• Journal of Korean Society of Coastal and Ocean Engineers
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• v.28 no.1
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• pp.27-33
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• 2016

A numerical analysis on deck wetness is carried out for a large caisson directly wet-towed by tugs in irregular waves. A constant panel method is used for linear analysis in frequency domain and a statistical post-processing for the deck wetness is presented. Hydrodynamic coefficients obtained from the frequency domain computation are imported for time domain analysis which enables complete modeling for towing equipment, environment, etc. Both frequency and time domain computations over two sea states are performed and comparison is made. In the time domain analysis, towing systems of various arrangements of tugs are investigated from short-term prediction for the largest deck wetness and the number of occurrences of deck wetness.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1404-1409
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• 2007

Polymers for laser sintering were needed in order to fabricate the articles with the three-dimensional duplication equipment of SLS (selective laser sintering) process. The thermal properties, particle size, distribution, and shape of polymer powder had a close relation with the processibility of laser sintering. In this study, we prepared new polymer powders with uniform size and higher bulk density by wet process. Wet process consists of several finely-controlled steps such as dissolution, nucleation, propagation and crystallization. Several additives were added to improve the thermal, rheological, and flow properties.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.157-162
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• 2005

The wafer's size has been increased up to 300mm according as the devices have been integrated sophisticatedly. For this process to make 300mm-wafer, it is required strict level which removes the particulates on the surface of wafer. Therefore we need new type wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is very important to control the temperature and the concentration of chemical wet-stat ion. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical in cleaning process, but also it is difficult to make fit quantity and temperature. We propose new chemical supply system, which overcomes the problems via analysis of fluid and thermal transfer on chemical supply system,

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.123-128
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• 2004

Semiconductor Wet Station has a very important place in semiconductor process. It is important that to discharge chemical with fit concentration and temperature using chemical supply system for clean process. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical which is need in clean process, but also difficult to make fit concentration and temperature. Moreover, it has high stability but it is inefficient spatially because its volume is great. We propose In-line System to improve system with implement analysis of fluid and thermal transfer on chemical supply system and understand problem of system.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.418.2-418.2
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• 2016

$Al_2O_3$ passivation layer has excellent passivation properties at p-type Si surface. This $Al_2O_3$ layer forms thin $SiO_2$ layer at the interface. There were some studies about inserting thermal oxidation process to replace naturally grown oxide during $Al_2O_3$ deposition. They showed improving passivation properties. However, thermal oxidation process has disadvantage of expensive equipment and difficult control of thin layer formation. Wet chemical oxidation has advantages of low cost and easy thin oxide formation. In this study, $Al_2O_3$/$SiO_2/Si(100)$ interface was formed by wet chemical oxidation and PA-ALD process. $SiO_2$ layer at Si wafer was formed by $HCl/H_2O_2$, $H_2SO_4/H_2O_2$ and $HNO_3$, respectively. 20nm $Al_2O_3$ layer on $SiO_2/Si$ was deposited by PA-ALD. This $Al_2O_3/SiO_2/Si(100)$ interface were characterized by capacitance-voltage characteristics and quasi-steady-state photoconductance decay method.

• Journal of the Korea Concrete Institute
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• v.11 no.6
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• pp.121-128
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• 1999

The SHO PATCH System Mortar is a mortar shotcreting system which uses fairly small machine and equipment, and is applied for shotcrete tunnel linings, in particular for small bore tunnels of aqueducts by the TBM(Tunnel Boring Machine) method, and for reparing tunnels suffering from spring water and deterioration. This study shows the characteristics of the new mortar shotcreting system, the SHOT PATCh System Mortar, which exhibits excellent shotcrete performance.

• Proceedings of the Korea Concrete Institute Conference
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• 1998.10b
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• pp.871-876
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• 1998

The SHOT PATCH System Remitar is a mortar shotcreting system which used fairly small machine and equipment, and is applied for shortcrete tunnel linings, in particular for small bore tunnels of aqueducts by the TBM(Tunnel Boring Machine) method, and for repairing tunnels suffering from spring water and deterioration. This study shows the characteristics of the new mortar shotcreting system, the SHOT PATCH System Remitar, which exhibits excellent shotcrete performance.

• KIEAE Journal
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• v.4 no.3
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• pp.45-52
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• 2004

The purpose of this research was to identify the structural characteristics of open housing typologically and systematically. The main method of this study was content analysis and literature review on open housing. This study found that the typological analysis on terminology and the details of the constituents concerning structural patterns in open housing indicated that the main approaches were classified into three criteria such as 'Organization Element', 'Construction Element', and 'Equipment Element'. Organization Element was classified into 'Main Dwelling Unit Area and its Form', 'Room Organization Method', 'Relationship with the Main Dwelling Unit's External Constituents', and 'Combination Method of Support and Infill'. Construction Element was classified into 'Method of Structure' and 'Structural Element Technology'. Equipment Element was classified into 'Method of Using Duct' and 'Wet Zone Method'. The attributes were determined based on these classifications. The results of this study can be used to construct an evaluation tool and further to develop a framework in understanding open housing. Technical research should be conducted on the variables that affect the flexibility of space.

• Restorative Dentistry and Endodontics
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• v.25 no.2
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• pp.243-253
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• 2000

The purpose of this in vitro study was to evaluate dentin bonding by two different dentin bonding systems(DBS) using acetone based primer or adhesive [All Bond 2(AB2), One Step(OS)] when they were applied by wet or dry bonding technique. Morphology of resin-dentin interface and hybrid layer thickness(HLT) were investigated using Confocal Laser Scanning Microscope(CLSM) and compared to shear bond strength(SBS). 72 extracted sound human molars were randomly divided into 4 groups of 18 teeth each - Group 1.(AW); AB2 by wet bonding. Group 2(AD); AB2 by dry bonding. Group 3.(OW); OS by wet bonding, Group 4.(OD); OS by dry bonding. In 6 teeth of each group, notch-shaped class V cavities(depth 2mm) were prepared on buccal and lingual surface at the cementoenamel juction(12 cavities per group). To obtain color contrast in CLSM observation, bonding resins of each DBS were mixed with rhodamine B and primer of AB2 was mixed with sodium fluorescein. Prepared teeth of each group were treated with AB2, OS, respectively according to the manufacturer's instructions except for dentin surface moisture treatment after acid etching. In group 1 and 3, after acid etching, excess water was removed with wet tissue(Kimwipes), leaving consistently shiny, visibly hydrated dentin surface. In group 2 and 4, dentin surface was dried for 10 seconds at 1 inch distance. The treated teeth were then packed with composite resin(${\AE}$litefil) and light-cured. 12 microscopic samples($60{\sim}80{\mu}m$ thickness) of each group were obtained after longitudinal section and grinding(Exakt cutting and grinding system). Morphological investigation of resin-dentin interface and HLT measurement using CLSM were done. For measurement of SBS, remaining 12 teeth of each group were flattened occlusally to remove all enamel and grinded to 500 grit SiC(Pedemet Specimen Preparation Equipment). After applying DBS on the exposed dentin surface, composite resin was applied in the shape of cylinder, which has 5mm diameter, 1.5mm thickness, and light cured. SBS was measured using Instron with a crosshead speed of 0.5mm/min. It was concluded as follows, 1. HLT of AW(mean: $2.59{\mu}m$) was thicker than any other group, and followed by AD, OW, OD in descending order(mean; 2.37, 2.28, $1.92{\mu}m$). Only OD had statistically significant differences(p<0.05) to AW and AD. 2. There were intimate contact of resin and dentin at the interface in wet bonding groups, but gaps or irregular interfaces were observed in dry bonding groups. 3. The length, diameter, density of resin tags were various even in the same group without significant differences between groups and lots of adhesive lateral branches were observed. 4. There were no statistically significant difference of SBS between AB2 and OS, but SBS of wet bonding groups were significantly higher(p<0.05) than dry bonding groups. 5. There were no consistent relationships between HLT and SBS.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.650-656
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• 2018

The TFT-LCD industry is a kind of large-scale industrial Giant Microelectronics device industry and has a similar semiconductor process technology. Wet etching forms a relatively large proportion of the entire TFT process, but the number of published research papers on this topic is limited. The main reason for this is that the components of the etchant, in which the reaction takes place, are confidential and rarely publicized. Aluminum (Al) and copper (Cu), which have been used in recent years for the manufacture of large area LCDs, are very difficult materials to process using wet etching. Cu, a low-resistance material, can only be used in the wet etching process, and is used as a substitute for Al due to its high speed etching, low failure rate, and low power consumption. Further, the abnormal reaction of hydrogen peroxide ($H_2O_2$), which is used as an etching solution, requires additional piping and electrical safety devices. This paper proposes a method of minimizing the damage to the plant in the case of adverse reactions, though it cannot limit the adverse reaction of hydrogen peroxide. In recent years, there have been many cases in which aluminum etching equipment has been changed to copper. This paper presents a countermeasure against abnormal reactions by implementing safety PLC with a high safety grade.