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http://dx.doi.org/10.5762/KAIS.2018.19.4.650

A study on Safety Management and Control in Wet-Etching Process for H2O2 Reactions  

Yoo, Heung-Ryol (Department of Mechanical Facility Control Engineering, Korea University of Technology and Education)
Son, Yung-Deug (Department of Mechanical Facility Control Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.19, no.4, 2018 , pp. 650-656 More about this Journal
Abstract
The TFT-LCD industry is a kind of large-scale industrial Giant Microelectronics device industry and has a similar semiconductor process technology. Wet etching forms a relatively large proportion of the entire TFT process, but the number of published research papers on this topic is limited. The main reason for this is that the components of the etchant, in which the reaction takes place, are confidential and rarely publicized. Aluminum (Al) and copper (Cu), which have been used in recent years for the manufacture of large area LCDs, are very difficult materials to process using wet etching. Cu, a low-resistance material, can only be used in the wet etching process, and is used as a substitute for Al due to its high speed etching, low failure rate, and low power consumption. Further, the abnormal reaction of hydrogen peroxide ($H_2O_2$), which is used as an etching solution, requires additional piping and electrical safety devices. This paper proposes a method of minimizing the damage to the plant in the case of adverse reactions, though it cannot limit the adverse reaction of hydrogen peroxide. In recent years, there have been many cases in which aluminum etching equipment has been changed to copper. This paper presents a countermeasure against abnormal reactions by implementing safety PLC with a high safety grade.
Keywords
Al; Cu; Etchant; $H_2O_2$; PCB Board; Reactions; Safety PLC; Wet-Etching;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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