시간 구현 기법에 관하여 상세히 기술한다. 실험 결과, 구현된 R2MFC/DTMF 송수신기는 ITU-T(International Telecommunication Union-Telecommunication) 조건을 만족하며, 최적화 된 코드는 250 ㎒ C62x에서 780 채널을 수용할 수 있는 계산량을 보였다.

황처리가 금속/InP Schootky 접촉과 $Si_3$$N_4$/InP 계면들에 미치는 영향 (Effects of sulfur treatments on metal/InP schottky contact and $Si_3$$N_4$/InP interfaces)

  • 허준;임한조;김충환;한일기;이정일;강광남
    • 전자공학회논문지A
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    • 제31A권12호
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    • pp.56-63
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    • 1994
  • The effects of sulfur treatments on the barrier heithts of Schottky contacts and the interface-state density of metal-insulator-semiconductor (MIS) capacitors on InP have been investigated. Schottky contacts were formed by the evaporation of Al, Au, and Pt on n-InP substrate before and after (NH$_{4}$)$_{2}$S$_{x}$ treatments, respectively. The barrier height of InP Schottky contacts was measured by their current-voltage (I-V) and capacitance-voltage (C_V) characteristics. We observed that the barrier heights of Schottky contacks on bare InP were 0.35~0.45 eV nearly independent of the metal work function, which is known to be due to the surface Fermi level pinning. In the case of sulfur-treated Au/InP ar Pt/InP Schottky diodes, However, the barrier heights were not only increased above 0.7 eV but also highly dependent on the metal work function. We have also investigated effects of (NH$_{4}$)$_{2}$S$_{x}$ treatments on the distribution of interface states in Si$_{3}$N$_{4}$InP MIS diodes where Si$_{3}$N$_{4}$ was provided by plasma enhanced chemical vapor deposition (PECVD). The typical value of interface-state density extracted feom 1 MHz C-V curve of sulfur-treated SiN$_{x}$/InP MIS diodes was found to be the order of 5${\times}10^{10}cm^{2}eV^{1}$. This value is much lower than that of MiS diodes made on bare InP surface. It is certain, therefore, that the (NH$_{4}$)$_{2}$S$_{x}$ treatment is a very powerful tool to enhance the barrier heights of Au/n-InP and Pt/n-InP Schottky contacts and to reduce the density of interface states in SiN$_{x}$/InP MIS diode.

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미세 Cu 배선 적용을 위한 SiNx/Co/Cu 박막구조에서 Co층이 계면 신뢰성에 미치는 영향 분석 (Effect of Co Interlayer on the Interfacial Reliability of SiNx/Co/Cu Thin Film Structure for Advanced Cu Interconnects)

  • 이현철;정민수;김가희;손기락;박영배
    • 마이크로전자및패키징학회지
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    • 제27권3호
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    • pp.41-47
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    • 2020
  • 비메모리 반도체 미세 Cu배선의 전기적 신뢰성 향상을 위해 SiNx 피복층(capping layer)과 Cu 배선 사이 50 nm 두께의 Co 박막층 삽입이 계면 신뢰성에 미치는 영향을 double-cantilever beam (DCB) 접착력 측정법으로 평가하였다. DCB 평가 결과 SiNx/Cu 구조는 계면접착에너지가 0.90 J/㎡이었으나 SiNx/Co/Cu 구조에서는 9.59 J/㎡으로 SiNx/Cu 구조보다 약 10배 높게 측정되었다. 대기중에서 200℃, 24시간 동안 후속 열처리 진행한 결과 SiNx/Cu 구조는 0.93 J/㎡으로 계면접착에너지의 변화가 거의 없는 것으로 확인되었으나 SiNx/Co/Cu 구조에서는 2.41 J/㎡으로 열처리 전보다 크게 감소한 것을 확인하였다. X-선 광전자 분광법 분석 결과 SiNx/Cu 도금층 사이에 Co를 증착 시킴으로써 SiNx/Co 계면에 CoSi2 반응층이 형성되어 SiNx/Co/Cu 구조의 계면접착에너지가 매우 높은 것으로 판단된다. 또한 대기중 고온에서 장시간 후속 열처리에 의해 SiNx/Co 계면에 지속적으로 유입된 산소로 인한 Co 산화막 형성이 계면접착에너지 저하의 주요인으로 판단된다.

BSCCO 초전도 선재의 미세조직 및 임계전류밀도에 미치는 공정변수 효과 (Effect of Processing Variables on Microstructure and Critical Current Density of BSCCO Superconductors Tape)

  • 지봉기;김태우;주진호;김원주;이희균;홍계원
    • 한국전기전자재료학회논문지
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    • 제11권11호
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    • pp.1014-1021
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    • 1998
  • We evaluated the effect of processing variables on microstructural evolution interface irregularity between Ag sheath and superconductor core and resultant critical current density(J$_{c}$) of (Bi,Pb)$_2$Sr$_2$Ca$_2$Cu$_3$O$_{x}$(2223) superconductor tape. The value of J$_{c}$ was significantly influenced by the interface irregularity, degree of texturing and relative 2223 content. The interface became more irregular(sausage effect), while the degree of texturing gradually improved as the dimension of tape decreased during forming process. As the dimension of wire/tape were changed from diameter of 3.25 mm to thickness of 0.20 mm, J$_{c}$ value was observed to be increased by 10 times. In addition, optimum sintering temperature for improved J$_{c}$ was observed to be 835$^{\circ}C$ in a ambient atmosphere probably due to combined effect of both improved texturing and high 2223 content. Microstructural investigation showed the degree of texturing was degraded by the existence of both second phases and interface irregularity. It was observed that larger grain size and better texturing was developed near relatively flat interface compared to those inside superconducting core.ting core.

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In-situ XPS Study of Core-levels of ZnO Thin Films at the Interface with Graphene/Cu

  • Choi, Jinsung;Jung, Ranju
    • Journal of the Korean Physical Society
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    • 제73권10호
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    • pp.1546-1549
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    • 2018
  • We have investigated core-levels of ZnO thin films at the interface with the graphene on Cu foil using in-situ X-ray Photoelectron Spectroscopy (XPS). Spectral evolution of C 1s, Zn 2p, and O 1s are observed in real time during RF sputtering deposition. We found binding energy (BE) shifts of Zn 2p and 'Zn-O' state of O 1s depending on ZnO film thickness. Core-levels BE shifts of ZnO will be discussed on the basis of electron transfer at the interface and it may have an important role in the electronic transport property of the ZnO/graphene-based electronic device.

액시머 레이저로 증착된 초전도박막과 사파이어 기판간 계면 특성 분석 (Interface Characterization of Supeconducting Thin Film on Sapphire Grown by an Excimer Laser)

  • 이상렬;박형호;강광용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1995년도 추계학술대회 논문집
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    • pp.148-151
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    • 1995
  • Excimer laser has been used to fabricate superconducting YBa$_2$Cu$_3$O$\sub$7-x/(YBCO) thin films on various substrates. An XeCl excimer laser with an wavelength of 308 nm was used to deposit both buffer layer and superconducting thin film on sapphire substrate. The characterizations of the interface between thin film and substrate were performed. The interfacial properties of thin films on buffered sapphire and on bare sapphire were compared. With a 20 nm PrBa$_2$Cu$_3$O$\sub$7-x/(PBCO) buffer layer, no diffusion layer was observed between film and substrate while the diffusion layer with about 30 nm thickness was observed between film and sapphire without buffer layer.

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Interface Characteristics of Ion Beam Mixed Cu/polyimide system

  • G.S.Chang;Jung, S.M.;Lee, Y.S.;Park, I.S.;Kang, H.J.;J.J.Woo;C.N.Whang
    • 한국진공학회지
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    • 제4권S2호
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    • pp.1-7
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    • 1995
  • Cu(400$\AA$)/Polyimide has been mixed with 80 keV Ar+ and N2+from 1.0X1015ions/$\textrm{cm}^2$ to 2.0X1016 ions/$\textrm{cm}^2$. The changes of chemical bond and internal properties of sample are investigated by X-ray photoelectron spectroscopy(XPS). The quantitative adhesion strength is measured by using scratch test. The optimized mixing condition is that Cu/PI is irradiated with 80 keV N2+ at a dose of 1.0X1015 ions/$\textrm{cm}^2$, because N2+ ions can product more pyridine-like moiety, amide group, and tertiary amine moiety which are known as adesion promoters than Ar+.

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